Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (A1) or formula (A2): Zr12O8(OH)14(RCO2)18 ??Formula (A1); or Hf6O4(OH)6(RCO2)10 ??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.

Abstract: A method of wireless signal transmission management includes transmitting a plurality of data packets to tethering equipment from user equipment to tethering equipment, determining a size of each of the plurality of data packets by the tethering equipment, designating data packets of the plurality of data packets having a specific range of sizes as control signal packets by the tethering equipment, and prioritizing in transmitting the control signal packets to a cellular network by the tethering equipment.

Abstract: An electronic device is provided. The electronic device includes a frame, a backlight module, a working panel, and a spacer. The backlight module is disposed in the frame. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

Abstract: An electronic device is provided. The electronic device includes a frame, a working panel, a case, and a tape. The frame includes a side wall and a back plate. The side wall has an outer surface. The back plate has a back plate surface. The extension direction of the back plate is different from the extension direction of the side wall. The working panel is disposed on the back plate. The working panel has a working panel surface, and the back plate surface faces away the working panel. The case is disposed on the back plate and having a case surface. The case surface is higher than the side wall. The tape is in contact with at least a portion of the outer surface and at least a portion of the working panel surface.

Abstract: An electronic device is provided, including a frame, a working panel, and a spacer. The frame includes a side wall. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

Abstract: An electronic device is provided, including a frame, a backlight module, a working panel, and a tape. The frame includes a side wall and a back plate. The side wall includes an outer surface. The extension direction of the back plate is different from the extension direction of the side wall. The backlight module is disposed on the back plate. The working panel and the back plate are disposed on the opposite sides of the backlight module. The tape is in contact with at least a portion of the outer surface and the working panel.

Abstract: An interrupt control device between clock domains is provided. An interrupt sharing logic is configured to receive one or more original interrupt signals and generate a combined interrupt signal. An interrupt processing logic is configured to output a processed interrupt signal to a processor according to the combined interrupt signal, so that the processor executes an interrupt service routine. When the interrupt service routine is executed, the processed interrupt signal changes to be disabled; before the interrupt service routine is completed, the processor outputs an interrupt clear signal to change the respective interrupt signal to be negated. After the interrupt processing logic detects that interrupt signal has been cleared successfully, the interrupt processing logic will generate the processed interrupt signal according to the combined interrupt signal again.

Abstract: An electronic device is provided, including a frame, a working panel, and a spacer. The frame includes a side wall. The working panel is disposed on the frame. The spacer is disposed between the frame and the working panel. At least a portion of the working panel and at least a portion of the spacer are in direct contact with an adhesive.

Abstract: An electronic device is provided, including a frame, a backlight module, a working panel, and a tape. The frame includes a side wall and a back plate. The side wall includes an outer surface. The extension direction of the back plate is different from the extension direction of the side wall. The backlight module is disposed on the back plate. The working panel and the back plate are disposed on the opposite sides of the backlight module. The tape is in contact with at least a portion of the outer surface and the working panel.

Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.

Abstract: An electronic device is provided, including a frame, a working panel and a cover plate. The frame includes a sidewall, and the sidewall includes an outer surface. At least a part of the working panel is disposed in the frame. The cover plate is disposed on the working panel and includes a surface, wherein a surface of the cover plate and an outer surface of the sidewall of the frame are fixed by using an adhesive, and the extension direction of the surface of the cover plate is different than the extension direction of the outer surface of the sidewall of the frame.

Abstract: A bloom filter and an implementation method thereof are provided. The implementation method has a ternary rule encoded as a rule binary codeword according to a predetermined encoding rule; has a packet encoded as at least one packet binary codeword according to the predetermined encoding rule; and comparing the rule binary codeword and the at least one packet binary codeword to decide a following processing of the packet. The predetermined encoding rule includes: tagging 0 or 1 into most significant bit (MSB) of the output binary codeword based on mask length of the input codeword; placing the prefix of the input codeword right after MSB of the output binary codeword; and tagging a string to last bits of the output binary codeword based on the mask length, and the bit number of the string equals to the mask length.

Abstract: The present disclosure illustrates a ternary content addressable memory (TCAM) device for software defined networking and method thereof. In the TCAM device, M bits of each forwarding rule is stored as a first part into a NAND-Type TCAM, and N bits of the same forwarding rule is stored as a second part into a NOR-Type TCAM. M bits of searching data is compared with the first part to generate a first matching result, N bits of the searching data is compared with the second part to generate a second matching result when the first matching result indicates match, and comparing process for the second part is disabled when the first matching result indicates mismatch. The mechanism is help to improve flexibility of the TCAM in words length and to reduce power consumption.

Abstract: A display magnifying device adapted for an electronic device having one or more external sockets is provided. The display magnifying device includes a magnifying glass, a plug, and a stand. The plug fits the external socket. The stand has a first end connected to the magnifying glass and a second end connected to the plug. The display magnifying device is adapted to be detachably assembled to the electronic device by connecting the plug to the external socket. A display magnifying device including a magnifying glass, a casing and a stand is further provided. The casing at least covers a part of the electronic device. The stand has a first end connected to the magnifying glass and a second end connected to the casing. The display magnifying device is adapted to be detachably assembled to the electronic device by covering the part of the electronic device with the casing.

Abstract: An operating method of a hardwired switch is provided. First, a first die is provided. The first die is configured as the first die in the hardwired switch. Next, a function of the first die is inspected to obtain an inspected result. Upon the inspected result, whether a second TSV is selectively disposed between the first landing pad and the fifth landing pad, between the second landing pad and the sixth landing pad, between the third landing pad and the seventh landing pad, or between the fourth landing pad and the eighth landing pad or not is determined. The first die is stacked above a second die, so that the second surface is located between the first die and the second die.

Abstract: A wafer and a method for improving the yield rate of the wafer are provided. The wafer includes a first and a second circuit units, a first and a second through silicon vias (TSVs), and a first spare TSV. The first and the second circuit units are disposed inside the wafer. The first TSV vertically runs through the wafer and is coupled to the first circuit unit through the front metal of the wafer. The second TSV vertically passes through the wafer and is coupled to the second circuit unit through the front metal of the wafer. When the first or the second TSV has failed, the first spare TSV vertically passes through the wafer to replace the failed first or second TSV.

Abstract: An operating method of a hardwired switch is provided. First, a first die is provided. The first die is configured as the first die in the hardwired switch. Next, a function of the first die is inspected to obtain an inspected result. Upon the inspected result, whether a second TSV is selectively disposed between the first landing pad and the fifth landing pad, between the second landing pad and the sixth landing pad, between the third landing pad and the seventh landing pad, or between the fourth landing pad and the eighth landing pad or not is determined. The first die is stacked above a second die, so that the second surface is located between the first die and the second die.

Abstract: A hardwired switch of a die stack including eight landing pads is provided. A first, a second, a third, and a fourth landing pads are disposed on a first surface of a die. The second and the fourth landing pads are electrically connected to the first and the third landing pads respectively. A fifth, a sixth, a seventh, and an eighth landing pads are disposed on a second surface of the die. The seventh and the eighth landing pads are electrically connected to the sixth and the fifth landing pads respectively. In a vertical direction of the die, the first, the second, the third, and the fourth landing pads overlap partially or fully with the fifth, the sixth, the seventh, and the eighth landing pads respectively. In addition, an operating method of a hardwired switch is also provided.

Abstract: A physical training system is provided combining biomechanics and neurophysiological measurement for providing users with instant advisory feedback about adjustment to body movements of a user or parameter setting of a gymnastic apparatus for a training objective, especially for specific muscle groups, without incurring sports injuries.

Abstract: A wafer and a method for improving the yield rate of the wafer are provided. The wafer includes a first and a second circuit units, a first and a second through silicon vias (TSVs), and a first spare TSV. The first and the second circuit units are disposed inside the wafer. The first TSV vertically runs through the wafer and is coupled to the first circuit unit through the front metal of the wafer. The second TSV vertically passes through the wafer and is coupled to the second circuit unit through the front metal of the wafer. When the first or the second TSV has failed, the first spare TSV vertically passes through the wafer to replace the failed first or second TSV.