Abstract: A heat-shrinkable polyester film made of a polyester-forming resin composition includes a recycled material, and has an exothermic crystallization peak and an endothermic melting peak which are determined via differential scanning calorimetry, and which satisfy relationships of T2?T1?68° C. and T3?T2?78° C., where T1 represents an onset point of the exothermic crystallization peak, T2 represents an end point of the exothermic crystallization peak and an onset point of the endothermic melting peak, and T3 represents an end point of the endothermic melting peak. A method for manufacturing the heat-shrinkable polyester film is also disclosed.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: A capacitor capable of releasing reactive oxygen species and reactive nitrogen species after powering of claim 1 is composed of the dielectric material. A plurality of through holes are designed on the capacitor, the through holes being used as air gaps to supply plasma gas and blow a fan to increase the gas flow, and the voltage being connected to the two corresponding electrode edges of the capacitor so that the capacitor generating a heating temperature (lower than 200 degrees Celsius). Thereby, after the capacitor is perforated to form honeycomb shape and powered, the air surrounding the capacitor flowing through the capacitor is ionized to the oxygen ion and nitrogen ion via heating and charge-discharge, generates plasma at room temperature and atmospheric pressure and releases the reactive oxygen ions and reactive nitrogen ions healing and helpful for body healing.

Abstract: Provided are monospecific and bispecific proteins that bind specifically to OX40 and/or PD-L1. Exemplary proteins release the inhibition through PD-L1 and stimulate T cell through OX40. Exemplary polyvalent proteins comprise at least one OX40 binding site and at least one PD-L1 binding site. In certain embodiments, the binding sites may be linked through an immunoglobulin constant region. Anti-OX40 and anti-PD-L1 antibodies are also provided.

Abstract: Provided are monospecific and bispecific proteins that bind specifically to OX40 and/or PD-L1. Exemplary proteins release the inhibition through PD-L1 and stimulate T cell through OX40. Exemplary polyvalent proteins comprise at least one OX40 binding site and at least one PD-L1 binding site. In certain embodiments, the binding sites may be linked through an immunoglobulin constant region. Anti-OX40 and anti-PD-L1 antibodies are also provided.

Abstract: Provided are monospecific and bispecific proteins that bind specifically to OX40 and/or PD-L1. Exemplary proteins release the inhibition through PD-L1 and stimulate T cell through OX40. Exemplary polyvalent proteins comprise at least one OX40 binding site and at least one PD-L1 binding site. In certain embodiments, the binding sites may be linked through an immunoglobulin constant region. Anti-OX40 and anti-PD-L1 antibodies are also provided.

Abstract: Disclosed is a dual inline memory module with temperature-sensing scenario modes. A plurality of volatile memory components and an EEPROM component are disposed on a module board. A plurality of LED components and a scenario-lighting controller are disposed at a radiant side of the module board. A light bar is located at the radiant side of the module board without direct installing relationship. A plurality of clamping-type heat spreaders are fastened to one another in a manner that the light bar is tightly clamped. Therein, the power of the scenario-lighting controller component is shared and linked with the power supply system of the LED components and the signals of the scenario-lighting controller component are shared and linked with the signal connection system of the EEPROM component.

Abstract: Disclosed is a dual inline memory module with temperature-sensing scenario modes. A plurality of volatile memory components and an EEPROM component are disposed on a module board. A plurality of LED components and a scenario-lighting controller are disposed at a radiant side of the module board. A light bar is located at the radiant side of the module board without direct installing relationship. A plurality of clamping-type heat spreaders are fastened to one another in a manner that the light bar is tightly clamped. Therein, the power of the scenario-lighting controller component is shared and linked with the power supply system of the LED components and the signals of the scenario-lighting controller component are shared and linked with the signal connection system of the EEPROM component.

Abstract: The present invention provides a casing used for electronic device and server for computing, wherein the server including a casing and a circuit board, and the casing including a casing body and a carrier mechanism. The casing body has an internal space, and the carrier mechanism including a carrier unit and a fastening unit, wherein the carrier unit is disposed in the internal space and it carries the circuit board. The fastening unit is disposed on the terminal of the carrier unit, wherein the fastening unit has a handle. One terminal of the handle is pivoted on the carrier unit, and the other terminal has a fastening element, which is for the use of fastening on the casing body. The present invention can shorten the time spending on replacing the electronic components by using the casing used for electronic device so as to facilitate the users.