Patents by Inventor Ting-Wei CHUNG

Ting-Wei CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POWER MANAGEMENT METHOD AND ELECTRONIC DEVICE USING SAME
    Publication number: 20240069618
    Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.
    Type: Application
    Filed: April 27, 2023
    Publication date: February 29, 2024
    Inventors: Wen Che CHUNG, Hui Chuan LO, Hao-Hsuan LIN, Chun TSAO, Jun-Fu CHEN, Ming-Hung YAO, Jia-Wei ZHANG, Kuan-Lun CHEN, Ting-Chao LIN, Cheng-Yen LIN, Chunyen LAI
  • Circuit substrate and display panel including the same
    Patent number: 9012931
    Abstract: A circuit substrate includes a substrate, a first lead line, a second lead line, an insulating layer and a pad. The substrate has a pad region, a first non-pad region and a second non-pad region. The first lead line extends from the first non-pad region to the pad region. The second lead line extends from the second non-pad region to the pad region. The insulating layer is interposed between the first and second lead lines. The pads are on the pad region of the substrate and one of the pads is electrically connected to the first and second lead lines. A display panel including the circuit substrate is also provided.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: April 21, 2015
    Assignee: AU Optronics Corporation
    Inventors: Ting-Wei Chung, Tsai-Chi Yeh, Kuan-Ting Chen, Ming-Huei Lin, Pei-Chi Hsu
  • CIRCUIT SUBSTRATE AND DISPLAY PANEL INCLUDING THE SAME
    Publication number: 20140339575
    Abstract: A circuit substrate includes a substrate, a first lead line, a second lead line, an insulating layer and a pad. The substrate has a pad region, a first non-pad region and a second non-pad region. The first lead line extends from the first non-pad region to the pad region. The second lead line extends from the second non-pad region to the pad region. The insulating layer is interposed between the first and second lead lines. The pads are on the pad region of the substrate and one of the pads is electrically connected to the first and second lead lines. A display panel including the circuit substrate is also provided.
    Type: Application
    Filed: February 18, 2014
    Publication date: November 20, 2014
    Applicant: AU Optronics Corporation
    Inventors: Ting-Wei CHUNG, Tsai-Chi YEH, Kuan-Ting CHEN, Ming-Huei LIN, Pei-Chi HSU