Abstract: An alignment structure of an optical element includes an optical fiber having a parallel fiber segment and a plurality of bare fiber segments, a cover plate provided with a plurality of side-by-side guide grooves and a plurality of first coupling parts, the bare fiber segments of the optical fiber being arranged in the corresponding guide grooves, cross-sectional shapes of the guide grooves being at least one of U-shaped or V-shaped, and a silicon chip provided with lines and a plurality of second coupling parts. When the cover plate is matched with the silicon chip, the first coupling parts and the second coupling parts are coupled and positioned with each other respectively, and the optical fiber is fixed between the silicon chip and the cover plate.

Abstract: An optical probe package structure is provided, used in a test environment for testing a plurality of optical chips on a wafer, including: a main body, an optical fiber, an optical fiber positioning area, a mode field conversion waveguide structure, and an optical waveguide. Wherein, the mode field conversion waveguide structure is used to convert the propagation field of the optical signal, and the optical signal transmitted by the mode field conversion waveguide structure enters the optical waveguide. The optical waveguide has an emitting end, and the emitting end is provided with a facet, the facet has a facet angle, and the facet angle makes the optical signal after field conversion mode field conversion to produce total reflection and output along a second direction. The optical signal after total reflection enters the optical chips. Thereby, an optical probe package structure that can test before wafer cutting and polishing is provided.

Abstract: An assembly alignment structure for optical component is provided, including: an optical fiber, comprising: a combined fiber segment and a plurality of bare fiber segments; a cover plate, having a first installation surface disposed with a plurality of guide grooves, an installation groove, and at least one first coupling groove, the bare fiber segments being in the corresponding in the guide grooves; a lens, arranged in the installation groove; a chip, having a signal receiving surface; a carrier plate, having a second installation surface disposed with at least one second coupling groove, the chip is fixed on the second installation surface; and at least one positioning post; when the cover plate and carrier plate are aligned, the positioning post is located in the first and second coupling grooves, and the optical fiber and the lens are fixed and aligned between the carrier plate and the cover plate.

Abstract: An alignment structure of optical element is provided, including: an optical fiber, having a parallel fiber segment and a plurality of bare fiber segments; a cover plate, provided with a plurality of side-by-side guide grooves and a plurality of first coupling parts, the bare fiber segments of the optical fiber being arranged in the corresponding guide grooves, cross-sectional shapes of the guide grooves being at least one of U-shaped or V-shaped; and a silicon chip, provided with lines and a plurality of second coupling parts; when the cover plate is matched with the silicon chip, the first coupling parts and the second coupling parts being coupled and positioned with each other respectively, and the optical fiber being fixed between the silicon chip and the cover plate. As such, precise positioning and rapid assembly are achieved.

Abstract: An optical probe package structure is provided, used in a test environment for testing a plurality of optical chips on a wafer, including: a main body, an optical fiber, an optical fiber positioning area, a mode field conversion waveguide structure, and an optical waveguide. Wherein, the mode field conversion waveguide structure is used to convert the propagation field of the optical signal, and the optical signal transmitted by the mode field conversion waveguide structure enters the optical waveguide. The optical waveguide has an emitting end, and the emitting end is provided with a facet, the facet has a facet angle, and the facet angle makes the optical signal after field conversion mode field conversion to produce total reflection and output along a second direction. The optical signal after total reflection enters the optical chips. Thereby, an optical probe package structure that can test before wafer cutting and polishing is provided.

Abstract: An optical probe for optoelectronic integrated circuits is provided, applicable to a test environment for testing a plurality of optical chips on a wafer. The optical chips include at least one optical waveguide, and the optical probe includes a substrate and an optical fiber. The facet of the optical fiber has a first angle, and the first angle causes the optical signal transmitted by the optical fiber to generate total reflection, and the optical signal after total reflection enters the optical waveguide of the optical chip. Thereby, an optical probe able to perform testing before wafer cutting and polishing is provided, and a high-speed, effective and reliable detection is achieved.

Abstract: An optical probe for optoelectronic integrated circuits is provided, applicable to a test environment for testing a plurality of optical chips on a wafer. The optical chips include at least one optical waveguide, and the optical probe includes a substrate and an optical fiber. The facet of the optical fiber has a first angle, and the first angle causes the optical signal transmitted by the optical fiber to generate total reflection, and the optical signal after total reflection enters the optical waveguide of the optical chip. Thereby, an optical probe able to perform testing before wafer cutting and polishing is provided, and a high-speed, effective and reliable detection is achieved.

Abstract: An alignment structure of optical element is provided, including: an optical fiber, having a parallel fiber segment and a plurality of bare fiber segments; a cover plate, provided with a plurality of side-by-side guide grooves and a plurality of first coupling parts, the bare fiber segments of the optical fiber being arranged in the corresponding guide grooves, cross-sectional shapes of the guide grooves being at least one of U-shaped or V-shaped; and a silicon chip, provided with lines and a plurality of second coupling parts; when the cover plate is matched with the silicon chip, the first coupling parts and the second coupling parts being coupled and positioned with each other respectively, and the optical fiber being fixed between the silicon chip and the cover plate. As such, precise positioning and rapid assembly are achieved.