Patents by Inventor Ting-Yun Lin

Ting-Yun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fastening device for expansion cards
    Patent number: 11239607
    Abstract: A fastening device for expansion cards that is capable of connecting to a slot on a normal motherboard and fastening an expansion card in the slot is disclosed. The fastening device includes a top pressing unit and two side fastening units, wherein the two side fastening units are connected to two ends of the top pressing unit, respectively, and each side fastening unit is provided with an opening. When two clip units disposed on the two ends of the slot pass through the openings of the two side fixing units respectively, the top pressing unit presses the top edge of the expansion card inserted into the slot and the two side fastening units respectively press and fasten the two clip units so as to restrain the clip units from unlocking and to prevent the expansion card from becoming loose in the slot.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: February 1, 2022
    Assignee: Innodisk Corporation
    Inventors: Shuang-Te Chang, Ting-Yun Lin, Cheng-Wei Lee, Rei Yeh, Chung-Yu Chuang
  • FASTENING DEVICE FOR EXPANSION CARDS
    Publication number: 20210135401
    Abstract: A fastening device for expansion cards that is capable of connecting to a slot on a normal motherboard and fastening an expansion card in the slot is disclosed. The fastening device includes a top pressing unit and two side fastening units, wherein the two side fastening units are connected to two ends of the top pressing unit, respectively, and each side fastening unit is provided with an opening. When two clip units disposed on the two ends of the slot pass through the openings of the two side fixing units respectively, the top pressing unit presses the top edge of the expansion card inserted into the slot and the two side fastening units respectively press and fasten the two clip units so as to restrain the clip units from unlocking and to prevent the expansion card from becoming loose in the slot.
    Type: Application
    Filed: April 17, 2020
    Publication date: May 6, 2021
    Inventors: SHUANG-TE CHANG, TING-YUN LIN, CHENG-WEI LEE, REI YEH, CHUNG-YU CHUANG
  • Method for producing flexible conductive substrate with high transmittance and product thereof
    Patent number: 10465056
    Abstract: The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: November 5, 2019
    Assignee: NATIONAL CHUNG HSING UNIVERSITY
    Inventors: Wei-Ping Dow, Po-Ting Chen, Liang-Jie Lin, Hung-Ming Chang, Ting-Yun Lin, Fang-Yu Lin
  • METHOD FOR PRODUCING FLEXIBLE CONDUCTIVE SUBSTRATE WITH HIGH TRANSMITTANCE AND PRODUCT THEREOF
    Publication number: 20180340050
    Abstract: The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.
    Type: Application
    Filed: November 6, 2017
    Publication date: November 29, 2018
    Inventors: Wei-Ping Dow, Po-Ting Chen, Liang-Jie Lin, Hung-Ming Chang, Ting-Yun Lin, Fang-Yu Lin