Patents by Inventor Ting-Wei CHI

Ting-Wei CHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11527472
    Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: December 13, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cho-Hsin Chang, Hao-Ju Fang, Ting-Wei Chi, Te-Fang Chu
  • Publication number: 20210305148
    Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.
    Type: Application
    Filed: May 6, 2020
    Publication date: September 30, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cho-Hsin Chang, Hao-Ju Fang, Ting-Wei Chi, Te-Fang Chu
  • Publication number: 20150205088
    Abstract: An embodiment disclosed bevel-axial auto-focusing method for a microscopic system, including: capturing full-frame bevel-axial input image; using image analysis to read image information and transmitting grayscale information to a statistic analysis module; the statistic module extracting image statistic characteristics and performing curve fitting with probability function; and estimating the optimal focus point based on the post-fitting characteristic parameters. A preferred embodiment combines image with Gaussian curve fitting and Kalman filter, and analyzes the in-focus position based on image quality so as to directly determine the optimal rectification value of the in-focus position on the object surface. The method can improve the accuracy and speed of auto-focusing.
    Type: Application
    Filed: January 23, 2014
    Publication date: July 23, 2015
    Applicant: U&U Engineering Inc.
    Inventors: Ta-Ming SHIH, Ho-Chung CHANG, Ting-Wei CHI, Hsiao-Yen CHUANG