Abstract: A server system includes a rack, servers disposed in the rack and a heat dissipation module including a pump assembly, a main manifold assembly, heat exchange assemblies and a sub manifold assembly. The pump assembly is disposed in the rack. The main manifold assembly includes two main pipelines, one is connected to a main outlet of the pump assembly and inlets of the servers, and the other is connected to outlets of the servers and a main inlet of the pump assembly. The heat exchange assemblies are removably disposed in the rack. The sub manifold assembly includes two sub pipelines, one is connected to a sub outlet of the pump assembly and inlets of the heat exchange assemblies, and the other is connected to outlets of the heat exchange assemblies and a sub inlet of the pump assembly.

Abstract: An immersion cooling system includes a work tank, a buffer tank, and a communication control assembly. The work tank has a work-tank gas-phase region and a work-tank liquid-phase region. The buffer tank has a buffer-tank gas-phase region and a buffer-tank liquid-phase region. The communication control assembly includes a first pipeline, a first pump, a second pipeline, and a second valve. In response to that the first pump is actuated, through the first pipeline, a fluid of the work-tank liquid-phase region is transported to the buffer-tank liquid-phase region, or a fluid of the buffer-tank liquid-phase region is transported to the work-tank liquid-phase region. In response to that the second valve is actuated, through the second pipeline, the work-tank gas-phase region is selectively in communication with the buffer-tank gas-phase region.

Abstract: A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Abstract: A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: A method for cooling electronic components includes: causing a flow of a portion of a cooling liquid from a cooling chamber through an electro-filtration device, in which the cooling chamber is configured to enable a thermal exchange between one or more electronic components and the cooling liquid housed in the cooling chamber; filtering at least a portion of the cooling liquid through the electro-filtration device, which is configured to apply one or more electric fields on the portion of the cooling liquid, the electro-filtration device having electrodes for providing the one or more electric fields while the portion of the cooling liquid flows through at least some of the one or more electric fields to result in a filtered cooling liquid; and causing a flow of the filtered cooling liquid from the electro-filtration device to the cooling chamber.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: A separate immersion cooling system includes a separate immersion cooling device. The separate immersion cooling device includes a condensing device, a plurality of cooling tanks, a plurality of outflow pipes and a plurality of return pipes. The separate immersion cooling device is adapted to cooling a heat-generating device immersed in the cooling tank.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: The invention provides an immersion fluid module including a tank, a heat exchanger, a condenser, and at least one pipe. The tank contains a first fluid. An electronic device is disposed in the tank and is at least partially immersed in the first fluid in a liquid state. The heat exchanger is disposed in the tank and is at least partially immersed in the first fluid in the liquid state. The condenser is disposed in the tank. The pipe connects the heat exchanger and the condenser. A second fluid is provided to the pipe, and a temperature of the second fluid is higher than a preset value. When an ambient temperature of the electronic device is lower than the preset value, the second fluid flows through the heat exchanger to raise the ambient temperature of the electronic device. The invention also provides a server system.

Abstract: An immersion cooling system includes a work tank, a chip device, a microchannel device, a first communication pipeline, and a first heat exchange device. The work tank includes a fluid section. The chip device is in the fluid section and has an inlet and an outlet. The chip device includes a motherboard, a chip, and a cover. The motherboard has a main surface substantially parallel to a vertical line. The cover is on the motherboard. The chip is between the cover and the motherboard. The microchannel device is in the chip device. Two ends of the microchannel device are respectively in communication with the inlet and the outlet. The first communication pipeline and the first heat exchange device are in the fluid section. Two ends of the first communication pipeline are respectively in communication with the outlet and the first heat exchange device.

Abstract: A piece of immersion liquid cooling equipment, which is adapted for an electronic device, includes a tank, a condenser, a cold plate, and a first pipe. The tank accommodates a first fluid, and the electronic device is immersed in the first fluid in the form of a liquid. The condenser is disposed in the tank and located above the first fluid in the form of a liquid. The cold plate is disposed in the tank and is in thermal contact with at least one high power commodity of the electronic device. The first pipe is disposed and extends between an exterior and an interior of the tank. The first pipe communicates with the condenser and the cold plate. The first pipe is configured to receive a second fluid to flow through the condenser and the cold plate. A heat dissipation method for an electronic device.

Abstract: An immersion cooling system including a cooling tank, an immersion unit, a plurality of piezoelectric units, and a piezoelectric driver is provided. The cooling tank has a receiving portion. The immersion unit is in the receiving portion and the immersion unit includes a boiler plate. One or more channels are between the piezoelectric units, and the at least one channel is in communication with the boiler plate. The piezoelectric driver is for driving each of the piezoelectric units to generate a deformation.

Abstract: An immersion cooling system includes a cooling tank, an immersion unit, a first disturbing element, and a first maintaining element. The cooling tank has a receiving portion. The immersion unit is in the receiving portion, and the immersion unit includes a boiler plate. The first disturbing element has a first convex surface. The first maintaining element maintains the first disturbing element to allow a convex direction of the first convex surface towards the boiler plate, and a first predetermined distance is between the first convex surface and the boiler plate.

Abstract: An immersion cooling system including a cooling tank, an immersion unit, and a baffle assembly is provided. The cooling tank has a receiving portion. The immersion unit is in the receiving portion and includes a boiler plate. The baffle assembly divides the receiving portion into an inner upper portion, an inner lower portion, and a peripheral portion. The boiler plate is in the inner lower portion, and a width of the inner upper portion is less than or equal to a width of the boiler plate.

Abstract: A flow dividing device including a box body and a baffle set is provided. The box body includes a chamber, an inflow port, and an outflow port. The baffle set is located in the chamber and divides the chamber into a plurality of guide channels, and two ends of the guide channel communicate with the inflow port and the outflow port respectively. After flowing into the flow dividing device, the condensate fluid can guide different liquids in the condensate fluid to separate from each other. An immersion cooling system including the flow dividing device and a fluid separation method of the immersion cooling system are also provided.

Abstract: A separate immersion cooling system includes a separate immersion cooling device. The separate immersion cooling device includes a condensing device, a plurality of cooling tanks, a plurality of outflow pipes and a plurality of return pipes. The separate immersion cooling device is adapted to cooling a heat-generating device immersed in the cooling tank.

Abstract: An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.

Abstract: A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.