Abstract: A device includes a package component including an interconnect structure on a first side of a substrate; metal pads on the interconnect structure; a semiconductor die connected to a second side of the substrate; a dielectric material surrounding the package component; a passivation layer extending over the package component and over the dielectric material; a first buffer layer over the passivation layer, wherein the first buffer layer extends over the package component and over the dielectric material, wherein a width of the first buffer layer is greater than a width of the package component and is less than a width of the passivation layer; and conductive connectors penetrating the passivation layer and the first buffer layer to physically contact the metal pads.

Abstract: A foldable lamp shade device includes a housing, a lining mounted in the housing, and a plurality of fixing members mounted between the housing and the lining to combine the housing and the lining together. Thus, the foldable lamp shade device is mounted and detached easily, rapidly and conveniently, thereby facilitating the user assembling and disassembling the lamp shade device. In addition, the lamp shade device can be folded when not in use, thereby greatly saving the cost, space and time of package, storage and transportation.