Patents by Inventor Tingwen WEI

Tingwen WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11845708
    Abstract: The present disclosure provides a method for photocleavage of an amide bond, the method has mild reaction conditions and can realize the cleavage of amide bonds by using light. The method comprises the following steps: subjecting 2,4-dinitrofluorobenzene to a reaction with an amino group of a substance represented by structural formula I with an ?-amino acid at the end to produce a compound 1 represented by structural formula II; then under light irradiation, subjecting the compound 1 to a cleavage reaction of amide bond; Wherein, R1 is the side chain group of ?-amino acid; R2 is: aryl, aliphatic hydrocarbon, —CH(R)—COOH or polypeptide.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: December 19, 2023
    Assignee: NANJING TECH UNIVERSITY
    Inventors: Xiaoqiang Chen, Tingwen Wei, Jing Wang, Yanyan Wang
  • Publication number: 20220289665
    Abstract: The present disclosure provides a method for photocleavage of an amide bond, the method has mild reaction conditions and can realize the cleavage of amide bonds by using light. The method comprises the following steps: subjecting 2,4-dinitrofluorobenzene to a reaction with an amino group of a substance represented by structural formula I with an ?-amino acid at the end to produce a compound 1 represented by structural formula II; then under light irradiation, subjecting the compound 1 to a cleavage reaction of amide bond; Wherein, R1 is the side chain group of ?-amino acid; R2 is: aryl, aliphatic hydrocarbon, —CH(R)—COOH or polypeptide.
    Type: Application
    Filed: September 27, 2021
    Publication date: September 15, 2022
    Inventors: Xiaoqiang CHEN, Tingwen WEI, Jing WANG, Yanyan WANG