Abstract: The present invention reveals an alignment platform for aligning electronic component precisely to the operation position during testing or hot pressing processes. The alignment platform makes a rotor to rotate by a driving apparatus. The rotor has an eccentric axle to where a connecting member is disposed. The connecting member is moved by the eccentric axle, driving an active plate to move. The eccentric axle, the driving apparatus, the connecting member, and the active plate are configured to move under control in a micro or nano meter scale. Thus, precisely alignment of electronic component can be achieved. Floating mechanism of electronic component transmission apparatus or electronic component handler may be dismissed for lowering cost and prolonging lifetime.

Abstract: The present disclosure relates to a semiconductor device with a hybrid fin-dielectric region. The semiconductor device includes a substrate, a source region and a drain region laterally separated by a hybrid fin-dielectric (HFD) region. A gate electrode is disposed above the HFD region and the HFD region includes a plurality of fins covered by a dielectric and separated from the source region and the drain region by the dielectric.

Abstract: The present invention reveals an alignment platform for aligning electronic component precisely to the operation position during testing or hot pressing processes. The alignment platform makes a rotor to rotate by a driving apparatus. The rotor has an eccentric axle to where a connecting member is disposed. The connecting member is moved by the eccentric axle, driving an active plate to move. The eccentric axle, the driving apparatus, the connecting member, and the active plate are configured to move under control in a micro or nano meter scale. Thus, precisely alignment of electronic component can be achieved. Floating mechanism of electronic component transmission apparatus or electronic component handler may be dismissed for lowering cost and prolonging lifetime.

Abstract: In some embodiments, a semiconductor device comprises a first active region, a second active region, and a conductive metal structure. The second active region is separate from the first active region. The conductive metal structure is arranged to connect the first active region and the second active region. The conductive metal structure includes a first leg, a second leg and a body. The second leg is separate from the first leg and a body extending between and connecting the first leg and the second leg.

Abstract: In some embodiments, a semiconductor device comprises a first active region, a second active region, and a conductive metal structure. The second active region is separate from the first active region. The conductive metal structure is arranged to connect the first active region and the second active region. The conductive metal structure includes a first leg, a second leg and a body. The second leg is separate from the first leg and a body extending between and connecting the first leg and the second leg.