Patents by Inventor Ting-Yao Hung

Ting-Yao Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11177191
    Abstract: An independent loading mechanism for use with a CPU connector includes a metallic frame cooperating with a back plate module to sandwich a printed circuit board therebetween. A plurality of screw nut units are provided around the four corners of the frame. A plurality of hollow spacers are secured to the corresponding through holes of the frame so as to allow the corresponding screw nut units moveable relative to the frame along the vertical direction within a range larger than a thickness of the frame, thus avoiding improper interference between the screw nut units and the corresponding screw posts of the back plate module during sequential screwing.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: November 16, 2021
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Shan-Yong Cheng, Fang-Jwu Liao, Ting-Yao Hung
  • Publication number: 20200381333
    Abstract: An independent loading mechanism for use with a CPU connector includes a metallic frame cooperating with a back plate module to sandwich a printed circuit board therebetween. A plurality of screw nut units are provided around the four corners of the frame. A plurality of hollow spacers are secured to the corresponding through holes of the frame so as to allow the corresponding screw nut units moveable relative to the frame along the vertical direction within a range larger than a thickness of the frame, thus avoiding improper interference between the screw nut units and the corresponding screw posts of the back plate module during sequential screwing.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 3, 2020
    Inventors: SHAN-YONG CHENG, FANG-JWU LIAO, TING-YAO HUNG
  • Patent number: 8894422
    Abstract: An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: November 25, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Nan-Hung Lin, Andrew Cheng, Chih-Pi Cheng, Shuo-Hsiu Hsu, Ting-Yao Hung
  • Publication number: 20120028502
    Abstract: An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.
    Type: Application
    Filed: October 12, 2011
    Publication date: February 2, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-CHI YEH, NAN-HUNG LIN, ANDREW CHENG, CHIH-PI CHENG, SHUO-HSIU HSU, TING-YAO HUNG
  • Patent number: 8052434
    Abstract: A socket connector configured with an insulative housing defining a mating interface surrounded with peripheral walls and a mounting surface is disclosed. A plurality of passageways is defined between the mating interface and the mounting surface and having an opening at the mounting surface. The insulative housing includes an encampment associated with each of the passageway at the mounting surface, and includes an extension crossing over an inner wall of the passageway to substantially narrow the opening of the opening. The socket connector furthers includes a plurality of contact terminals each received in the passageway and further includes a curvilinear solder portion extending beyond the mounting surface. And the socket connector further is incorporated with a plurality of solder balls each disposed between the encampment and the curvilinear solder portion.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: November 8, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Chi Yeh, Nan-Hung Lin, Andrew Cheng, Chih-Pi Cheng, Ting-Yao Hung
  • Patent number: 8033839
    Abstract: A socket connector is configured with an insulative housing defining a mating interface surrounded with peripheral walls and a mounting surface. A plurality of passageways is defined between the mating interface and the mounting surface and having an opening at the mounting surface. The insulative housing includes an encampment associated with each of the passageway at the mounting surface, and includes an extension crossing over an inner wall of the passageway to substantially narrow the opening of the opening. The socket connector furthers includes a plurality of contact terminals each received in the passageway and further includes a curvilinear solder portion extending beyond the mounting surface. And the socket connector further is incorporated with a plurality of solder balls each disposed between the encampment and the curvilinear solder portion.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: October 11, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Cheng-Chi Yeh, Nan-Hung Lin, Andrew Cheng, Ting-Yao Hung
  • Publication number: 20110008979
    Abstract: Disclosed herewith a socket connector configured with an insulative housing defining a mating interface surrounded with peripheral walls and a mounting surface. A plurality of passageways is defined between the mating interface and the mounting surface and having an opening at the mounting surface. The insulative housing includes an encampment associated with each of the passageway at the mounting surface, and includes an extension crossing over an inner wall of the passageway to substantially narrow the opening of the opening. The socket connector furthers includes a plurality of contact terminals each received in the passageway and further includes a curvilinear solder portion extending beyond the mounting surface. And the socket connector further is incorporated with a plurality of solder balls each disposed between the encampment and the curvilinear solder portion.
    Type: Application
    Filed: August 10, 2010
    Publication date: January 13, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-CHI YEH, NAN-HUNG LIN, ANDREW CHENG, TING-YAO HUNG
  • Publication number: 20100267257
    Abstract: Disclosed herewith a socket connector configured with an insulative housing defining a mating interface surrounded with peripheral walls and a mounting surface. A plurality of passageways is defined between the mating interface and the mounting surface and having an opening at the mounting surface. The insulative housing includes an encampment associated with each of the passageway at the mounting surface, and includes an extension crossing over an inner wall of the passageway to substantially narrow the opening of the opening. The socket connector furthers includes a plurality of contact terminals each received in the passageway and further includes a curvilinear solder portion extending beyond the mounting surface. And the socket connector further is incorporated with a plurality of solder balls each disposed between the encampment and the curvilinear solder portion.
    Type: Application
    Filed: April 20, 2010
    Publication date: October 21, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-CHI YEH, NAN-HUNG LIN, ANDREW CHENG, CHIH-PI CHENG, TING-YAO HUNG
  • Patent number: D719099
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Ting-Yao Hung, Albert Harvey Terhune, IV
  • Patent number: D719100
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Ting-Yao Hung, Albert Harvey Terhune, IV