Patents by Inventor Ting-Ya CHANG

Ting-Ya CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240085797
    Abstract: A method of controlling an extreme ultraviolet (EUV) lithography system is disclosed. The method includes irradiating a target droplet with EUV radiation, detecting EUV radiation reflected by the target droplet, determining aberration of the detected EUV radiation, determining a Zernike polynomial corresponding to the aberration, and performing a corrective action to reduce a shift in Zernike coefficients of the Zernike polynomial.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Ya CHENG, Han-Lung CHANG, Shi-Han SHANN, Li-Jui CHEN, Yen-Shuo SU
  • Publication number: 20240088023
    Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Shao-Kuan LEE, Kuang-Wei YANG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Shau-Lin SHUE
  • Patent number: 11923243
    Abstract: A method for manufacturing a semiconductor structure includes preparing a dielectric structure formed with trenches respectively defined by lateral surfaces of the dielectric structure, forming spacer layers on the lateral surfaces, filling an electrically conductive material into the trenches to form electrically conductive features, selectively depositing a blocking layer on the dielectric structure, selectively depositing a dielectric material on the electrically conductive features to form a capping layer, removing the blocking layer and the dielectric structure to form recesses, forming sacrificial features in the recesses, forming a sustaining layer to cover the sacrificial features; and removing the sacrificial features to obtain the semiconductor structure formed with air gaps confined by the sustaining layer and the spacer layers.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue, Hsiao-Kang Chang
  • Publication number: 20140099425
    Abstract: A method is proposed for fabricating small-scale, curved structures. Firstly, a calligraphy paper or filter paper is provided. Liquid-phase material droplets are applied to calligraphy paper or filter paper to form a desired pattern at a contact angle that can form convex curved small-scale structures.
    Type: Application
    Filed: September 17, 2013
    Publication date: April 10, 2014
    Applicant: National Tsing Hua University
    Inventors: Ting-Ya Chang, Chao-Min Cheng, Kuan-Hung Chen
  • Publication number: 20140097560
    Abstract: A method is proposed for fabricating small-scale, curved, polymeric structures. Firstly, desired patterns are created from droplets of photocurable PDMS after using ink or wax to create the desired patterns on a flexible material such as papers or plastic films. The photocurable PDMS droplets are then activated by UV light to form a small-scale polymeric mold. Next, polymeric curved structures can be obtained at millimeter scale by casting and curing thermocurable PDMS on the mold.
    Type: Application
    Filed: January 28, 2013
    Publication date: April 10, 2014
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Ting-Ya CHANG, Chao-Min CHENG