Patents by Inventor Ting-Yen WANG

Ting-Yen WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240169215
    Abstract: A system includes a processor and a memory storing software code and a machine learning (ML) model. The software code is executed to receive contextual data samples each including raw data and a descriptive label, for each contextual data sample: search a database for a data pattern matching the raw data, determine, when the data pattern is detected, whether the data pattern is correlated with an anomalous event, and generate, when the correlation is determined, training data including a label identifying the anomalous event, and the raw data, the data pattern, or both, to provide one of multiple training data samples, wherein the training data samples describe anomalous events corresponding respectively to the raw data, the data pattern, or both. The software code is further executed to train the ML model, using the training data samples, to provide a trained predictive ML model configured to predict the anomalous events.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 23, 2024
    Inventors: Thiago Borba Onofre, Michael Tschanz, Brian F. Walters, Chun Sum Yeung, Ting-Yen Wang, Amber E. Weyand
  • Patent number: 11600612
    Abstract: A switch chip includes a first switch device, a first ESD protection device and a second ESD protection device. The first switch device is electrically coupled between a first pad and a second pad. The first ESD protection device is electrically coupled to a third pad which is electrically coupled to the first pad by a first bond wire. The second ESD protection device is electrically coupled to a fourth pad which is electrically coupled to the second pad by a second bond wire.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: March 7, 2023
    Assignee: VIA LABS, INC.
    Inventors: Didmin Shih, Tengyi Huang, Ting-Yen Wang, Yen Wei Wu
  • Publication number: 20220199612
    Abstract: A switch chip includes a first switch device, a first ESD protection device and a second ESD protection device. The first switch device is electrically coupled between a first pad and a second pad. The first ESD protection device is electrically coupled to a third pad which is electrically coupled to the first pad by a first bond wire. The second ESD protection device is electrically coupled to a fourth pad which is electrically coupled to the second pad by a second bond wire.
    Type: Application
    Filed: April 19, 2021
    Publication date: June 23, 2022
    Inventors: Didmin SHIH, Tengyi HUANG, Ting-Yen WANG, Yen Wei WU