Abstract: A hybrid power conversion circuit includes a high-side switch, a low-side switch, a transformer, a resonance tank, a first switch, a second switch, a first synchronous rectification switch, a second synchronous rectification switch, and a third switch. The resonance tank has an external inductor, an external capacitance, and an internal inductor. The first switch is connected to the external inductor. The second switch and a first capacitance form a series-connected path, and is connected to the external capacitance. The first and second synchronous rectification switches are respectively coupled to a first winding and a second winding. The third switch is connected to the second synchronous rectification switch. When an output voltage is less than a voltage interval, the hybrid power conversion circuit operates in a hybrid flyback conversion mode, and otherwise the hybrid power conversion circuit operates in a resonance conversion mode.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: A fastening device for expansion cards that is capable of connecting to a slot on a normal motherboard and fastening an expansion card in the slot is disclosed. The fastening device includes a top pressing unit and two side fastening units, wherein the two side fastening units are connected to two ends of the top pressing unit, respectively, and each side fastening unit is provided with an opening. When two clip units disposed on the two ends of the slot pass through the openings of the two side fixing units respectively, the top pressing unit presses the top edge of the expansion card inserted into the slot and the two side fastening units respectively press and fasten the two clip units so as to restrain the clip units from unlocking and to prevent the expansion card from becoming loose in the slot.

Abstract: A fastening device for expansion cards that is capable of connecting to a slot on a normal motherboard and fastening an expansion card in the slot is disclosed. The fastening device includes a top pressing unit and two side fastening units, wherein the two side fastening units are connected to two ends of the top pressing unit, respectively, and each side fastening unit is provided with an opening. When two clip units disposed on the two ends of the slot pass through the openings of the two side fixing units respectively, the top pressing unit presses the top edge of the expansion card inserted into the slot and the two side fastening units respectively press and fasten the two clip units so as to restrain the clip units from unlocking and to prevent the expansion card from becoming loose in the slot.

Abstract: The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.

Abstract: The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.