Patents by Inventor Tingting Du

Tingting Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150455
    Abstract: Provided are an anti-CLDN6 antibody or an antigen-binding fragment thereof; a nucleic acid molecule encoding same; an immunoconjugate, a bispecific molecule, a chimeric antigen receptor and a pharmaceutical composition containing same; and the use thereof for preventing and/or treating tumors.
    Type: Application
    Filed: March 5, 2021
    Publication date: May 9, 2024
    Inventors: Liang Du, Hongyan Zhang, Lina Jin, Yali Chen, Tingting Wan, Liuliu Xu, Jijun Yuan
  • Publication number: 20240130120
    Abstract: The present disclosure provides a three-dimensional memory comprising: a storage channel structure vertically penetrating a plurality of stacked layers and comprising a first channel layer; a select gate structure on the plurality of stacked layers; and a select channel structure vertically penetrating the select gate structure and comprising: a block layer in contact with the select gate structure, an insulating layer covering the block layer, and a second channel layer in contact with the insulating layer and the first channel layer.
    Type: Application
    Filed: December 28, 2022
    Publication date: April 18, 2024
    Inventors: Jiayi Liu, Tingting Gao, Xiaoxin Liu, Xiaolong Du, Changzhi Sun, Zhiliang Xia
  • Publication number: 20240130129
    Abstract: The present disclosure provides a three-dimensional memory device and a manufacturing method thereof, the three-dimensional memory device including: a plurality of stacked layers; a storage channel structure vertically penetrating the stacked layers and comprising a first channel layer; a select gate structure on the plurality of stacked layers; and a select channel structure vertically penetrating the select gate structure and comprising a second channel layer; wherein an outer sidewall of the second channel layer is in contact with an inner sidewall of the first channel layer.
    Type: Application
    Filed: December 28, 2022
    Publication date: April 18, 2024
    Inventors: Jiayi Liu, Tingting Gao, Xiaoxin Liu, Xiaolong Du, Changzhi Sun, Zhiliang Xia
  • Publication number: 20240130130
    Abstract: The present disclosure provides a three-dimensional memory device and a manufacturing method thereof. The three-dimensional memory device comprises: a plurality of stacked layers; a storage channel structure vertically penetrating the stacked layers and comprising a first channel layer; a select gate structure on the plurality of stacked layers and comprising a conductive layer sandwiched between two dielectric layers; and a select channel structure vertically penetrating the select gate structure and comprising a second channel layer.
    Type: Application
    Filed: December 28, 2022
    Publication date: April 18, 2024
    Inventors: Jiayi Liu, Tingting Gao, Changzhi Sun, Xiaolong Du, Xiaoxin Liu, Zhiliang Xia
  • Publication number: 20240099008
    Abstract: According to an aspect of the disclosure, a semiconductor device is provided. The semiconductor device includes a stack structure that includes alternating insulating layers and word line layers. The semiconductor device also includes a first channel structure extending through the stack structure, a first top select gate (TSG) layer over the stack structure, and a second TSG layer over the first TSG layer. The semiconductor device further includes a second channel structure extending through the first and second TSG layers, where the second channel structure is positioned over and coupled to the first channel structure.
    Type: Application
    Filed: September 15, 2022
    Publication date: March 21, 2024
    Applicant: Yangtze Memory Technologies Co., Ltd.
    Inventors: Tingting GAO, ZhiLiang XIA, Xiaoxin LIU, Xiaolong DU, Changzhi SUN, Jiayi LIU, ZongLiang HUO
  • Publication number: 20220102775
    Abstract: Variable thermal resistors, systems, and methods suitable for modulating heat transport between a heat source and a heat sink based on a degree of compression of a reversibly-compressible, open-pore graphene foam within the variable thermal resistors. The variable thermal resistor is configured to controllably vary heat transport therethrough by controlling the degree of compression of the graphene foam.
    Type: Application
    Filed: September 27, 2021
    Publication date: March 31, 2022
    Inventors: Xiulin Ruan, Amy Marie Marconnet, Tingting Du, Luis Delgado
  • Patent number: 10612219
    Abstract: A bathtub spout quick connecting mechanism includes a main body, a hand wheel, and a gasket. A boss of the hand wheel is inserted through an open top of the main body. A conical recess at an outer end of the boss is fitted on a pull rod head of a bathtub spout. The gasket is attached to the inner bottom surface of the main body. The gasket has a central perforation communicating with a through hole at the bottom of the main body. The conical recess of the hand wheel screwedly connected to the main body abuts against the pull rod head to drive the pull rod head to move up and down. The installation is convenient and quick.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: April 7, 2020
    Inventor: Tingting Du
  • Publication number: 20180127958
    Abstract: A bathtub spout quick connecting mechanism includes a main body, a hand wheel, and a gasket. A boss of the hand wheel is inserted through an open top of the main body. A conical recess at an outer end of the boss is fitted on a pull rod head of a bathtub spout. The gasket is attached to the inner bottom surface of the main body. The gasket has a central perforation communicating with a through hole at the bottom of the main body. The conical recess of the hand wheel screwedly connected to the main body abuts against the pull rod head to drive the pull rod head to move up and down. The installation is convenient and quick.
    Type: Application
    Filed: January 26, 2017
    Publication date: May 10, 2018
    Inventor: Tingting Du