Abstract: The invention provides a circuit substrate and a package structure. The circuit substrate includes a molding compound having a chip-side surface and a solder ball-side surface opposite from the chip side surface. A first conductive bulk is formed embedded in the molding compound. The first conductive bulk has a first number of first chip-side bond pad surfaces and a second number of first solder ball-side surfaces exposed from the chip side surface and the ball-side surface, respectively. The width of the first conductive bulk is greater than the first width of the first chip-side bond pad surfaces and the second width of the first solder ball-side surfaces.

Abstract: The invention provides a circuit substrate and a package structure. The circuit substrate includes a molding compound having a chip-side surface and a solder ball-side surface opposite from the chip side surface. A first conductive bulk is formed embedded in the molding compound. The first conductive bulk has a first number of first chip-side bond pad surfaces and a second number of first solder ball-side surfaces exposed from the chip side surface and the ball-side surface, respectively. The width of the first conductive bulk is greater than the first width of the first chip-side bond pad surfaces and the second width of the first solder ball-side surfaces.

Abstract: The present invention relates to an inflatable bag for bottles packaging. The bag consists of a pair of connecting unit located at each edge of predetermined gas pocket unit. The connecting unit consists of one vertical and one horizontal welding line forming H shape. The outer edges on the H shape are cut to form U shape breaches. After inflation, due to the stress relief effect of the breaches, the outer part of the gas pocket units beyond the horizontal welding line forms top and bottom sides of cylindrical spaces suitable for containing and protecting cylindrical bottle or can from mechanical impact. One or more pair of connecting unit can be constructed so that plural cylindrical space can be formed to contain and protect plural cylindrical bottles or cans from broken during shipping and handling.