Patents by Inventor Ting SHAO

Ting SHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250075002
    Abstract: The present disclosure provides for multi-specific antibodies and antigen-binding fragments thereof that bind to human MUC1 and CD16A, pharmaceutical compositions comprising said antibodies, and use of the antibodies or the compositions for treating a disease, such as cancer.
    Type: Application
    Filed: September 6, 2024
    Publication date: March 6, 2025
    Applicant: BeiGene Switzerland GmbH
    Inventors: Hui LI, Qiansheng REN, Liang QU, Ming JIANG, Qi LIU, Xin CHEN, Yun CHEN, Liu XUE, Wenjie WANG, Jie PAN, Zhuo LI, Xiaoyan TANG, Chichi HUANG, Ting SHAO
  • Publication number: 20240301061
    Abstract: The present disclosure provides for multi-specific antibodies and antigen-binding fragments thereof that bind to human CLDN6 and CD3, a pharmaceutical composition comprising said antibody or antigen-binding fragments thereof, and use of the multi-specific antibody or antigen-binding fragments thereof or the composition for treating a disease, such as cancer.
    Type: Application
    Filed: March 28, 2024
    Publication date: September 12, 2024
    Applicant: BeiGene Switzerland GmbH
    Inventors: Zhitao WAN, Dan LI, Xiaoyan TANG, Yun CHEN, Ming LEI, Ting SHAO, Liu XUE, Yao DING, Ruyue JI, Qiming XU, Hui GUO
  • Publication number: 20240301051
    Abstract: The present disclosure provides for antibodies and antigen-binding fragments thereof that bind to human CLDN6, a pharmaceutical composition comprising said antibody or antigen-binding fragments thereof, and use of the antibody or antigen-binding fragments thereof or the composition for treating a disease, such as cancer.
    Type: Application
    Filed: March 28, 2024
    Publication date: September 12, 2024
    Applicant: BeiGene Switzerland GmbH
    Inventors: Dan LI, Xiaoyan TANG, Ming LEI, Ting SHAO
  • Patent number: 12051220
    Abstract: Provided are a point cloud attribute prediction method and prediction device based on a filter. The method comprises a coding method and a decoding method, and the device comprises a coding device and a decoding device. The method comprises: determining K nearest neighbor points of the current point; determining a filter matrix; and determining an attribute prediction value of the current point according to the filter matrix. Therefore, the compression performance of a point cloud attribute can be improved by means of selecting an appropriate filter.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: July 30, 2024
    Assignee: Peking University Shenzhen Graduate School
    Inventors: Ge Li, Chuang Ma, Jing Wang, Yi Ting Shao, Wen Gao
  • Patent number: 11967613
    Abstract: A semiconductor structure includes a substrate, and an active device and a passive device over the substrate. The active device is disposed in a first region of the substrate, and the passive device is disposed in a second region of the substrate. The semiconductor structure further includes a shielding structure and a passivation layer. The shielding structure includes a barrier layer and a ceiling layer. The barrier layer is on the passive device and the active device, and the ceiling layer is on the barrier layer. The passivation layer is under the barrier layer and covers a top surface of the passive device. An air cavity is defined by sidewalls of the barrier layer, a bottom surface of the ceiling layer, and the substrate.
    Type: Grant
    Filed: May 16, 2023
    Date of Patent: April 23, 2024
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Ju-Hsien Lin, Jung-Tao Chung, Shu-Hsiao Tsai, Hsi-Tsung Lin, Chen-An Hsieh, Yi-Han Chen, Yao-Ting Shao
  • Publication number: 20230346969
    Abstract: Provided are an intermediate (connexon and load combination) for preparing an antibody-drug conjugate (ADC), a preparation method therefor, and the use thereof. The connexon and load combination has a structure as represented by formula I. Formula I can be used for coupling highly hydrophobic compound loads, such as paclitaxel (PTX’), and a prepared ADC molecule has good hydrophilicity and thermal stability and can achieve a higher drug-to-antibody ratio.
    Type: Application
    Filed: June 18, 2021
    Publication date: November 2, 2023
    Applicant: Dartsbio Pharmaceuticals Ltd.
    Inventors: Chunhe WANG, Ting SHAO, Tianzhi CHEN, Qi WANG, Yili CHEN, Yijun LIN
  • Publication number: 20230282697
    Abstract: A semiconductor structure includes a substrate, and an active device and a passive device over the substrate. The active device is disposed in a first region of the substrate, and the passive device is disposed in a second region of the substrate. The semiconductor structure further includes a shielding structure and a passivation layer. The shielding structure includes a barrier layer and a ceiling layer. The barrier layer is on the passive device and the active device, and the ceiling layer is on the barrier layer. The passivation layer is under the barrier layer and covers a top surface of the passive device. An air cavity is defined by sidewalls of the barrier layer, a bottom surface of the ceiling layer, and the substrate.
    Type: Application
    Filed: May 16, 2023
    Publication date: September 7, 2023
    Inventors: Ju-Hsien LIN, Jung-Tao CHUNG, Shu-Hsiao TSAI, Hsi-Tsung LIN, Chen-An HSIEH, Yi-Han CHEN, Yao-Ting SHAO
  • Patent number: 11695037
    Abstract: A semiconductor structure includes a substrate, a passive device and an active device over the substrate. The active device is formed in the first region of the substrate, and the passive device is formed in the second region of the substrate. The semiconductor structure further includes a passivation layer that covers the top surface of the passive device. The passivation layer has an opening that exposes the active device.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: July 4, 2023
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Ju-Hsien Lin, Jung-Tao Chung, Shu-Hsiao Tsai, Hsi-Tsung Lin, Chen-An Hsieh, Yi-Han Chen, Yao-Ting Shao
  • Publication number: 20220254057
    Abstract: Provided are a point cloud attribute prediction method and prediction device based on a filter. The method comprises a coding method and a decoding method, and the device comprises a coding device and a decoding device. The method comprises: determining K nearest neighbor points of the current point; determining a filter matrix; and determining an attribute prediction value of the current point according to the filter matrix. Therefore, the compression performance of a point cloud attribute can be improved by means of selecting an appropriate filter.
    Type: Application
    Filed: May 11, 2020
    Publication date: August 11, 2022
    Inventors: Ge LI, Chuang MA, Jing WANG, Yi Ting SHAO, Wen GAO
  • Publication number: 20220223685
    Abstract: A semiconductor structure includes a substrate, a passive device and an active device over the substrate. The active device is formed in the first region of the substrate, and the passive device is formed in the second region of the substrate. The semiconductor structure further includes a passivation layer that covers the top surface of the passive device. The passivation layer has an opening that exposes the active device.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 14, 2022
    Inventors: Ju-Hsien LIN, Jung-Tao CHUNG, Shu-Hsiao TSAI, Hsi-Tsung LIN, Chen-An HSIEH, Yi-Han CHEN, Yao-Ting SHAO
  • Patent number: 11004240
    Abstract: Disclosed is a hierarchical division-based point cloud attribute compression method. For point cloud attribute information, a new hierarchical division based coding scheme is proposed, wherein a frame of point cloud is adaptively divided into a “stripe-macroblock-block” hierarchical structure according to the spatial position and color distribution of the point cloud, and stripes are coded independently from one another, increasing the coding efficiency, enhancing the fault tolerance of a system and improving the performance of point cloud attribute compression. The method comprises: (1) inputting a point cloud; (2) division of a k-dimension (KD) tree structure of the point cloud; (3) continuity analysis of point cloud attribute information; (4) stripe division of the point cloud; (5) division of macroblocks and coding blocks of the point cloud; and (6) intra-frame prediction, transformation, quantification and entropy coding based on a block structure.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: May 11, 2021
    Inventors: Ge Li, Yi Ting Shao, Qi Zhang, Rong Gang Wang, Tie Jun Huang, Wen Gao
  • Patent number: 10939123
    Abstract: Disclosed is a multi-angle adaptive intra-frame prediction-based point cloud attribute compression method. A novel block structure-based intra-frame prediction scheme is provided for point cloud attribute information, where six prediction modes are provided to reduce information redundancy among different coding blocks and improve the point cloud attribute compression performance. The method comprises: (1) inputting a point cloud; (2) performing point cloud attribute color space conversion; (3) dividing a point cloud by using a K-dimensional (KD) tree to obtain coding blocks; (4) performing block structure-based multi-angle adaptive intra-frame prediction; (5) performing intra-frame prediction mode decision; and (6) performing conversion, uniform quantization, and entropy encoding.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: March 2, 2021
    Inventors: Ge Li, Yi Ting Shao, Hong Lian Wei, Rong Gang Wang, Tie Jun Huang, Wen Gao
  • Publication number: 20200151915
    Abstract: Disclosed is a hierarchical division-based point cloud attribute compression method. For point cloud attribute information, a new hierarchical division based coding scheme is proposed, wherein a frame of point cloud is adaptively divided into a “stripe-macroblock-block” hierarchical structure according to the spatial position and color distribution of the point cloud, and stripes are coded independently from one another, increasing the coding efficiency, enhancing the fault tolerance of a system and improving the performance of point cloud attribute compression. The method comprises: (1) inputting a point cloud; (2) division of a k-dimension (KD) tree structure of the point cloud; (3) continuity analysis of point cloud attribute information; (4) stripe division of the point cloud; (5) division of macroblocks and coding blocks of the point cloud; and (6) intra-frame prediction, transformation, quantification and entropy coding based on a block structure.
    Type: Application
    Filed: May 15, 2018
    Publication date: May 14, 2020
    Inventors: Ge LI, Yi Ting SHAO, Qi ZHANG, Rong Gang WANG, Tie Jun HUANG, Wen GAO
  • Publication number: 20200137399
    Abstract: Disclosed is a multi-angle adaptive intra-frame prediction-based point cloud attribute compression method. A novel block structure-based intra-frame prediction scheme is provided for point cloud attribute information, where six prediction modes are provided to reduce information redundancy among different coding blocks and improve the point cloud attribute compression performance. The method comprises: (1) inputting a point cloud; (2) performing point cloud attribute color space conversion; (3) dividing a point cloud by using a K-dimensional (KD) tree to obtain coding blocks; (4) performing block structure-based multi-angle adaptive intra-frame prediction; (5) performing intra-frame prediction mode decision; and (6) performing conversion, uniform quantization, and entropy encoding.
    Type: Application
    Filed: May 15, 2018
    Publication date: April 30, 2020
    Inventors: Ge LI, Yi Ting SHAO, Hong Lian WEI, Rong Gang WANG, Tei Jun HUANG, Wen GAO
  • Publication number: 20150054326
    Abstract: A headrest assembly for a chair includes a headrest unit, two spaced-apart grip frame members respectively connected to two opposite ends of the headrest unit, and two spaced-apart connection frame members respectively connected to the grip frame members. The grip frame members gradually extend away from each other from the headrest unit to the connection frame members, respectively. Each of the grip frame members extends obliquely, rearwardly and downwardly from the headrest unit in a manner of being oblique to a first vertical plane that has opposite front and rear surfaces respectively facing front and rear sides of the chair.
    Type: Application
    Filed: August 21, 2014
    Publication date: February 26, 2015
    Inventors: Deng-Chuan CAI, Shao-Yong CHEN, Yan-Wei ZHANG, Yen-Ju LAI, Ting SHAO
  • Patent number: 6846618
    Abstract: The present invention uses a double exposure and double etching method to improve critical dimension uniformity. A coating layer is formed on a wafer that includes a first area and a second area. The first area and the second area are separately patterned with different processing conditions. By means of this two-stage patterning, the CD uniformity between wafer center and wafer edge is successfully improved over the conventional single-stage patterning process. The fabrication yield is thus enhanced.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: January 25, 2005
    Assignee: Winbond Electronics Corporation
    Inventors: Yi-Yu Hsu, Kuo-Chen Wang, Yao-Ting Shao
  • Patent number: 6821846
    Abstract: A method of manufacturing a contact is disclosed. A substrate is provided, and a first dielectric layer and a metal layer are formed thereon in sequence. A second dielectric layer is formed on the metal layer and the first dielectric layer. A bottom contact is formed in the second dielectric layer to electrically connect to the metal layer. A node contact is formed in the first and second dielectric layers. A capacitor is formed on the dielectric layer to electrically connect to the node contact, and a middle contact is formed on the second dielectric layer to electrically connect to the bottom contact. A third dielectric layer is formed on the capacitor, the middle contact and the second dielectric layer. A top contact is formed in the third dielectric layer to electrically connect to the middle contact.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: November 23, 2004
    Assignee: Winbond Electronics Corp.
    Inventors: Yao-Ting Shao, Ishibashi Shigeru
  • Publication number: 20030235978
    Abstract: A method of manufacturing a contact is disclosed. A substrate is provided, and a first dielectric layer and a metal layer are formed thereon in sequence. A second dielectric layer is formed on the metal layer and the first dielectric layer. A bottom contact is formed in the second dielectric layer to electrically connect to the metal layer. A node contact is formed in the first and second dielectric layers. A capacitor is formed on the dielectric layer to electrically connect to the node contact, and a middle contact is formed on the second dielectric layer to electrically connect to the bottom contact. A third dielectric layer is formed on the capacitor, the middle contact and the second dielectric layer. A top contact is formed in the third dielectric layer to electrically connect to the middle contact.
    Type: Application
    Filed: January 27, 2003
    Publication date: December 25, 2003
    Inventors: YAO-TING SHAO, ISHIBASHI SHIGERU
  • Publication number: 20030131942
    Abstract: The present invention is a <CD sticker stand structure> in the purpose of providing a structure able to put a sticker on a CD quickly and accurately; in particular an alternative positioning ring that can be used for square type or larger opening stickers.
    Type: Application
    Filed: January 17, 2002
    Publication date: July 17, 2003
    Inventor: Ting Shao Chieh
  • Publication number: 20030044722
    Abstract: The present invention uses a double exposure and double etching method to improve critical dimension uniformity. A coating layer is formed on a wafer that includes a first area and a second area. The first area and the second area are separately patterned with different processing conditions. By means of this two-stage patterning, the CD uniformity between wafer center and wafer edge is successfully improved over the conventional single-stage patterning process. The fabrication yield is thus enhanced.
    Type: Application
    Filed: August 8, 2002
    Publication date: March 6, 2003
    Inventors: Yi-Yu Hsu, Kuo-Chen Wang, Yao-Ting Shao