Patents by Inventor Ting To Lo

Ting To Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220332717
    Abstract: Compounds of the following formula: having defined substituents. The compounds can inhibit class II phosphoinositide 3-kinase (PI3K) signaling and are useful for the treatment of a medical condition associated with defective PI3K signaling, such as myopathy, cancer, diabetes, thrombosis or cardiovascular disease.
    Type: Application
    Filed: June 7, 2019
    Publication date: October 20, 2022
    Inventors: Wen-Ting Lo, Hassane Belabed, Volker Haucke, Marc Nazare, Murat Kucukdisli
  • Publication number: 20220216571
    Abstract: The disclosure provides a method for manufacturing a separator, comprising the steps of: providing a nonporous precursor substrate; coating a heat-resistant slurry on a surface of the nonporous precursor substrate to form a heat-resistant coating layer, wherein the heat-resistant slurry comprises a binder and a plurality of inorganic particles; and stretching the nonporous precursor substrate with the heat-resistant coating layer formed thereon to generate a separator comprising a porous substrate and a heat-resistant layer; wherein the heat-resistant layer is disposed on the surface of the porous substrate in the range of 10% to 90% of the total surface area of the porous substrate.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Applicant: BenQ Materials Corporation
    Inventors: WEI-TING YEH, YI-FANG HUANG, KAI-WEI CHENG, YU-RUEI LI, WAN-TING LO
  • Publication number: 20210296734
    Abstract: The disclosure provides a separator comprising a porous substrate and a heat-resistant layer disposed on a surface of the substrate. The heat-resistant layer comprises a binder and a plurality of inorganic particles, wherein the heat-resistant layer is disposed on the surface of the porous substrate in the range of 10% to 90% of the total surface area of the porous substrate.
    Type: Application
    Filed: January 28, 2021
    Publication date: September 23, 2021
    Inventors: WEI-TING YEH, YI-FANG HUANG, KAI-WEI CHENG, YU-RUEI LI, WAN-TING LO
  • Patent number: 11032857
    Abstract: A mobile communication device including a Radio Frequency (RF) device and a baseband processor is provided. The RF device performs wireless transmission and reception to and from one or more cells. The baseband processor uses a first subscriber identity to establish a connection with a serving cell via the RF device to perform a first communication procedure, and in response to completing the first communication procedure or the first communication procedure being interrupted by a second communication procedure associated with a second subscriber identity, uses the first subscriber identity to send a measurement report to the serving cell via the RF device. In particular, the measurement report indicates a reported signal quality of the serving cell is poor enough to release the connection.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: June 8, 2021
    Assignee: MEDIATEK INC.
    Inventors: Chih-Yuan Tsai, Mohamed Abdelrazek El-Saidny, Yung-Chun Lin, Tzu-Ting Lo, Tsung-Ming Lee, Chun-Pin Chen
  • Publication number: 20210060918
    Abstract: A method for manufacturing a composite material is provided, including following steps of: (1) providing a thermoplastic prepreg which includes a first fibrous layer pre-impregnated with thermoplastic resin, wherein the first fibrous layer includes at least one layer which has a thickness smaller than or equal to 0.1 min, and at least a portion of the at least one layer includes fibers of parallel; (2) providing a thermosetting prepreg which includes a second fibrous layer pre-impregnated with unsolidified thermosetting resin; (3) combining the thermoplastic prepreg with the thermosetting prepreg by thermoforming to form a non-smooth bonding interface therebetween; (4) cooling the thermoplastic prepreg and the thermosetting prepreg which are combined in the step (3) to form the composite material.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 4, 2021
    Inventors: SHAO-CHEN CHIU, CHANG-TING LO, SHIH-YU HUANG
  • Patent number: 10922464
    Abstract: Fabricating a first semiconductor device cell using a first process based on a first process parameter or material comprises extracting semiconductor device parameters from the first process parameters to obtain extracted semiconductor device parameters of a first semiconductor device cell. The fabrication process includes training an artificial intelligence to obtain a predictive artificial intelligence using training data as input, the training data comprising the extracted semiconductor device cell parameters and the first process parameter or material. A proposed process modification is provided to the predictive artificial intelligence to generate a predicted cell delay by the predictive artificial intelligence. The predicted cell delay is evaluated against a cell delay threshold. When the predicted cell delay satisfies the cell delay threshold, a new semiconductor device cell is fabricated using a modified process incorporating the proposed process modification.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: February 16, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Hui-I Wu, Ke-Ying Su, Wan-Ting Lo, Niranjan Vepuri, Hsiang-Ho Chang
  • Patent number: 10762951
    Abstract: An SRAM device includes a memory cell and a keeper circuit. The memory cell is formed in an active area and coupled to a first bit line and a second bit line. The keeper circuit is formed in the active area and configured to charge the second bit line when the first bit line is at a first voltage level and the second bit line is at a second voltage level or charge the first bit line when the second bit line is at the first voltage level and the first bit line is at the second voltage level, wherein the second voltage level is higher than the first voltage level.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 1, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Wei Tsai, Tsan-Tang Chen, Chung-Cheng Tsai, Yen-Hsueh Huang, Chang-Ting Lo, Chun-Yen Tseng, Yu-Tse Kuo
  • Publication number: 20200110913
    Abstract: Fabricating a first semiconductor device cell using a first process based on a first process parameter or material comprises extracting semiconductor device parameters from the first process parameters to obtain extracted semiconductor device parameters of a first semiconductor device cell. The fabrication process includes training an artificial intelligence to obtain a predictive artificial intelligence using training data as input, the training data comprising the extracted semiconductor device cell parameters and the first process parameter or material. A proposed process modification is provided to the predictive artificial intelligence to generate a predicted cell delay by the predictive artificial intelligence. The predicted cell delay is evaluated against a cell delay threshold. When the predicted cell delay satisfies the cell delay threshold, a new semiconductor device cell is fabricated using a modified process incorporating the proposed process modification.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 9, 2020
    Inventors: Hui-I Wu, Ke-Ying Su, Wan-Ting Lo, Niranjan Vepuri, Hsiang-Ho Chang
  • Patent number: 10515172
    Abstract: Fabricating a first semiconductor device cell using a first process based on a first process parameter or material comprises extracting semiconductor device parameters from the first process parameters to obtain extracted semiconductor device parameters of a first semiconductor device cell. The fabrication process includes training an artificial intelligence to obtain a predictive artificial intelligence using training data as input, the training data comprising the extracted semiconductor device cell parameters and the first process parameter or material. A proposed process modification is provided to the predictive artificial intelligence to generate a predicted cell delay by the predictive artificial intelligence. The predicted cell delay is evaluated against a cell delay threshold. When the predicted cell delay satisfies the cell delay threshold, a new semiconductor device cell is fabricated using a modified process incorporating the proposed process modification.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: December 24, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Hui-I Wu, Ke-Ying Su, Wan-Ting Lo, Niranjan Vepuri, Hsiang-Ho Chang
  • Publication number: 20190357275
    Abstract: A mobile communication device including a Radio Frequency (RF) device and a baseband processor is provided. The RF device performs wireless transmission and reception to and from one or more cells. The baseband processor uses a first subscriber identity to establish a connection with a serving cell via the RF device to perform a first communication procedure, and in response to completing the first communication procedure or the first communication procedure being interrupted by a second communication procedure associated with a second subscriber identity, uses the first subscriber identity to send a measurement report to the serving cell via the RF device. In particular, the measurement report indicates a reported signal quality of the serving cell is poor enough to release the connection.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 21, 2019
    Inventors: Chih-Yuan TSAI, Mohamed Abdelrazek El-Saidny, Yung-Chun LIN, Tzu-Ting LO, Tsung-Ming LEE, Chun-Pin CHEN
  • Publication number: 20190310735
    Abstract: The present disclosure provides a method for correcting touch position to a tip of a stylus on a touch sensitive electronic device; the method is adapted to perform an actual touch point compensation of the tip of the styles including a first electrode and a second electrode separated from each other. The method includes: defining a distance coefficient by the distance between the first and the second electrodes; defining a first position by the projection of the first electrode on the touch sensitive electronic device; defining a second position by the projection of the second electrode on the touch sensitive electronic device; and performing the actual touch point compensation in accordance with the distance coefficient and the first and second positions.
    Type: Application
    Filed: April 4, 2018
    Publication date: October 10, 2019
    Inventors: Yueh-Hua LI, Yu-Ting LO
  • Publication number: 20190121928
    Abstract: Fabricating a first semiconductor device cell using a first process based on a first process parameter or material comprises extracting semiconductor device parameters from the first process parameters to obtain extracted semiconductor device parameters of a first semiconductor device cell. The fabrication process includes training an artificial intelligence to obtain a predictive artificial intelligence using training data as input, the training data comprising the extracted semiconductor device cell parameters and the first process parameter or material. A proposed process modification is provided to the predictive artificial intelligence to generate a predicted cell delay by the predictive artificial intelligence. The predicted cell delay is evaluated against a cell delay threshold. When the predicted cell delay satisfies the cell delay threshold, a new semiconductor device cell is fabricated using a modified process incorporating the proposed process modification.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 25, 2019
    Inventors: Hui-I Wu, Ke-Ying Su, Wan-Ting Lo, Niranjan Vepuri, Hsiang-Ho Chang
  • Publication number: 20190101497
    Abstract: The present disclosure relates to a device and method for measuring the thermal properties of different types of shoes. More specifically, the present disclosure relates to an improved foot manikin comprising a foot shaped member and a shin element. The foot shaped member is connected to the shin element via an ankle joint. The foot shaped member further comprises a metatarsal phalangeal joint connecting a toe portion of the foot shaped member with the rest of the foot shaped member.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Kit-Lun YICK, Wai-ting LO, Sun-Pui NG, Yiu-Wan Joanne YIP, Annie YU
  • Patent number: 9977520
    Abstract: Embodiments of a stylus having a capacitive slide sensor and grip sensors are disclosed, for use with electronic devices and particularly with touchscreen devices. The stylus is in signal communication with the electronic device, either wired or wirelessly, and the slide sensor allows a user to generate a sliding data value as well as a contact/no-contact datum; these can be used as scaled control values or as buttonpress control values to control features of applications running on the electronic device. The capacitive sensors are formed on a single flexible PCB wrapped inside the stylus barrel.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 22, 2018
    Assignee: Adonit Co., Ltd.
    Inventors: Yu-Kuang Hou, Yueh-Hua Li, Yen-Teh Lee, Chien-Pang Lin, Yu-Ting Lo
  • Publication number: 20180024650
    Abstract: Embodiments of a stylus having a capacitive slide sensor and grip sensors are disclosed, for use with electronic devices and particularly with touchscreen devices. The stylus is in signal communication with the electronic device, either wired or wirelessly, and the slide sensor allows a user to generate a sliding data value as well as a contact/no-contact datum; these can be used as scaled control values or as buttonpress control values to control features of applications running on the electronic device. The capacitive sensors are formed on a single flexible PCB wrapped inside the stylus barrel.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 25, 2018
    Inventors: Yu-Kuang Hou, Yueh-Hua Li, Yen-Teh Lee, CHIEN-PANG LIN, Yu-Ting Lo
  • Patent number: 9719553
    Abstract: A rotation drive device includes a crankshaft which has two ends dynamically connected to a drive source and a driven device, respectively. The drive source drives the crankshaft to rotate the driven device. The crankshaft structurally changes to make the two ends of the shaft portion connected to the rotation drive portion and the driven portion, respectively, at different central angles, which divides the space into two subspaces which are located two sides of the shaft portion, so that the wire can be arranged in the subspaces at both sides of the shaft portion, thus enhancing the flexibility of wire distribution while improving rotation range of motion.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: August 1, 2017
    Assignee: HIWIN TECHNOLOGIES CORP.
    Inventors: Yi-Ting Lo, Chin-Yen Su
  • Publication number: 20170184145
    Abstract: A rotation drive device includes a crankshaft which has two ends dynamically connected to a drive source and a driven device, respectively. The drive source drives the crankshaft to rotate the driven device. The crankshaft structurally changes to make the two ends of the shaft portion connected to the rotation drive portion and the driven portion, respectively, at different central angles, which divides the space into two subspaces which are located two sides of the shaft portion, so that the wire can be arranged in the subspaces at both sides of the shaft portion, thus enhancing the flexibility of wire distribution while improving rotation range of motion.
    Type: Application
    Filed: December 28, 2015
    Publication date: June 29, 2017
    Inventors: Yi-Ting LO, Chin-Yen SU
  • Patent number: D697897
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: January 21, 2014
    Assignee: Monster, LLC
    Inventors: Noel Lee, Man Ting Lo, Jacky Hsiung, Kendrew Lee
  • Patent number: D715253
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: October 14, 2014
    Assignee: Monster, LLC
    Inventors: Noel Lee, Kendrew Lee, Man Ting Lo
  • Patent number: D715254
    Type: Grant
    Filed: September 8, 2013
    Date of Patent: October 14, 2014
    Assignee: Monster, LLC
    Inventors: Noel Lee, Kendrew Lee, Man Ting Lo