Patents by Inventor Ting-Xiao Liao

Ting-Xiao Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for Improving Performance of Etch Stop Layer
    Publication number: 20120256324
    Abstract: A method of forming an interconnect structure includes providing a dielectric layer; forming a metal line in the dielectric layer; and forming a composite etch stop layer (ESL), which includes forming a lower ESL over the metal line and the dielectric layer; and forming an upper ESL over the lower ESL. The upper ESL and the lower ESL have different compositions. The step of forming the lower ESL and the step of forming the upper ESL are in-situ performed.
    Type: Application
    Filed: June 20, 2012
    Publication date: October 11, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Miao-Cheng Liao, Huai-Tei Yang, Chung-Ren Sun, Jinn-Kwei Liang, Ting-Xiao Liao
  • Method for Improving Performance of Etch Stop Layer
    Publication number: 20100252930
    Abstract: A method of forming an interconnect structure includes providing a dielectric layer; forming a metal line in the dielectric layer; and forming a composite etch stop layer (ESL), which includes forming a lower ESL over the metal line and the dielectric layer; and forming an upper ESL over the lower ESL. The upper ESL and the lower ESL have different compositions. The step of forming the lower ESL and the step of forming the upper ESL are in-situ performed.
    Type: Application
    Filed: February 18, 2010
    Publication date: October 7, 2010
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Miao-Cheng Liao, Huai-Tei Yang, Chung-Ren Sun, Jinn-Kwei Liang, Ting-Xiao Liao