Patents by Inventor Ting Xue

Ting Xue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250075002
    Abstract: The present disclosure provides for multi-specific antibodies and antigen-binding fragments thereof that bind to human MUC1 and CD16A, pharmaceutical compositions comprising said antibodies, and use of the antibodies or the compositions for treating a disease, such as cancer.
    Type: Application
    Filed: September 6, 2024
    Publication date: March 6, 2025
    Applicant: BeiGene Switzerland GmbH
    Inventors: Hui LI, Qiansheng REN, Liang QU, Ming JIANG, Qi LIU, Xin CHEN, Yun CHEN, Liu XUE, Wenjie WANG, Jie PAN, Zhuo LI, Xiaoyan TANG, Chichi HUANG, Ting SHAO
  • Publication number: 20250075295
    Abstract: A high-performance sintered neodymium-iron-boron magnet and a preparation method therefor are provided. The magnet is prepared by means of diffusion heat treatment, using R1mFenBpM2w as a substrate and the alloy RHxM1yBz as a diffusion source. A detachable material reaction bucket is employed for diffusion. The diffusion source can be reused to reduce the production cost of the sintered neodymium-iron-boron magnet and can be applied to a magnet of a large size, and can in particular ensure mass production of a cost-effective sintered neodymium-iron-boron product with a thickness of 8-30 mm in an orientation direction.
    Type: Application
    Filed: July 20, 2022
    Publication date: March 6, 2025
    Inventors: Zhiqiang LI, Ting ZHANG, Nan ZHAO, Lingwen XUE
  • Publication number: 20250059061
    Abstract: An iron-carbon composite material, a preparation method therefor, and an application thereof related to microbial technology applications. The method includes the following steps: a cross-linking and curing step: carrying out cross-linking and curing to iron powder and biological activated carbon by using an alkaline earth metal salt and a cross-linking agent; and a mineralization treatment step: soaking the cross-linked and cured iron-carbon composite material in a mineralization bacteria solution for 5-15 min, and carrying out drying to obtain an iron-carbon composite material.
    Type: Application
    Filed: December 28, 2021
    Publication date: February 20, 2025
    Applicant: BCEG ENVIRONMENT REMEDIATION CO., LTD
    Inventors: Shupeng LI, Lili GUO, Ting QU, Yaru LIU, Jiachen LI, Yong WANG, Qi WANG, Jing XIONG, Jinmei XUE
  • Patent number: 12203224
    Abstract: The present invention discloses an assembled bamboo sleeper, which is obtained by using a bamboo unit as a raw material, dried and modified at the temperature of 110-180° C., undergone coating treatment using a dopamine solution, adhesive dipping, curing and solidifying, assembling and gluing, further solidifying, further treatment using a dopamine solution, and anti-mildew and/or anti-corrosion and/or anti-insect treatment, and then fastened. The present invention further provides a preparation method for the foregoing bamboo sleeper. The bamboo sleeper prepared in the present invention is green and environmentally friendly, and applicable for ballasted tracks of railways and urban rail transit systems.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: January 21, 2025
    Assignee: HUNAN TAOHUAJIANG BAMBOO SCIENCE & TECHNOLOGY CO., LTD.
    Inventors: Jinbo Hu, Jian Peng, Weihong Zeng, Yanhui Xiong, Diqin Liu, Zhicheng Xue, Xianjun Li, Zhiping Wu, Shanshan Chang, Gonggang Liu, Ting Li
  • Publication number: 20250015054
    Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.
    Type: Application
    Filed: September 18, 2024
    Publication date: January 9, 2025
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chi-Ching HO, Bo-Hao MA, Yu-Ting XUE, Ching-Hung TSENG, Guan-Hua LU, Hong-Da CHANG
  • Patent number: 12125828
    Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.
    Type: Grant
    Filed: September 11, 2023
    Date of Patent: October 22, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chi-Ching Ho, Bo-Hao Ma, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang
  • Patent number: 11923337
    Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: March 5, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chi-Ching Ho, Bo-Hao Ma, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang
  • Publication number: 20230420420
    Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.
    Type: Application
    Filed: September 11, 2023
    Publication date: December 28, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chi-Ching HO, Bo-Hao MA, Yu-Ting XUE, Ching-Hung TSENG, Guan-Hua LU, Hong-Da CHANG
  • Patent number: 11036978
    Abstract: The present invention provides a method for separating out a defect image from a thermogram sequence based on weighted naive Bayesian classifier and dynamic multi-objective optimization, we find that different kinds of TTRs have big differences in some physical quantities. The present invention extracts these features (physical quantities) and classifies the selected TTRs into K categories based on their feature vectors through a weighted naive Bayesian classifier, which deeply digs the physical meanings contained in each TTR, makes the classification of TTRs more rational, and improves the accuracy of defect image's separation. Meanwhile, the multi-objective function does not only fully consider the similarities between the RTTR and other TTRs in the same category, but also considers the dissimilarities between the RTTR and the TTRs in other categories, thus the RTTR selected is more representative, which guarantees the accuracy of describing the defect outline.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 15, 2021
    Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Chun Yin, Yuhua Cheng, Ting Xue, Xuegang Huang, Haonan Zhang, Kai Chen, Anhua Shi
  • Patent number: 10970132
    Abstract: A system for resolving a resource deadlock between processes. A shared data structure is maintained that includes process records of the processes. Process states and process priorities are defined for each of the processes. A respective state of the process is determined for each process based on the process states and process priorities of the process records maintained in the shared data structure. The respective state is used to allocate and deallocate resources to the process to mitigate and resolve the resource deadlock between the processes.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: April 6, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Lior Aronovich, Michael Feiman, Ting Xue
  • Patent number: 10938901
    Abstract: A computer-implemented method according to one embodiment includes identifying a request to create a consumer within a converged system, defining the consumer within a hierarchy of consumers, where the consumer represents a function in an organization, setting a storage capacity attribute for the consumer, and conditionally defining a data volume for the consumer, based at least in part on the storage capacity attribute.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: March 2, 2021
    Assignee: International Business Machines Corporation
    Inventors: Lior Aronovich, Shijie Che, Jordan J. Keon, Ting Xue
  • Patent number: 10846841
    Abstract: The present invention provides a method for separating out a defect image from a thermogram sequence based on feature extraction and multi-objective optimization, we find that different kinds of TTRs have big differences in some physical quantities, such as the energy, temperature change rate during endothermic process, temperature change rate during endothermic process, average temperature, maximum temperature. The present invention extract these features (physical quantities) and cluster the selected TTRs into L clusters based on their feature vectors, which deeply digs the physical meanings contained in each TTR, makes the clustering more rational, and improves the accuracy of defect separation. Meanwhile, the present invention creates a multi-objective function to select a RTTR for each cluster based on multi-objective optimization.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: November 24, 2020
    Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Yuhua Cheng, Chun Yin, Haonan Zhang, Xuegang Huang, Ting Xue, Kai Chen, Yi Li
  • Publication number: 20200350285
    Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.
    Type: Application
    Filed: August 29, 2019
    Publication date: November 5, 2020
    Inventors: Chi-Ching Ho, Bo-Hao Ma, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang
  • Publication number: 20200301755
    Abstract: A system for resolving a resource deadlock between processes. A shared data structure is maintained that includes process records of the processes. Process states and process priorities are defined for each of the processes. A respective state of the process is determined for each process based on the process states and process priorities of the process records maintained in the shared data structure. The respective state is used to allocate and deallocate resources to the process to mitigate and resolve the resource deadlock between the processes.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 24, 2020
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Lior ARONOVICH, Michael FEIMAN, Ting XUE
  • Patent number: 10768986
    Abstract: A computer-implemented method according to one embodiment includes identifying a request to create a consumer within a converged system. Additionally, the method includes defining the consumer within a hierarchy of consumers, where the consumer represents a function in an organization. Further, the method includes associating the consumer with a plurality of storage resources and a plurality of computing resources. Further still, the method includes setting a storage capacity attribute for the consumer.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: September 8, 2020
    Assignee: International Business Machines Corporation
    Inventors: Lior Aronovich, Stephen Ronald Haertel, Kiran Mantripragada, Ting Xue
  • Publication number: 20190228221
    Abstract: A method for separating out a defect image from a thermogram sequence based on weighted naive Bayesian classifier and dynamic multi-objective optimization. A method extracts these features and classifies the selected TTRs into K categories based on their feature vectors through a weighted naive Bayesian classifier, which deeply digs the physical meanings contained in each TTR, makes the classification of TTRs more rational, and improves the accuracy of defect image's separation. Meanwhile, the multi-objective function does not only fully consider the similarities between the RTTR and other TTRs in the same category, but also considers the dissimilarities between the RTTR and the TTRs in other categories, thus the RTTR selected is more representative, which guarantees the accuracy of describing the defect outline.
    Type: Application
    Filed: March 29, 2019
    Publication date: July 25, 2019
    Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Chun YIN, Yuhua CHENG, Ting XUE, Xuegang HUANG, Haonan ZHANG, Kai CHEN, Anhua SHI
  • Publication number: 20190228517
    Abstract: The present invention provides a method for separating out a defect image from a thermogram sequence based on feature extraction and multi-objective optimization, we find that different kinds of TTRs have big differences in some physical quantities, such as the energy, temperature change rate during endothermic process, temperature change rate during endothermic process, average temperature, maximum temperature. The present invention extract these features (physical quantities) and cluster the selected TTRs into L clusters based on their feature vectors, which deeply digs the physical meanings contained in each TTR, makes the clustering more rational, and improves the accuracy of defect separation. Meanwhile, the present invention creates a multi-objective function to select a RTTR for each cluster based on multi-objective optimization.
    Type: Application
    Filed: March 29, 2019
    Publication date: July 25, 2019
    Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
    Inventors: Yuhua CHENG, Chun YIN, Haonan ZHANG, Xuegang HUANG, Ting XUE, Kai CHEN, Yi LI
  • Patent number: 10162684
    Abstract: Embodiments of the present invention relate to CPU resource management in a computer cluster. A master node selects a CPU core of at least one compute node for an application from a computer cluster, and allocates a portion of resource of the CPU core to the application. The master node re-allocates a new portion of the resource of the CPU core to the application, in response to a trigger event for re-allocation.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: December 25, 2018
    Assignee: International Business Machines Corporation
    Inventors: Kuan Feng, Fan Jie Meng, Heng Ping Xu, Ting Xue
  • Publication number: 20180196700
    Abstract: A computer-implemented method according to one embodiment includes identifying a request to create a consumer within a converged system. Additionally, the method includes defining the consumer within a hierarchy of consumers, where the consumer represents a function in an organization. Further, the method includes associating the consumer with a plurality of storage resources and a plurality of computing resources. Further still, the method includes setting a storage capacity attribute for the consumer.
    Type: Application
    Filed: January 6, 2017
    Publication date: July 12, 2018
    Inventors: Lior Aronovich, Stephen Ronald Haertel, Kiran Mantripragada, Ting Xue
  • Publication number: 20180198861
    Abstract: A computer-implemented method according to one embodiment includes identifying a request to create a consumer within a converged system, defining the consumer within a hierarchy of consumers, where the consumer represents a function in an organization, setting a storage capacity attribute for the consumer, and conditionally defining a data volume for the consumer, based at least in part on the storage capacity attribute.
    Type: Application
    Filed: January 11, 2017
    Publication date: July 12, 2018
    Inventors: Lior Aronovich, Shijie Che, Jordan J. Keon, Ting Xue