Patents by Inventor Ting-Yuan Liu

Ting-Yuan Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12180067
    Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: December 31, 2024
    Assignee: InvenSense, Inc.
    Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
  • Patent number: 12139398
    Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: November 12, 2024
    Assignee: InvenSense, Inc.
    Inventors: Weng Shen Su, CHung-Hsien Lin, Yaoching Wang, Tsung Lin Tang, Ting-Yuan Liu, Calin Miclaus
  • Patent number: 12140489
    Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: November 12, 2024
    Assignee: InvenSense, Inc.
    Inventors: Tsung Lin Tang, Chung-Hsien Lin, Ting-Yuan Liu, Weng Shen Su, Yaoching Wang
  • Publication number: 20230296461
    Abstract: A pressure sensor includes a first electrode, a plurality of cavities, and a second electrode. The second electrode is disposed opposite the first electrode through the plurality of cavities. The second electrode includes a flat structure spanning two adjacent cavities of the plurality of cavities.
    Type: Application
    Filed: February 23, 2023
    Publication date: September 21, 2023
    Inventors: Yoshitaka Sasaki, Jotaro Akiyama, Sal Akram, Yaoching Wang, Weng Shen Su, Tsung Lin Tang, Ting-Yuan Liu, Yuki Shibano, Chung-Hsien Lin
  • Publication number: 20230088319
    Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.
    Type: Application
    Filed: August 30, 2022
    Publication date: March 23, 2023
    Inventors: Tsung Lin Tang, Chung-Hsien Lin, Ting-Yuan Liu, Weng Shen Su, Yaoching Wang
  • Publication number: 20230089813
    Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 23, 2023
    Inventors: Weng Shen Su, Chung-Hsien Lin, Yaoching Wang, Tsung Lin Tang, Ting-Yuan Liu, Calin Miclaus
  • Publication number: 20220098030
    Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
    Type: Application
    Filed: December 13, 2021
    Publication date: March 31, 2022
    Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
  • Patent number: 11225409
    Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: January 18, 2022
    Assignee: InvenSense, Inc.
    Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
  • Patent number: 10705053
    Abstract: The present disclosure provides an aerosol sensing method. The aerosol sensing method includes steps of providing an entering process, providing a particle collecting process and providing a measuring process. The entering process is to allow an aerosol to enter a chamber of a thermal-piezoresistive oscillator-based aerosol sensor, and a thermal-piezoresistive resonator is disposed in the chamber. The particle collecting process is to allow particulate matters in the aerosol to land on at least one proof-mass of the thermal-piezoresistive resonator when the thermal-piezoresistive resonator is not driven. The measuring process is to use an electrical signal to drive the thermal-piezoresistive resonator and measure a resonant frequency of the thermal-piezoresistive resonator. The particle collecting process and the measuring process are operated in a repetitive cycle for measuring changes of the resonant frequency of the thermal-piezoresistive resonator to measure the particulate matters of the aerosol.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: July 7, 2020
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Sheng-Shian Li, Ting-Yuan Liu
  • Publication number: 20200087142
    Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 19, 2020
    Applicant: InvenSense, Inc.
    Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
  • Publication number: 20190227034
    Abstract: The present disclosure provides an aerosol sensing method. The aerosol sensing method includes steps of providing an entering process, providing a particle collecting process and providing a measuring process. The entering process is to allow an aerosol to enter a chamber of a thermal-piezoresistive oscillator-based aerosol sensor, and a thermal-piezoresistive resonator is disposed in the chamber. The particle collecting process is to allow particulate matters in the aerosol to land on at least one proof-mass of the thermal-piezoresistive resonator when the thermal-piezoresistive resonator is not driven. The measuring process is to use an electrical signal to drive the thermal-piezoresistive resonator and measure a resonant frequency of the thermal-piezoresistive resonator. The particle collecting process and the measuring process are operated in a repetitive cycle for measuring changes of the resonant frequency of the thermal-piezoresistive resonator to measure the particulate matters of the aerosol.
    Type: Application
    Filed: May 3, 2018
    Publication date: July 25, 2019
    Inventors: Sheng-Shian LI, Ting-Yuan LIU
  • Patent number: 8946503
    Abstract: A nucleic acid construct comprising a genetic engineered heterogeneous nuclear ribonucleoprotein (hnRNP) A1 gene is provided. A transgenic mouse in which the expression of hnRNP A1 gene has been disrupted is also provided. The mouse is useful for studying the role of hnRNP A1 gene in normal and disease states of a developmental disorder and muscular diseases. Therefore, a method of screening a compound for potential use in prevention and/or treatment of developmental disorder and muscular diseases is further provided.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: February 3, 2015
    Assignee: Kaohsiung Medical University
    Inventors: Yung-Fu Chang, Ting-Yuan Liu, Yuh-Jyh Jong, Jan-Gowth Chang
  • Publication number: 20140123329
    Abstract: A nucleic acid construct comprising a genetic engineered heterogeneous nuclear ribonucleoprotein (hnRNP) A1 gene is provided. A transgenic mouse in which the expression of hnRNP A1 gene has been disrupted is also provided. The mouse is useful for studying the role of hnRNP A1 gene in normal and disease states of a developmental disorder and muscular diseases. Therefore, a method of screening a compound for potential use in prevention and/or treatment of developmental disorder and muscular diseases is further provided.
    Type: Application
    Filed: November 27, 2013
    Publication date: May 1, 2014
    Applicant: KAOHSIUNG MEDICAL UNIVERSITY
    Inventors: Yung-Fu Chang, Ting-Yuan Liu, Yuh-Jyh Jong, Jan-Gowth Chang
  • Publication number: 20130067605
    Abstract: A nucleic acid construct comprising a genetic engineered heterogeneous nuclear ribonucleoprotein (hnRNP) A1 gene is provided. A transgenic mouse in which the expression of hnRNP A1 gene has been disrupted is also provided. The mouse is useful for studying the role of hnRNP A1 gene in normal and disease states of a neurodegenerative disease or a cancer for developing therapies to treat any of these diseases. Therefore, a method of screening a compound for potential use in prevention and/or treatment of neurodegenerative disease or cancer is further provided.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 14, 2013
    Applicant: KAOHSIUNG MEDICAL UNIVERSITY
    Inventors: Yung-Fu Chang, Ting-Yuan Liu, Yuh-Jyh Jong, Jan-Gowth Chang