Abstract: A wrist-worn electronic device configured to transmit and receive wireless signals in two frequency bands comprises a bezel loop antenna, first and second signal processing elements, a diplexer, and a tuning element. The bezel loop antenna has a first impedance and is configured to wirelessly receive first and second electronic signals simultaneously. The first and second signal processing elements process the first electronic signal having a frequency in a first frequency band and the second electronic signal having a frequency in a second frequency band. The diplexer is configured to receive the first and second electronic signals and output the first electronic signal to the first signal processing element and the second electronic signal to the second signal processing element. The tuning element has a second impedance causing the bezel loop antenna to wirelessly receive electronic signals in the first frequency band and electronic signals in the second frequency band.

Abstract: A wrist-worn electronic device configured to transmit and receive wireless signals in two frequency bands comprises a bezel loop antenna, first and second signal processing elements, a diplexer, and a tuning element. The bezel loop antenna has a first impedance and is configured to wirelessly receive first and second electronic signals simultaneously. The first and second signal processing elements process the first electronic signal having a frequency in a first frequency band and the second electronic signal having a frequency in a second frequency band. The diplexer is configured to receive the first and second electronic signals and output the first electronic signal to the first signal processing element and the second electronic signal to the second signal processing element. The tuning element has a second impedance causing the bezel loop antenna to wirelessly receive electronic signals in the first frequency band and electronic signals in the second frequency band.

Abstract: A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers.

Abstract: A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers.

Abstract: A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers.

Abstract: A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers.