Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.

Abstract: The present invention discloses a crib whose bed position can be adjusted, including a surrounding rod and a foot tube. The foot tube includes two transverse rods. Each transverse rod is parallel to a horizontal plane. The crib whose bed position can be adjusted further includes two movable connecting rods. One end of each movable connecting rod is connected to the surrounding rod, and the other end of the movable connecting, rod is movably arranged on the transverse rod and can move along the transverse rod to adjust the bed position of the crib. A bed body is movably arranged on the foot tube by using the movable connecting rods. When the bed position needs to be moved, the foot tube does not need to be moved, and only the surrounding rod and the movable connecting rods need to be moved. The operation is convenient, and the structure is simple.

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.

Abstract: In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, a method may include coupling at least one optoelectronic component to a surface of a printed circuit board. The method may include lasering the surface of the printed circuit board to form a laser-roughened area on the surface of the printed circuit board. The method may include coupling an optical component to the printed circuit board at the laser-roughened area on the surface of the printed circuit board.

Abstract: An ink-jet printing ink of an electron transport layer and its preparing method are provided. The method of the disclosure adopts an ionic conjugated polyelectrolyte as a solute and alcohol compounds as a solvent. By adjusting the proportion of each component, viscosity and surface tension to obtain an ink-jet printing ink of the electron transport layer. The ink-jet printing ink meets the manufacturing requirements and is able to be produced by ink-jet printing process. Simultaneously, it avoids a mutually soluble phenomenon occurred between the electron transport layer and the adjacent structural layers during the preparation of the OLED, which is favorable for the production of a full-solution OLED device. According to the above method, the disclosure satisfies the manufacturing requirements of the ink-jet printing and realizes the ink-jet printing type of the electron transport layer, and is favorable for the production of a full-solution OLED device.

Abstract: The disclosure provides an all-solution OLED device and a manufacturing method thereof. The manufacturing method fabricate a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode by solution film-forming. Compared with the manufacturing method of the existing OLED device, an all-solution fabrication of the electron transport layer and the cathode is achieved, the use of high vacuum evaporation process and equipment can be avoided, thereby saving materials and reducing manufacturing costs; and the adjacent layers will not appear mutual solubility, so the film quality is high and the device performance can be improved. The hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the cathode are all fabricated by solution film-forming; and compared with the existing OLED device, the manufacturing cost is low, the film-forming quality is high, and the display quality is excellent.

Abstract: An ink-jet printing ink of an electron transport layer and its manufacturing method are provided. The method of the disclosure adopts an ionic conjugated polyelectrolyte as a solute and alcohol compounds as a solvent. By adjusting the proportion of each component, viscosity and surface tension to obtain an ink-jet printing ink of the electron transport layer. The ink-jet printing ink meets the manufacturing requirements and is able to be produced by ink-jet printing process. Simultaneously, it avoids a mutually soluble phenomenon occurred between the electron transport layer and the adjacent structural layers during the preparation of the OLED, which is favorable for the production of a full-solution OLED device. According to the above method, the disclosure satisfies the manufacturing requirements of the ink-jet printing and realizes the ink-jet printing type of the electron transport layer, and is favorable for the production of a full-solution OLED device.

Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, a method may include coupling at least one optoelectronic component to a surface of a printed circuit board. The method may include lasering the surface of the printed circuit board to form a laser-roughened area on the surface of the printed circuit board. The method may include coupling an optical component to the printed circuit board at the laser-roughened area on the surface of the printed circuit board.

Abstract: The disclosure provides an all-solution OLED device and a manufacturing method thereof. The manufacturing method fabricate a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode by solution film-forming. Compared with the manufacturing method of the existing OLED device, an all-solution fabrication of the electron transport layer and the cathode is achieved, the use of high vacuum evaporation process and equipment can be avoided, thereby saving materials and reducing manufacturing costs; and the adjacent layers will not appear mutual solubility, so the film quality is high and the device performance can be improved. The hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the cathode are all fabricated by solution film-forming; and compared with the existing OLED device, the manufacturing cost is low, the film-forming quality is high, and the display quality is excellent.

Abstract: The present invention provides a Top-Emitting Organic Light Emitting Diode (TEOLED) and a manufacturing method thereof. The TEOLED includes a substrate; a stack structure on the substrate; a cathode layer covering the stack structure; and a light-scattering layer composed of nano particles and including a concave and convex structure. The present invention can effectively improve cathode transmittance of the TEOLED and modulate the coupling output of lights with multiple wavelengths.

Abstract: The present invention discloses a crib whose bed position can be adjusted, including a surrounding rod and a foot tube. The foot tube includes two transverse rods. Each transverse rod is parallel to a horizontal plane. The crib whose bed position can be adjusted further includes two movable connecting rods. One end of each movable connecting rod is connected to the surrounding rod, and the other end of the movable connecting, rod is movably arranged on the transverse rod and can move along the transverse rod to adjust the bed position of the crib. A bed body is movably arranged on the foot tube by using the movable connecting rods. When the bed position needs to be moved, the foot tube does not need to be moved, and only the surrounding rod and the movable connecting rods need to be moved. The operation is convenient, and the structure is simple.

Abstract: The present disclosure provides an ultraviolet (UV) radiation apparatus, where the UV radiation apparatus includes a chamber containing substrates, a sample stage supporting the substrates, UV lamps emitting UV light arranged opposite to the sample stage, and a mirror reflective structure arranged in the chamber. The sample stage is positioned at a top of the chamber or a bottom of the chamber. The mirror reflective structure includes protrusions or recesses that are orderly arranged; the protrusions or the recesses reflect the UV light along all directions and the UV light is irradiated on the mirror reflective structure.

Abstract: The present invention provides a package component of an Organic Light Emitting Diode (OLED) device and a package method thereof, and a display device. A first blocking layer covers the OLED device. A side of the first blocking layer far away from the OLED device includes a first pattern region and a second pattern region alternately set along a predetermined direction, and thickness of the first blocking layer at the first pattern region is smaller than that at the second pattern region.

Abstract: The present invention provides a package component of an Organic Light Emitting Diode (OLED) device and a package method thereof, and a display device. A first blocking layer covers the OLED device. A side of the first blocking layer far away from the OLED device includes a first pattern region and a second pattern region alternately set along a predetermined direction, and thickness of the first blocking layer at the first pattern region is smaller than that at the second pattern region.

Abstract: The present invention provides a Top-Emitting Organic Light Emitting Diode (TEOLED) and a manufacturing method thereof. The TEOLED includes a substrate; a stack structure on the substrate; a cathode layer covering the stack structure; and a light-scattering layer composed of nano particles and including a concave and convex structure. The present invention can effectively improve cathode transmittance of the TEOLED and modulate the coupling output of lights with multiple wavelengths.

Abstract: The present invention mainly provides an organic light emitting display assembly, a manufacturing thereof, and a display panel. The organic light emitting diode assembly comprises an anode layer, an electron hole transport layer, a light emitting layer, an electron transport layer, and a cathode layer arranged sequentially, wherein the anode layer is a metal layer with a high-power function, and the electron transport layer comprises a quantum dot material. By the above-mentioned method, the present invention can improve the stability of the electrode, thereby extending the life of OLED devices, and the color gamut of the OLED display can be improved.

Abstract: A method of forming a micro-electro-mechanical systems (MEMS) device includes: providing a substrate; forming a tantalum nitride (TaN) layer on the substrate; forming a dielectric anti-reflective coating (DARC) layer on the TaN layer; coating photoresist on the DARC layer and etching the DARC: and TaN layers to form a trench; performing intensified ashing and wet cleaning processes to remove the photoresist and the DARC layer. The DARC layer can prevent the formation of tantalum-containing polymeric substances from a reaction between the TaN layer and the photoresist during the intensified ashing process.

Abstract: A method of forming a micro-electro-mechanical systems (MEMS) device includes: providing a substrate; forming a tantalum nitride (TaN) layer on the substrate; forming a dielectric anti-reflective coating (DARC) layer on the TaN layer; coating photoresist on the DARC layer and etching the DARC: and TaN layers to form a trench; performing intensified ashing and wet cleaning processes to remove the photoresist and the DARC layer. The DARC layer can prevent the formation of tantalum-containing polymeric substances from a reaction between the TaN layer and the photoresist during the intensified ashing process.

Abstract: An optical decoder and a multi-functional printer using the same are provided. The optical decoder includes a directional light source, a light guide bar and a light receiving unit. The light guide bar disposed on a light-emitting side of the directional light source has multiple scales. The light receiving unit is disposed on a side of the light guide bar, wherein the directional light source and the light receiving unit are disposed on different sides of the light guide bar. The light receiving unit is used to move along the light guide bar and read the scales of the light guide bar. The overall volume of a multi-functional printer can be reduced by applying the optical decoder therein.