Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.

Abstract: A method is provided, and including operations as below: forming multiple active areas extending in a first direction; forming multiple conductive patterns extending in a second direction different from the first direction and arranged in a first layer above the active areas; forming multiple gates extending parallel to the conductive patterns; and forming a first set of conductive lines extending in the first direction and arranged in three first metal tracks that are in a second layer above the first layer, wherein one of the first set of conductive lines is arranged in a middle track of the three first metal tracks, coupled to one of the gates and overlap a first shallow trench region between two of the active areas.

Abstract: Magnetic coupling mechanisms for robotic arm end effectors are disclosed. In particular, a magnetic coupling mechanism couples a detachable tool, such as a suction gripper, to a tool changer base of a robotic arm tool of an end effector. Magnetic coupling between the robotic arm tool and the detachable tool allows for breakaway when a sufficient force is applied to the robotic arm tool and/or the detachable tool to separate the two. The decoupling may be achieved via a tool rack. An exemplary system for coupling a detachable tool to a motion device includes a first magnetic ring affixed to a distal end of the motion device, where an inside of the first magnetic ring forms a first hollow chamber; and a second magnetic ring affixed to a proximal end of the detachable tool, where an inside of the detachable tool forms a second hollow chamber.

Abstract: Circuits, methods, and systems are provided which facilitate testing of asynchronous circuits having one or more global or local feedback loops. A circuit includes a data path and a scan path. The data path has an input configured to receive a data input signal, and a first output. The scan path includes a first multiplexer having a first input configured to receive the data input signal, a latch coupled to an output of the first multiplexer, a scan isolator coupled to an output of the latch, and a second multiplexer having a first input coupled to the first output of the data path and a second input coupled to an output of the scan isolator. The second multiplexer is configured to output a data output signal.

Abstract: A semiconductor device includes a semiconductor layered structure, an electrode unit, and an anti-adsorption layer. The electrode unit is disposed on an electrode connecting region of the semiconductor layered structure, and is a multi-layered structure. The anti-adsorption layer is disposed on a top surface of the electrode unit opposite to the semiconductor layered structure. Also disclosed herein is a light-emitting system including the semiconductor device.

Abstract: An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.

Abstract: An immersion cooling system includes a box body, a condensing structure and a pressure adjusting module. The box body has a first containing space, the first containing space is adapted to contain a heat dissipation medium, and at least one heat generating component is disposed in the first containing space to be immersed in the heat dissipation medium which is in liquid state. The condensing structure is disposed in the first containing space and above the heat dissipation medium which is in liquid state. The pressure adjusting module is adapted to actively drive a liquid in the first containing space to flow into the second containing space, such that a pressure in the first containing space is reduced to be less than an external pressure. In addition, an electronic apparatus having the immersion cooling system and a pressure adjusting module are also provided.

Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

Abstract: An ultrasound-detectable marker, ultrasound system, and methods for monitoring vascular flow and patency is disclosed. The ultrasound-detectable marker comprises one or more resorbable polymers, one or more non-resorbable polymers, one or more non-polymeric materials, or any combinations thereof. The ultrasound-detectable marker is adapted for placement underneath, adjacent to, or above one or more vessels at a postoperative site, such as a vascular anastomosis site. Further, the ultrasound imaging system includes certain user guiding software and/or health analysis software for use with the ultrasound-detectable marker.

Abstract: Disclosed herein is a composition that includes Lactobacillus plantarum LP28 deposited at the China General Microbiological Culture Collection Center (CGMCC) under an accession number CGMCC 3346, and Streptococcus thermophilus ST30 deposited at Deutsche Sammlung von Mikroorganismen und Zellkulturen GmbH under an accession number DSM 32788. Also disclosed herein are an animal feed comprising the composition, and a method for improving pork quality, which comprises administering to a pig the composition.

Abstract: A manufacturing method of a semiconductor package includes the following steps. An encapsulated semiconductor package is provided on a substrate. A heat dissipation sheet is cut into a plurality of heat dissipation films. The plurality of heat dissipation films are attached on the encapsulated semiconductor package, wherein the plurality of heat dissipation films jointly cover an upper surface of the encapsulated semiconductor package. A cover lid is provided on the substrate, wherein the cover lid is in contact with the plurality of heat dissipation films.

Abstract: A superhydrophobic coating having a three-dimensional porous nanocomposite structure, includes: a constructing unit and a bonding unit; the constructing unit comprises inorganic hydrophobic nanoparticles, the bonding unit comprises hydrophobic polymer nanomicrospheres, and the inorganic hydrophobic nanoparticles and the hydrophobic polymer nanomicrospheres are interconnected to form uniform pores. A method for preparation of the superhydrophobic coating includes: mixing the inorganic hydrophobic nanoparticles with the hydrophobic polymer nanomicrospheres in a dispersant to form a coating solution; and coating the coating solution on the surface of a substrate using a dip coating, roll coating or spray coating process, and drying to form the superhydrophobic coating of a three-dimensional porous nanocomposite structure.

Abstract: A cell on an integrated circuit is provided. The cell includes: a fin structure; an intermediate fin structure connection metal track disposed in an intermediate fin structure connection metal layer above the fin structure, the intermediate fin structure connection metal track being connected to the fin structure; and a first intermediate gate connection metal track disposed in an intermediate gate connection metal layer above the intermediate fin structure connection metal layer, the first intermediate gate connection metal track being connected to the intermediate fin structure connection metal track. A first power supply terminal is connected to the first intermediate gate connection metal track.

Abstract: Quantum dot is a semiconductor nanomaterial. The quantum dot includes a core constituted of InP, a first shell constituted of ZnSe, a second shell constituted of ZnS, and a gradient alloy intermediate layer. The core is wrapped by the first shell. The first shell is wrapped by the second shell, and the first and second shells have different materials. The gradient alloy intermediate layer is between the core and the first shell. The gradient layer includes an alloy constituted of In, P, Zn and Se. A content of the In and P gradually decreases from the core to the first shell. A content of the Zn and Se gradually increases from the core to the first shell. A particle size of the quantum dot is greater than or equal to 11 nm. The quantum dot is capable of emitting light upon excitation with a photoluminescence quantum yield equal to or more than 50%.

Abstract: A user equipment (UE) is configured to transmit a discovery message for a sidelink connection. The UE receives a discovery message configuration, wherein the discovery message configuration includes at least one parameter dedicated to transmitting a discovery message for the second connection, transmits the discovery message as a broadcast and receives a signal from the further UE regarding the discovery message, wherein the second connection is a sidelink connection.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A query processing method including decomposing an SQL into logical plans based on data source feature information, to obtain a logical plan set, where the data source feature information is stored in an internal storage space of the query engine; generating physical plans for the logical plan set based on the data source feature information, to obtain a physical plan set; determining query costs of the physical plan set based on the data source feature information, to obtain a physical plan with a highest priority; and executing the physical plan with the highest priority, to obtain a query result queried by a user. The embodiments of this application further disclose a data source registration method and a query engine.

Abstract: Embodiments promote the maintenance of a designed flow of cooling air through a chassis during the servicing of one or more electronic components contained by the chassis. A top opening created by the removal of server chassis from a rack may be significantly reduced by internal lids that provide access to groups of components. Gaps created by the partial removal of groups of components may be significantly reduced by air dams attached to the components that inhibit the flow of air between the components. And the opening created by the removal of a circuit board may be significantly reduced by a flap configured to cover the opening upon removal of the circuit board. The various embodiments may be used individually or in combination to reduce openings in the chassis that may allow air to flow in paths that negatively affect the designed air flow.

Abstract: Autoencoder-based anomaly detection methods have been used in identifying anomalous users from large-scale enterprise logs with the assumption that adversarial activities do not follow past habitual patterns. Most existing approaches typically build models by reconstructing single-day and individual-user behaviors. However, without capturing long-term signals and group-correlation signals, the models cannot identify low-signal yet long-lasting threats, and will incorrectly report many normal users as anomalies on busy days, which, in turn, leads to a high false positive rate. A method is provided based on compound behavior, which takes into consideration long-term patterns and group behaviors. The provided method leverages a novel behavior representation and an ensemble of deep autoencoders and produces an ordered investigation list.

Abstract: An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a power conductive line, and a power via. The contact conductive line extends from the source region. The power conductive line is coupled to the contact conductive line. The power via interconnects the supply conductive line and the power conductive line.