Patents by Inventor Ting-Wei Yeh

Ting-Wei Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode having an adhesive layer and a reflective layer and manufacturing method thereof
    Patent number: 7172909
    Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: February 6, 2007
    Assignee: Epistar Corporation
    Inventors: Wen-Huang Liu, Tzu-Feng Tseng, Min-Hsun Hsieh, Ting-Wei Yeh, Jen-Shui Wang
  • Light emitting diode having an adhesive layer and a reflective layer and manufacturing method thereof
    Patent number: 7009217
    Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
    Type: Grant
    Filed: October 27, 2004
    Date of Patent: March 7, 2006
    Assignee: Epistar Corporation
    Inventors: Wen-Huang Liu, Tzu-Feng Tseng, Min-Hsun Hsieh, Ting-Wei Yeh, Jen-Shui Wang
  • Light emitting diode having an adhesive layer and a reflective layer and manufacturing method thereof
    Patent number: 7008858
    Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: March 7, 2006
    Assignee: Epistar Corporation
    Inventors: Wen-Huang Liu, Tzu-Feng Tseng, Min-Hsun Hsieh, Ting-Wei Yeh, Jen-Shui Wang
  • Light emitting diode having an adhesive layer and a reflective layer
    Patent number: 6987287
    Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
    Type: Grant
    Filed: July 4, 2003
    Date of Patent: January 17, 2006
    Assignee: Epistar Corporation
    Inventors: Wen-Huang Liu, Tzu-Feng Tseng, Min-Hsun Hsieh, Ting-Wei Yeh, Jen-Shui Wang
  • Light emitting diode having an adhesive layer and a reflective layer and manufacturing method thereof
    Publication number: 20050077544
    Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
    Type: Application
    Filed: October 28, 2004
    Publication date: April 14, 2005
    Inventors: Wen-Huang Liu, Tzu-Feng Tseng, Min-Hsun Hsieh, Ting-Wei Yeh, Jen-Shui Wang
  • LIGHT EMITTING DIODE HAVING AN ADHESIVE LAYER AND A REFLECTIVE LAYER AND MANUFACTURING METHOD THEREOF
    Publication number: 20050079641
    Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
    Type: Application
    Filed: October 28, 2004
    Publication date: April 14, 2005
    Inventors: Wen-Huang Liu, Tzu-Feng Tseng, Min-Hsun Hsieh, Ting-Wei Yeh, Jen-Shui Wang
  • LIGHT EMITTING DIODE HAVING AN ADHESIVE LAYER AND A REFLECTIVE LAYER AND MANUFACTURING METHOD THEREOF
    Publication number: 20050077528
    Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
    Type: Application
    Filed: October 27, 2004
    Publication date: April 14, 2005
    Inventors: Wen-Huang Liu, Tzu-Feng Tseng, Min-Hsun Hsieh, Ting-Wei Yeh, Jen-Shui Wang
  • Light emitting diode having an adhesive layer
    Patent number: 6876005
    Abstract: A method for forming a light emitting diode includes forming a first stack, forming a second reaction layer over the first stack, forming a second stack, forming a first reaction layer over the second stack, and holding together the first reaction layer and the second reaction layer by means of a transparent adhesive layer. The transparent adhesive layer is formed between the first and second reaction layer, therefore the second reaction layer of the first stack will not come off the first reaction layer of the second stack.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: April 5, 2005
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Tzu-Feng Tseng, Wen-Huang Liu, Ting-Wei Yeh, Jen-Shui Wang
  • LIGHT EMITTING DIODE HAVING AN ADHESIVE LAYER AND A MANUFACTURING METHOD THEREOF
    Publication number: 20050014305
    Abstract: A method for forming a light emitting diode includes forming a first stack, forming a second reaction layer over the first stack, forming a second stack, forming a first reaction layer over the second stack, and holding together the first reaction layer and the second reaction layer by means of a transparent adhesive layer. The transparent adhesive layer is formed between the first and second reaction layer, therefore the second reaction layer of the first stack will not come off the first reaction layer of the second stack.
    Type: Application
    Filed: May 21, 2004
    Publication date: January 20, 2005
    Inventors: Min-Hsun Hsieh, Tzu-Feng Tseng, Wen-Huang Liu, Ting-Wei Yeh, Jen-Shui Wang
  • LIGHT EMITTING DIODE HAVING AN ADHESIVE LAYER AND A REFLECTIVE LAYER AND MANUFACTURING METHOD THEREOF
    Publication number: 20040104393
    Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
    Type: Application
    Filed: July 4, 2003
    Publication date: June 3, 2004
    Inventors: Wen-Huang Liu, Tzu-Feng Tseng, Min-Hsun Hsieh, Ting-Wei Yeh, Jen-Shui Wang
  • LIGHT EMITTING DIODE HAVING AN ADHESIVE LAYER AND A MANUFACTURING METHOD THEREOF
    Publication number: 20040106225
    Abstract: A method for forming a light emitting diode includes forming a first stack, forming a second reaction layer over the first stack, forming a second stack, forming a first reaction layer over the second stack, and holding together the first reaction layer and the second reaction layer by means of a transparent adhesive layer. The transparent adhesive layer is formed between the first and second reaction layer, therefore the second reaction layer of the first stack will not come off the first reaction layer of the second stack.
    Type: Application
    Filed: July 14, 2003
    Publication date: June 3, 2004
    Inventors: Min-Hsun Hsieh, Tzu-Feng Tseng, Wen-Huang Liu, Ting-Wei Yeh, Jen-Shui Wang