Patents by Inventor Ting-Wei Yang

Ting-Wei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11983479
    Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung-Chan Yang, Ting-Wei Chiang, Jerry Chang-Jui Kao, Hui-Zhong Zhuang, Lee-Chung Lu, Li-Chun Tien, Meng-Hung Shen, Shang-Chih Hsieh, Chi-Yu Lu
  • Publication number: 20240153849
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a chip structure including a substrate and a wiring structure over a first surface of the substrate. The semiconductor device structure includes a first seed layer over the wiring structure, a first inner wall of the first enlarged portion, and a second inner wall of the neck portion. The semiconductor device structure includes a second seed layer over a second surface of the substrate, a third inner wall of the second enlarged portion, and the first seed layer over the second inner wall of the neck portion. The second seed layer is in direct contact with the first seed layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li YANG, Wen-Hsiung LU, Lung-Kai MAO, Fu-Wei LIU, Mirng-Ji LII
  • Patent number: 11968817
    Abstract: A semiconductor device includes a fin structure. A source/drain region is formed on the fin structure. A first gate structure is disposed over the fin structure. A source/drain contact is disposed over the source/drain region. The source/drain contact has a protruding segment that protrudes at least partially over the first gate structure. The source/drain contact electrically couples together the source/drain region and the first gate structure.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jui-Lin Chen, Chao-Yuan Chang, Ping-Wei Wang, Fu-Kai Yang, Ting Fang, I-Wen Wu, Shih-Hao Lin
  • Publication number: 20240119213
    Abstract: A method includes designing a plurality of cells for a semiconductor device, wherein designing the plurality of cells comprises reserving a routing track of a plurality of routing tracks within each of the plurality of cells, wherein each of the plurality of cells comprises signal lines, and the reserved routing track is free of the signal lines. The method includes placing a first cell and a second cell of the plurality of cells in a layout of the semiconductor device. The method includes determining whether any power rails overlap with any of the plurality of routing tracks other than the reserved routing track in the second cell. The method includes adjusting a distance between the first cell and the second cell in response to a determination that at least one power rail overlaps with at least one routing track other than the reserved routing track.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Jian-Sing LI, Jung-Chan YANG, Ting Yu CHEN, Ting-Wei CHIANG
  • Patent number: 11955890
    Abstract: A switching converter circuit for switching one end of an inductor therein between plural voltages according to a pulse width modulation (PWM) signal to convert an input voltage to an output voltage. The switching converter circuit has a driver circuit including a high side driver, a low side driver, a high side sensor circuit, and a low side sensor circuit. The high side sensor circuit is configured to sense a gate-source voltage of a high side metal oxide semiconductor field effect transistor (MOSFET), to generate a low side enable signal for enabling the low side driver to switch a low side MOSFET according to the PWM signal. The low side sensor circuit is configured to sense a gate-source voltage of a low side MOSFET, to generate a high side enable signal for enabling the high side driver to switch a high side MOSFET according to the PWM signal.
    Type: Grant
    Filed: January 2, 2022
    Date of Patent: April 9, 2024
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Ting-Wei Liao, Chien-Yu Chen, Kun-Huang Yu, Chien-Wei Chiu, Ta-Yung Yang
  • Patent number: 11942398
    Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
  • Publication number: 20240088023
    Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
  • Publication number: 20240083742
    Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li YANG, Kai-Di WU, Ming-Da CHENG, Wen-Hsiung LU, Cheng Jen LIN, Chin Wei KANG
  • Publication number: 20240069069
    Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: November 10, 2023
    Publication date: February 29, 2024
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
  • Patent number: 10079751
    Abstract: A flexible network building method for a remote-programmable monitoring and controlling system including an intelligent network device, a local area network router, and a dominant host in communication with the local area network router, including: sending a dominant host beacon containing router connection data for the local area network router through the dominant host; the intelligent network device receiving the dominant host beacon sent from the dominant host, and logining to the local area network router; the dominant host logining to the intelligent network device; sending a control command to the intelligent network device through the dominant host; receiving and executing the control command using the intelligent network device; and the intelligent network device responding to the dominant host with an executing status message after the execution of the control command.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: September 18, 2018
    Assignee: Link Advance Co., Ltd.
    Inventor: Ting-Wei Yang
  • Publication number: 20170006109
    Abstract: A flexible network building method for a remote-programmable monitoring and controlling system including an intelligent network device, a local area network router, and a dominant host in communication with the local area network router, including: sending a dominant host beacon containing router connection data for the local area network router through the dominant host; the intelligent network device receiving the dominant host beacon sent from the dominant host, and logining to the local area network router; the dominant host logining to the intelligent network device; sending a control command to the intelligent network device through the dominant host; receiving and executing the control command using the intelligent network device; and the intelligent network device responding to the dominant host with an executing status message after the execution of the control command
    Type: Application
    Filed: September 12, 2016
    Publication date: January 5, 2017
    Inventor: Ting-Wei Yang
  • Patent number: 8095235
    Abstract: A method for control of humidity and auto-dispensing of pills in a pill box includes a box having multiple rooms defined therein which are shifted to be in alignment with an outlet. The method controls the humidity in each of the rooms and provides a control unit which controls a transmission unit to proceed a mechanical action to shift the rooms to be in alignment with the outlet according to a time setting signal so as to dispense at least one pill. The method includes a display unit to display time information and provides a reminder to take pills by way of audio and/or light.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: January 10, 2012
    Assignee: Southern Taiwan University
    Inventors: Hsinn-Jyh Tzeng, Ting-Wei Yang, Tsan-Cheng Yang, Chih-Chun Chang, Meng-Feng Tsai, Chih-Tung Su
  • Publication number: 20110153068
    Abstract: A method for control of humidity and auto-dispensing of pills in a pill box includes a box having multiple rooms defined therein which are shifted to be in alignment with an outlet. The method controls the humidity in each of the rooms and provides a control unit which controls a transmission unit to proceed a mechanical action to shift the rooms to be in alignment with the outlet according to a time setting signal so as to dispense at least one pill. The method includes a display unit to display time information and provides a reminder to take pills by way of audio and/or light.
    Type: Application
    Filed: December 23, 2009
    Publication date: June 23, 2011
    Inventors: Hsinn-Jyh Tzeng, Ting-Wei Yang, Tsan-Cheng Yang, Chih-Chun Chang, Meng-Feng Tsai, Chih-Tung Su
  • Patent number: 7887895
    Abstract: An optical disc includes an annular substrate, a coating layer, a damping layer, and a leveling layer. The annular substrate includes a supporting portion, and a recording portion surrounding the supporting portion, wherein the recording portion has a recording surface located on a first side thereof. For disc clamping and cost saving, the supporting portion is thicker than the recording portion. The coating layer is formed on the recoding surface for recording dada. The damping layer is formed on the coating layer to shorten the response time of the optical disc to vibration. The leveling layer is formed on the side of the annular substrate opposite to the recording surface for leveling the disk deformation caused during fabrication. A method for fabricating the aforementioned optical disc is also disclosed.
    Type: Grant
    Filed: December 30, 2007
    Date of Patent: February 15, 2011
    Assignees: Princo Corp., Princo America Corp,
    Inventors: Pei-Liang Chiu, Ting-Wei Yang, Chi-Pin Kuo
  • Patent number: 7879422
    Abstract: An optical disc capable of suppressing vibration during read/write process includes an annular substrate, a coated layer, and a damping layer. The annular substrate includes a supporting portion and a recording portion, and a recording surface corresponding to the recording portion. The coated layer is formed on the recording surface. The damping layer is formed on the coated layer side of the annular substrate for increasing the response time to vibration of the optical disc. A method for fabricating the aforementioned optical disc is also disclosed.
    Type: Grant
    Filed: October 22, 2006
    Date of Patent: February 1, 2011
    Assignees: Princo Corp., Princo America Corp.
    Inventors: Ting-Wei Yang, Sheng-Chih Wu
  • Patent number: 7781011
    Abstract: The invention relates to a tool for coating an optical disc, and the tool includes: a coating section for spreading coating material; a restricting section for defining a coating area; and a support section for supporting the coating section and the restricting section. The coating section and the restricting section form a material accommodating space. Also, a method for coating an optical disc by using such tool and a method for fabricating an optical disc are disclosed.
    Type: Grant
    Filed: April 13, 2008
    Date of Patent: August 24, 2010
    Assignees: Princo Corp., Princo America Corp.
    Inventors: Ting-Wei Yang, Chi-Pin Kuo
  • Publication number: 20090092750
    Abstract: The invention relates to a tool for coating an optical disc, and the tool includes: a coating section for spreading coating material; a restricting section for defining a coating area; and a support section for supporting the coating section and the restricting section. The coating section and the restricting section form a material accommodating space. Also, a method for coating an optical disc by using such tool and a method for fabricating an optical disc are disclosed.
    Type: Application
    Filed: April 13, 2008
    Publication date: April 9, 2009
    Applicants: PRINCO CORP., PRINCO AMERICA CORP.
    Inventors: Ting-Wei Yang, Chi-Pin Kuo
  • Publication number: 20090053454
    Abstract: An optical disc includes an annular substrate, a coating layer, a damping layer, and a leveling layer. The annular substrate includes a supporting portion, and a recording portion surrounding the supporting portion, wherein the recording portion has a recording surface located on a first side thereof. For disc clamping and cost saving, the supporting portion is thicker than the recording portion. The coating layer is formed on the recoding surface for recording dada. The damping layer is formed on the coating layer to shorten the response time of the optical disc to vibration. The leveling layer is formed on the side of the annular substrate opposite to the recording surface for leveling the disk deformation caused during fabrication. A method for fabricating the aforementioned optical disc is also disclosed.
    Type: Application
    Filed: December 30, 2007
    Publication date: February 26, 2009
    Applicants: PRINCO CORP., PRINCO AMERICA CORP.
    Inventors: Pei-Liang Chiu, Ting-Wei Yang, Chi-Pin Kuo
  • Publication number: 20070098948
    Abstract: An optical disc capable of suppressing vibration during read/write process includes an annular substrate, a coated layer, and a damping layer. The annular substrate includes a supporting portion and a recording portion, and a recording surface corresponding to the recording portion. The coated layer is formed on the recording surface. The damping layer is formed on the coated layer side of the annular substrate for increasing the response time to vibration of the optical disc. A method for fabricating the aforementioned optical disc is also disclosed.
    Type: Application
    Filed: October 22, 2006
    Publication date: May 3, 2007
    Applicants: PRINCO CORP., PRINCO AMERICA CORP.
    Inventors: Ting-Wei Yang, Sheng-Chih Wu