Patents by Inventor Ting-Yu KANG

Ting-Yu KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Particle reduction in semiconductor fabrication
    Patent number: 11043405
    Abstract: A method includes transferring a wafer from a process chamber onto a plurality of robotic fingers outside the process chamber, elevating a wafer chuck until reaching the wafer, applying a first suction force to the wafer using a vacuum hole on the wafer chuck, and applying a second suction force toward the wafer using a porous pipe around the wafer chuck.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: June 22, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Ting-Yu Kang
  • PARTICLE REDUCTION IN SEMICONDUCTOR FABRICATION
    Publication number: 20200312700
    Abstract: A method includes transferring a wafer from a process chamber onto a plurality of robotic fingers outside the process chamber, elevating a wafer chuck until reaching the wafer, applying a first suction force to the wafer using a vacuum hole on the wafer chuck, and applying a second suction force toward the wafer using a porous pipe around the wafer chuck.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 1, 2020
    Inventor: Ting-Yu KANG