Patents by Inventor Ting Su

Ting Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250087532
    Abstract: A method includes forming a metal layer over a dielectric layer; forming hard masks over the metal layer; etching the metal layer using the hard masks as etch mask to form metal features; selectively forming dielectric liners on opposite sidewalls of each of the metal features, while leaving surfaces of the hard masks and the dielectric layer exposed by the dielectric liners; and forming an inter-metal dielectric layer laterally surrounding the metal features.
    Type: Application
    Filed: September 12, 2023
    Publication date: March 13, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuang-Wei YANG, Cheng-Chin LEE, Shao-Kuan LEE, Jing Ting SU, Hsin-Ning HUNG, Hsin-Yen HUANG, Hsiao-Kang CHANG
  • Publication number: 20250089295
    Abstract: A nano-FET and a method of forming is provided. In some embodiments, a nano-FET includes an epitaxial source/drain region contacting ends of a first nanostructure and a second nanostructure. The epitaxial source/drain region may include a first semiconductor material layer of a first semiconductor material, such that the first semiconductor material layer includes a first segment contacting the first nanostructure and a second segment contacting the second nanostructure, wherein the first segment is separated from the second segment. A second semiconductor material layer is formed over the first segment and the second segment. The second semiconductor material layer may include a second semiconductor material having a higher concentration of dopants of a first conductivity type than the first semiconductor material layer. The second semiconductor material layer may have a lower concentration percentage of silicon than the first semiconductor material layer.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Inventors: Yan-Ting Lin, Yen-Ru Lee, Chien-Chang Su, Chih-Yun Chin, Chien-Wei Lee, Pang-Yen Tsai, Chii-Horng Li, Yee-Chia Yeo
  • Patent number: 12249649
    Abstract: A semiconductor device includes a fin-shaped structure on the substrate, a shallow trench isolation (STI) around the fin-shaped structure, a single diffusion break (SDB) structure in the fin-shaped structure for dividing the fin-shaped structure into a first portion and a second portion; a first gate structure on the fin-shaped structure, a second gate structure on the STI, and a third gate structure on the SDB structure. Preferably, a width of the third gate structure is greater than a width of the second gate structure and each of the first gate structure, the second gate structure, and the third gate structure includes a U-shaped high-k dielectric layer, a U-shaped work function metal layer, and a low-resistance metal layer.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: March 11, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Han Wu, Hsin-Yu Chen, Chun-Hao Lin, Shou-Wei Hsieh, Chih-Ming Su, Yi-Ren Chen, Yuan-Ting Chuang
  • Publication number: 20250075884
    Abstract: A lighting apparatus includes an optical component housing, an optical component and a light source. The optical component housing has an optical container and an entrance opening. The entrance opening is disposed on a lateral side of the optical component housing. The optical component housing has a light escape side. The lateral side is at a different plane as the light escape side. The optical component is detachably inserted into the optical container via the entrance opening. a cover manually operable to reveal the entrance opening for inserting the optical component and operable to conceal the entrance opening. a light source. A light is emitted from the light source passing through the optical component and escaped from the light escape side.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Inventors: Tiansong Lan, Siyuan Su, Junjie Lin, Jiansheng Zhang, Haiyan Chen, Ting Luo
  • Publication number: 20250081632
    Abstract: A solar cell module includes a first substrate, a second substrate, at least one cell unit, a first packaging film, a second packaging film, a first protective layer, a second protective layer, and a plurality of support members. The first substrate and the second substrate are disposed opposite to each other. The cell unit is disposed between the first substrate and the second substrate. The first packaging film is disposed between the cell unit and the first substrate. The second packaging film is disposed between the cell unit and the second substrate. The first protective layer is disposed between the cell unit and the first packaging film. The second protective layer is disposed between the cell unit and the second packaging film. The support members are respectively disposed between the first packaging film and the second packaging film and surround at least two opposite sides of the cell unit.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Chung Wu, Chun-Wei Su, Tzu-Ting Lin, En-Yu Pan, Yu-Tsung Chiu, Chih-Lung Lin, Teng-Yu Wang, Chiou-Chu Lai, Ying-Jung Chiang
  • Publication number: 20250072054
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes multiple first semiconductor nanostructures over a substrate and multiple second semiconductor nanostructures over the substrate. The semiconductor device structure also includes a dielectric structure between the first semiconductor nanostructures and the second semiconductor nanostructures. The semiconductor device structure further includes a metal gate stack wrapped around the first semiconductor nanostructures and the second semiconductor nanostructures. The metal gate stack has a gate dielectric layer and a gate electrode. The gate dielectric layer extends along a sidewall of a lower portion of the dielectric structure. A topmost surface of the gate dielectric layer is between a topmost surface of the first semiconductor nanostructures and a topmost surface of the dielectric structure.
    Type: Application
    Filed: November 8, 2024
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Cheng CHIANG, Huan-Chieh SU, Kuan-Ting PAN, Shi-Ning JU, Chih-Hao WANG
  • Patent number: 12237230
    Abstract: A method of manufacturing a semiconductor device includes forming a fin structure over a substrate, forming a sacrificial gate structure over the fin structure, and etching a source/drain (S/D) region of the fin structure to form an S/D recess. The fin structure includes first semiconductor layers and second semiconductor layers alternately stacked. The method further includes depositing an insulating dielectric layer in the S/D recess, depositing an etch protection layer over a bottom portion of the insulating dielectric layer, and partially removing the insulating dielectric layer. The method further includes growing an epitaxial S/D feature in the S/D recess. The bottom portion of the insulating dielectric layer interposes the epitaxial S/D feature and the substrate.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Bo-Yu Lai, Jyun-Chih Lin, Yen-Ting Chen, Wei-Yang Lee, Chia-Pin Lin, Wei Hao Lu, Li-Li Su
  • Publication number: 20250054684
    Abstract: A power module, having: a transformer pack; a top substrate mounted on the transformer pack; and two power device chips mounted on the top substrate, wherein each one of the power device chips has at least one pin connected to the transformer pack via the top substrate; wherein the transformer pack has a magnetic core, a first primary winding and a second primary winding, a first secondary winding and a second secondary winding, a first magnetic core part and a second magnetic core part, and wherein each one of the primary windings passes through the magnetic core, the first secondary winding is close to the first primary winding with the first magnetic core part in between, and the second secondary winding is close to the second primary winding with the second magnetic core part in between.
    Type: Application
    Filed: August 7, 2023
    Publication date: February 13, 2025
    Inventors: Daocheng Huang, Ting Ge, Yishi Su, Wenyang Huang, Yingxin Zhou
  • Patent number: 12222576
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: February 11, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Kuen-Wang Tsai, Liang-Ting Ho, Chao-Hsi Wang, Chih-Wei Weng, He-Ling Chang, Che-Wei Chang, Sheng-Zong Chen, Ko-Lun Chao, Min-Hsiu Tsai, Shu-Shan Chen, Jungsuck Ryoo, Mao-Kuo Hsu, Guan-Yu Su
  • Publication number: 20250048704
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of metal portions, a plurality of nanosheet structures, and a plurality of isolation structures. The metal portions are disposed on the semiconductor substrate and are spaced apart from each other. The nanosheet structures are surrounded by the metal portions such that the nanosheet structures are spaced apart from each other. The isolation structures are disposed on the semiconductor substrate such that two adjacent ones of the metal portions are isolated from each other by a corresponding one of the isolation structures. Each of the isolation structures includes a first dielectric layer and an air gap surrounded by the first dielectric layer.
    Type: Application
    Filed: August 1, 2023
    Publication date: February 6, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hong-Chih CHEN, Fu-Hsiang SU, Shih-Hsun CHANG, Chia-Hao KUO, Chih-Ting YEH
  • Publication number: 20240320925
    Abstract: According to one embodiment, a method, computer system, and computer program product for adjusting an audible area of an avatar's voice is provided. The present invention may include receiving, at a microphone, a source audio; creating a received audio; calculating, by a generative model, a voice propagation distance of a user based on the source audio, the received audio, and a templated text sentence describing a category of a mixed reality environment experienced by the user; drawing a virtual circle within the mixed reality environment centered on a user avatar representing the user and with a radius equal to the voice propagation distance; and transmitting the source audio to one or more participants within the mixed-reality environment represented by one or more participant avatars located within the virtual circle.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 26, 2024
    Inventors: Meng Chai, Dan Zhang, Yuan Jie Song, Yu Li, Wen Ting Su, Xiao Feng Ji
  • Publication number: 20240317367
    Abstract: A power-free passive stabilizing device working at an interface of different media includes a hollow chamber body, a limiting structure and a valve cover. The hollow chamber body has a first end, a second end, a first opening at the first end and a second opening at the second end. The limiting structure is connected to the first end of the hollow chamber body. The valve cover is limited by the limiting structure and movably disposed on the first end of the hollow chamber body to close and open the first opening. A passive stabilizing system using the passive stabilizing device is also disclosed.
    Type: Application
    Filed: May 19, 2023
    Publication date: September 26, 2024
    Inventors: HUNG-YIN TSAI, SHANG-RU WU, SHANG-YI KUNG, CHENG-YANG LI, YU-CHENG WU, YU-TING SU
  • Publication number: 20240242539
    Abstract: Embodiments of the present disclosure provide enhanced system and methods for implementing generative converting 3D face landmarks. An enhanced disclosed system and non-limiting method effectively renders a third 3D face model of a first user that enables a second user to easily recognize the first user, where the second user is only familiar with a first face model that is significantly changed in a second face model of the first user in a current interaction of the first user and second user. This method effectively renders the third 3D face model of the first user that can gradually change from the first face model to the second face model, and can be easily recognized by the second user.
    Type: Application
    Filed: January 13, 2023
    Publication date: July 18, 2024
    Inventors: Wen Ting SU, Yuan Jie SONG, Dan ZHANG, Yu LI, Meng CHAI, Xiao Feng JI
  • Publication number: 20240234203
    Abstract: A method for manufacturing a semiconductor device includes: preparing a conductive structure that includes a plurality of conductive features, adjacent two of which are spaced apart from each other by a corresponding one of a plurality of recesses; conformally forming a dielectric capping layer on the conductive structure; forming a dielectric cover layer on the dielectric capping layer to fill the recesses; and removing a portion of the dielectric cover layer and a portion of the dielectric capping layer to expose the conductive features, so as to form a plurality of spacer features respectively filled in the recesses; wherein each of the dielectric capping layer and the dielectric cover layer is made of a dielectric material doped with metal oxide.
    Type: Application
    Filed: January 5, 2023
    Publication date: July 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ting-Ya LO, Shao-Kuan LEE, GARY LIU, Zi-Yi YANG, Kuang-Wei YANG, Jing-Ting SU, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
  • Publication number: 20240165702
    Abstract: The disclosure belongs to the technical field of powder metallurgy, and provides a method for preparing an aluminum-based tubular target. The method includes: sleeve assembly, raw material mixing, powder filling, sleeve degassing, hot isostatic pressing, and finished product processing.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 23, 2024
    Applicants: Hebei Shenghua New Materials Technology Co., Ltd., Inner Mongolia University of Science & Technology
    Inventors: Pengguo XU, Qun LI, Lilin YANG, Ting SU
  • Patent number: 11955240
    Abstract: A neural-network-based-implemented ophthalmologic intelligent consultation method includes: performing correction filtering on a consultation voice of a patient, framing the voice into a consultation voice frame sequence, generating a consultation text corresponding to the consultation voice frame sequence based on phoneme recognition and phoneme transcoding, and extracting an ophthalmologically-described disease; performing gray-level filtering, primary picture segmentation, and size equalization operation on an eye picture set of the to-be-diagnosed patient to acquire a standard eyeball picture group; extracting eye white features, pupil features and blood vessel features from the standard eyeball picture group, performing lesion feature analysis on the eye white features, the pupil features and the blood vessel features to acquire an ophthalmologically-observed disease, and based on the ophthalmologically-observed disease and the ophthalmologically-described disease, generating a consultation result.
    Type: Grant
    Filed: September 12, 2023
    Date of Patent: April 9, 2024
    Assignee: Renmin Hospital of Wuhan University (Hubei General Hospital)
    Inventors: Xuan Xiao, Xiang Gao, Ting Chen, Ting Su, Xuejie Li
  • Publication number: 20240062988
    Abstract: The present disclosure provides a machine vision-based automatic focusing and automatic centering method and system, which belongs to the technical field of machine vision-based automatic control. An object stage is controlled to move in an imaging distance range of an electron microscope, and images scanned by the electron microscope when the object stage is at different imaging distances are acquired. The image definition of an object stage image is calculated according to a gray-scale value of each pixel in the object stage image, the imaging position when an image definition value is the maximum is determined, and the object stage is controlled to move to the position, so as to realize machine vision-based accurate focusing.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 22, 2024
    Inventors: Yabin YAN, Fuzhen XUAN, Ting SU
  • Patent number: 11817974
    Abstract: A method for sounding-interval adaptation using link quality for use in an apparatus is provided. The apparatus includes a sounding transceiver. The method includes the following steps: periodically transmitting a sounding packet to a beamformee through a downlink channel from the apparatus to the beamformee according to a first sounding interval; in response to the sounding transceiver receiving a data packet or a report packet from the beamformee, obtaining a current first channel profile from the received data packet or the received report packet; and adaptively adjusting the first sounding interval according to a first mobility indicator which is calculated according to the current first channel profile and the previous first channel profile.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: November 14, 2023
    Assignee: MEDIATEK INC.
    Inventors: Hao-Chih Yu, Pu-Hsuan Lin, Yu-Ting Su
  • Patent number: D997757
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: September 5, 2023
    Assignee: IMAXALARM LLC
    Inventors: Alice Ting Ting Su, Michael Chun-Hao Su
  • Patent number: D1008573
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: December 19, 2023
    Inventor: Ting Su