Patents by Inventor Ting Song Chen

Ting Song Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit layout structure
    Patent number: 8884402
    Abstract: A circuit layout structure includes a wafer having at least a cell region and a scribe line region defined thereon, a metal pattern formed in a first insulating layer in the scribe line region, a second insulating layer and a hard mask layer formed on the metal pattern and the first insulating layer, and at least a dummy pattern formed in the second insulating layer and the hard mask layer in the scribe line region. The dummy pattern has a transmission rate between 0% and 1%.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: November 11, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Yong-Gang Xie, Yu-Neng Cheng, Ting Song Chen
  • CIRCUIT LAYOUT STRUCTURE
    Publication number: 20110266032
    Abstract: A circuit layout structure includes a wafer having at least a cell region and a scribe line region defined thereon, a metal pattern formed in a first insulating layer in the scribe line region, a second insulating layer and a hard mask layer formed on the metal pattern and the first insulating layer, and at least a dummy pattern formed in the second insulating layer and the hard mask layer in the scribe line region. The dummy pattern has a transmission rate between 0% and 1%.
    Type: Application
    Filed: April 28, 2010
    Publication date: November 3, 2011
    Inventors: Yong-Gang Xie, Yu-Neng Cheng, Ting Song Chen