Patents by Inventor Ting Wang

Ting Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240005666
    Abstract: Provided are methods for managing vehicle resources based on scenarios, which can include obtaining, from the at least one sensor, information representative of the environment of the vehicle; determining, based on the information representative of the environment of the vehicle, a current scenario of the environment of the vehicle; determining, based on the determined current scenario, a level of computational resources appropriate for the determined current scenario; and adjusting at least one parameter associated with the at least one sensor based on the determined level of computational resources. Systems and computer program products are also provided.
    Type: Application
    Filed: April 26, 2023
    Publication date: January 4, 2024
    Inventor: Ting Wang
  • Publication number: 20240005553
    Abstract: The embodiments of the disclosure provide a method for pose correction and a host. The method includes: obtaining a first image; in response to determining that a first reference object of at least one reference object exists in the first image, determining a first relative position between the host and the first reference object; obtaining a first reference pose based on the first relative position; and correcting a pose of the host based on the first reference pose.
    Type: Application
    Filed: May 26, 2022
    Publication date: January 4, 2024
    Applicant: HTC Corporation
    Inventors: Yun-Ting Wang, Sheng-Hui Tao
  • Patent number: 11864410
    Abstract: The present disclosure provides an OLED display panel, a preparation method thereof and an OLED display device. By providing an uneven surface on a side of a first encapsulation layer away from the organic light-emitting function layer in a non-display area, the uneven surface of the first encapsulation layer can block the flow of the second encapsulation layer to a certain extent, so as to reduce the fluidity and the climbing distance of the edge of the second encapsulation layer, and increase the edge stress and the slope angle. Thereby the narrow frame design of the product is achieved, the thickness uniformity of the edge of the second encapsulation layer is improved, the Mura defect in the non-display area is avoided, and the encapsulation result is guaranteed.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: January 2, 2024
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ge Wang, Zhiliang Jiang, Ting Wang, Zi Qiao
  • Publication number: 20230420532
    Abstract: A method of manufacturing an integrated circuit device is provided. The method includes forming a semiconductor fin over a semiconductor substrate; forming an isolation structure surrounding the semiconductor fin; etching a trench in the semiconductor fin; forming a dielectric fin in the trench; after forming the dielectric fin, recessing a top surface of the isolation structure, such that the dielectric fin and the semiconductor fin protrude from the recessed top surface of the isolation structure; and forming a first metal gate structure and a second metal gate structure over the dielectric fin and the semiconductor fin, respectively.
    Type: Application
    Filed: June 27, 2022
    Publication date: December 28, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Ruei JHAN, Kuan-Ting PAN, Wei Ting WANG, Shi Ning JU, Kuo-Cheng CHIANG, Chih-Hao WANG
  • Patent number: 11851017
    Abstract: A safety airbag having an air bag, the air bag configured with an inflated state and a stowed state, and including a main body portion and a first side flap and a second side flap connected to two sides of the main body portion. The first side flap and the second side flap extend from the main body portion towards an occupant when the air bag is in the inflated state such that the head of the occupant is accommodated in a recessed portion between the first side flap and the second side flap. The first side flap includes a first inner side surface and a first outer side surface. The second side flap includes a second inner side surface and a second outer side surface.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: December 26, 2023
    Assignee: Autoliv Development AB
    Inventors: Qiang Meng, Ting Wang
  • Patent number: 11855146
    Abstract: A method includes forming a gate stack on a first portion of a semiconductor substrate, removing a second portion of the semiconductor substrate on a side of the gate stack to form a recess, growing a semiconductor region starting from the recess, implanting the semiconductor region with an impurity, and performing a melt anneal on the semiconductor region. At least a portion of the semiconductor region is molten during the melt anneal.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Su-Hao Liu, Wen-Yen Chen, Li-Heng Chen, Li-Ting Wang, Liang-Yin Chen, Huicheng Chang, Yee-Chia Yeo, Ying-Lang Wang
  • Publication number: 20230408631
    Abstract: In some aspects, a device may receive a communication indicating a first radar signal pattern parameter set associated with another device. The device may select, based at least in part receiving the communication indicating the first radar signal pattern parameter set, a second radar signal pattern parameter set that is different from the first radar signal pattern parameter set. The device may transmit a radar signal using the second radar signal pattern parameter set. Numerous other aspects are provided.
    Type: Application
    Filed: November 13, 2020
    Publication date: December 21, 2023
    Inventors: Yan LI, Shuping CHEN, Lu GAO, Ting WANG
  • Publication number: 20230411168
    Abstract: Provided is a device including a fin structure and methods for forming such a device. A method includes forming an initial fin having a sidewall. Further, the method includes forming an additional layer of fin material over the sidewall, wherein the additional layer has a thickness. Also, the method includes adjusting the thickness of the additional layer of fin material to form a fin structure with a desired critical dimension.
    Type: Application
    Filed: June 16, 2022
    Publication date: December 21, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Yang Lu, Tz-Shian Chen, Li-Ting Wang, Huicheng Chang, Yee-Chia Yeo
  • Publication number: 20230412266
    Abstract: A method for time synchronization using distributed fiber optic sensing (DFOS) that employs several trusted time beacons that are attached to the DFOS sensing fiber which in turn is connected to the DFOS interrogator. The beacons transmit their signal via two different mediums, (1) wirelessly to sensor nodes in the coverage area, and (2) through vibrations on fiber to the DFOS/DAS system located at a trusted area such as the central office. Wireless broadcast to nearby sensors includes a timestamp and beacon ID. All the sensors in the field use one of the beacons in their vicinity (the one with the strongest signal) as their time reference and send the data back with the corresponding beacon index.
    Type: Application
    Filed: May 17, 2023
    Publication date: December 21, 2023
    Applicant: NEC Laboratories America, Inc.
    Inventors: Christopher WHITE, Jian FANG, Sarper OZHARAR, Ting WANG
  • Patent number: 11846569
    Abstract: A method of utility pole integrity assessment by distributed fiber optic sensing/distributed acoustic sensing (DFOS/DAS) employing existing telecommunications fiber optic cable as a sensor. The fiber optic cable is suspended aerially from a plurality of utility poles and a machine learning model is developed during training by mechanically exciting the utility poles. Once developed, and in sharp contrast to the prior art, the machine learning model—in conjunction with DFOS/DAS operation—determines an integrity assessment for a plurality of the utility poles aerially suspending the fiber optic cable from a mechanical impact of a single pole.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: December 19, 2023
    Assignee: NEC Corporation
    Inventors: Yue Tian, Sarper Ozharar, Yangmin Ding, Shaobo Han, Ting Wang
  • Publication number: 20230394782
    Abstract: The embodiments of the disclosure provide a method for determining a floor plane and a host. The method includes: determining a first plane as a reference floor plane based on motion data; in response to determining that the host has moved for a predetermined distance after determining the first plane as the reference floor plane, determining a plurality of first feature points on the reference floor plane; determining a second plane based on the first feature points on the reference floor plane; and in response to determining that the second plane meets a predetermined condition, determining the second plane as the reference floor plane.
    Type: Application
    Filed: April 17, 2023
    Publication date: December 7, 2023
    Applicant: HTC Corporation
    Inventors: Yun-Ting Wang, Nien Hsin Chou
  • Publication number: 20230383435
    Abstract: In an embodiment, an apparatus includes a first pyrometer and a second pyrometer configured to monitor thermal radiation from a first point and a second point on a backside of a wafer, respectively, a first heating source in a first region and a second heating source in a second region of an epitaxial growth chamber, respectively, where a first controller adjusts an output of the first heating source and the second heating source based upon the monitored thermal radiation from the first point and the second point, respectively, a third pyrometer and a fourth pyrometer configured to monitor thermal radiation from a third point and a fourth point on a frontside of the wafer, respectively, where a second controller adjusts a flow rate of one or more precursors injected into the epitaxial growth chamber based upon the monitored thermal radiation from the first, second, third, and fourth points.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Li-Ting Wang, Jung-Jen Chen, Ming-Hua Yu, Yee-Chia Yeo
  • Publication number: 20230387251
    Abstract: A method for manufacturing a semiconductor device includes: forming a patterned structure on a substrate, the patterned structure including a dielectric layer and a dummy gate structure disposed in the dielectric layer; and subjecting the patterned structure to an ion implantation process so as to modulate a profile of the dummy gate structure.
    Type: Application
    Filed: May 25, 2022
    Publication date: November 30, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tien-Shun CHANG, Kuo-Ju CHEN, Sih-Jie LIU, Wei-Fu WANG, Yi-Chao WANG, Li-Ting WANG, Su-Hao LIU, Huicheng CHANG, Yee-Chia YEO
  • Patent number: 11832191
    Abstract: This application provides a power control method, a terminal, and a network device. The power control method includes: receiving, by a terminal, at least one piece of downlink control information (DCI) sent by at least one network device, where the at least one piece of DCI includes at least two transmit power control commands; and determining, by the terminal, a transmit power on an uplink channel in a same carrier based on the at least two transmit power control commands. According to the power control method in the embodiments of this application, the terminal can determine the transmit power on the uplink channel based on a plurality of transmit power control commands, thereby ensuring efficient and proper power allocation and improving overall system performance.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: November 28, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shengyue Dou, Ting Wang, Haibao Ren, Yuanjie Li
  • Patent number: 11830589
    Abstract: The disclosure provides a disease classification method and a disease classification device. The disease classification method includes: inputting samples into a first stage model and obtaining a first stage determination result; inputting first samples determined positive by the first stage model into a second stage high specificity model to obtain second samples determined to be positive and third samples determined to be negative and rule in the second samples; inputting fourth samples determined negative by the first stage model into a second stage high sensitivity model to obtain fifth samples determined to be positive and sixth samples determined to be negative and rule out the sixth samples; obtaining a second stage determination result of the second and sixth samples; and inputting the third and fifth samples not ruled in or ruled out into a third stage model and obtaining a third stage determination result of the third and fifth samples.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: November 28, 2023
    Assignees: Acer Incorporated, Acer Medical Inc., Taipei Veterans General Hospital
    Inventors: Jun-Hong Chen, Tsung-Hsien Tsai, Chun-Hsien Li, Wei-Ting Wang, Yin-Hao Lee, Hao-Min Cheng
  • Patent number: 11829216
    Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may determine a temperature value associated with a discrete graphics processing unit (dGPU); if the temperature value is below a threshold temperature value: configure an information handling system (IHS) to utilize the dGPU for processing graphics workloads of the IHS; disable an integrated graphics processing unit (iGPU) from processing any of the graphics workloads; and provide an amount of power utilized by the iGPU to a processor of the IHS; and if the temperature value is not below the threshold temperature value: determine that the iGPU is disabled; configure the IHS to utilize the iGPU for processing a portion of the graphics workloads; and enable the iGPU to process the portion of the graphics workloads; and remove the amount of power utilized by the iGPU from the at least one processor.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: November 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Thomas Alexander Shows, Yi-Ting Wang
  • Publication number: 20230378881
    Abstract: The present application provides a control device, a power-supply device, and a method for controlling a power-supply device. The control device, applied to a power converter, includes a primary controller, a secondary controller and a voltage detector, wherein the power converter includes a transformer having a primary winding and a secondary winding. The primary controller is configured to generate a PWM signal having an off-time and an on-time, wherein the power converter is operative to deliver power from the primary winding to the secondary winding during the on-time. The secondary controller monitors an output voltage of the power converter and applies a preset voltage to the secondary winding according to a threshold voltage and the output voltage. The voltage detector, coupled to the primary winding, drives the primary controller to adjust a period of the PWM signal in response to the application of the preset voltage.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Inventors: WEI-TING WANG, YUEH-PING YU
  • Publication number: 20230377915
    Abstract: An intensity of a power laser beam applied to a semiconductor device is adjusted. An applied intensity of the power laser beam is indicative of a magnitude at which the power laser beam is emitted toward the semiconductor device and a reflection intensity of a probing laser beam applied to the semiconductor device is indicative of an emissivity of the semiconductor device. The reflection intensity of the probing laser beam is measured to determine the emissivity of the semiconductor device and the applied intensity of the power laser beam is adjusted as a function of the emissivity.
    Type: Application
    Filed: May 17, 2022
    Publication date: November 23, 2023
    Inventors: Wei-Fu Wang, Yi-Chao Yi-Chao, Li-Ting Wang, Yee-Chia Yeo
  • Publication number: 20230377179
    Abstract: Computer vision based, wide-area snow/water level estimation methods using disparity maps. In one embodiment our method provides rich depth-information using a stereo camera and image processing. Scene images at normal and snow/rain weather conditions are obtained by a double-lens stereo camera and a disparity map is generated from the scene images at left and right lenses using a self-supervised deep convolutional network. In another embodiment, our method uses a single point snow/water level sensor, a stationary monocular camera to measure snow/water levels covering a wide area.
    Type: Application
    Filed: May 17, 2023
    Publication date: November 23, 2023
    Applicant: NEC Laboratories America, Inc.
    Inventors: Zhuocheng JIANG, Yue TIAN, Yangmin DING, Sarper OZHARAR, Ting WANG
  • Patent number: D1009795
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: January 2, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Hirotsugu Yamamoto, Ting Wang