Abstract: An integrated circuit (IC) package includes a first integrated circuit (IC) device. An interconnection structure is disposed over the first IC device in a cross-sectional side view. The interconnection structure includes a plurality of interconnection components. A cavity is disposed in the interconnection structure in the cross-sectional side view. A second IC device is disposed at least partially within the cavity in the cross-sectional side view. The second IC device is electrically coupled to the first IC device through at least a subset of the interconnection components of the interconnection structure. A non-metallic material partially fills the cavity. The second IC device is at least partially surrounded by the non-metallic material in the cross-sectional side view and in a top view.

Abstract: A semiconductor structure includes an interconnect structure, a passivation structure, a first capacitor, and a contact feature. The interconnect structure is disposed over a semiconductor substrate. The passivation structure is disposed over the interconnect structure. The first capacitor is disposed within the passivation structure. The contact feature is disposed over the passivation structure, wherein the first capacitor is proximal to a corner of the contact feature. A method of manufacturing the semiconductor structure is also provided.

Abstract: A semiconductor package structure includes a semiconductor die encapsulated in a molding compound, a redistribution structure over the semiconductor die and the molding compound, a surface device over and electrically connected to the redistribution structure, a first connector over and electrically connected to the redistribution structure, a second connector between the surface device and the redistribution structure, a trench in the redistribution structure and laterally surrounding the surface device in a top view of the semiconductor package structure, and an underfill. The second connector electrically connects the surface device to the redistribution structure. The underfill surrounds the second connector. The underfill include a first portion and a second portion. The first portion of the underfill is located between the surface device and the redistribution structure and laterally surrounding the second connector, and the second portion of the underfill is disposed in the trench.

Abstract: The present invention relates to a sensing system and a sensing method using the same. The sensing system includes at least one tested unit and an optical fiber measuring unit. The tested unit includes a container, a strain arm and a float. The container can be filled with a fluid, and the strain arm is connected with the float and combined with a measuring portion of the optical fiber measuring unit. When the container is disposed on a body of interest, the surface inclination or settlement of the body of interest would cause changes of buoyant force on the floating element and induce bending deformation of the strain arm. Accordingly, the surface deformation of the body of interest can be determined by detecting the bending deformation of the strain arm using the measuring portion combined with the strain arm.

Abstract: The present invention relates to a sensing system and a sensing method using the same. The sensing system includes at least one tested unit and an optical fiber measuring unit. The tested unit includes a container, a strain arm and a float. The container can be filled with a fluid, and the strain arm is connected with the float and combined with a measuring portion of the optical fiber measuring unit. When the container is disposed on a body of interest, the surface inclination or settlement of the body of interest would cause changes of buoyant force on the floating element and induce bending deformation of the strain arm. Accordingly, the surface deformation of the body of interest can be determined by detecting the bending deformation of the strain arm using the measuring portion combined with the strain arm.

Abstract: A software deployment system and method are provided. The system includes a server and at least one client. The server executes a first server application and a second server application simultaneously. The client controls at least one equipment tool, executes a first client application connected to the first server application, and has a second client application. In response to a deployment signal, the client first deletes the first client application and executes the second client application to connect to the second server application if all equipment tools controlled by the client are idle. The client then transmits a completion signal to the server. If software deployment on each client is complete, the server deletes the first server application.

Abstract: A software deployment system and method are provided. The system includes a server and at least one client. The server executes a first server application and a second server application simultaneously. The client controls at least one equipment tool, executes a first client application connected to the first server application, and has a second client application. In response to a deployment signal, the client first deletes the first client application and executes the second client application to connect to the second server application if all equipment tools controlled by the client are idle. The client then transmits a completion signal to the server. If software deployment on each client is complete, the server deletes the first server application.