Patents by Inventor Tinhoi Siu

Tinhoi Siu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8255582
    Abstract: The present invention discloses an optical communication module comprising a second mode supporting a data transfer of USB 3.0 standard and a third mode supporting a data transfer of USB 2.0 standard, and the second mode comprises A mode and B mode with a different power consumption and supported data rate, and a detect unit operative to detect idle state of the data traffic on the data path of USB 3.0 standard to determine to stay on the A mode or enter to the B mode automatically during operation in the second mode. The control circuitry can work in different modes to support different status of devices attachment and removal, different data rate of USB 2.0 and 3.0 standards; and it can real time monitor the data traffic to switch different modes to save power consumption. The present invention also discloses a USB cable and a processing method of data transfer for an optical communication module.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: August 28, 2012
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Kwokleung Wong, Fukming Lam, Tinhoi Siu, Wai Hung
  • Patent number: 8120856
    Abstract: A method for manufacturing a polymer miniature lens on a substrate with the lens forming pattern, and the liquid polymer is dispensed therein. The lens forming pattern having a periphery area and an interior area, most portion of the periphery area having a property of confining liquid polymer, while the interior area having at least one portion exposing the surface of the substrate; depositing liquid polymer onto the lens forming pattern; and curing the liquid polymer after the liquid polymer reaches equilibrium shape and is confined to the periphery area. The invention also discloses a collimator including the polymer miniature lens.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: February 21, 2012
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung Mak, Tinhoi Siu
  • Publication number: 20120011286
    Abstract: The present invention discloses an optical communication module comprising a second mode supporting a data transfer of USB 3.0 standard and a third mode supporting a data transfer of USB 2.0 standard, and the second mode comprises A mode and B mode with a different power consumption and supported data rate, and a detect unit operative to detect idle state of the data traffic on the data path of USB 3.0 standard to determine to stay on the A mode or enter to the B mode automatically during operation in the second mode. The control circuitry can work in different modes to support different status of devices attachment and removal, different data rate of USB 2.0 and 3.0 standards; and it can real time monitor the data traffic to switch different modes to save power consumption. The present invention also discloses a USB cable and a processing method of data transfer for an optical communication module.
    Type: Application
    Filed: January 11, 2011
    Publication date: January 12, 2012
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Kwokleung Wong, Fukming Lam, Tinhoi Siu, Wai Hung
  • Publication number: 20110198014
    Abstract: The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances.
    Type: Application
    Filed: April 29, 2011
    Publication date: August 18, 2011
    Applicant: SAE Magnetics (H.K.) Ltd
    Inventors: Wingkeung MAK, Tinhoi Siu, Xiaoxi Liu, Gamboa Guillen, Dianjun Gong, Wei Si
  • Publication number: 20110194186
    Abstract: A method for manufacturing a polymer miniature lens on a substrate with the lens forming pattern, and the liquid polymer is dispensed therein. The lens forming pattern having a periphery area and an interior area, most portion of the periphery area having a property of confining liquid polymer, while the interior area having at least one portion exposing the surface of the substrate; depositing liquid polymer onto the lens forming pattern; and curing the liquid polymer after the liquid polymer reaches equilibrium shape and is confined to the periphery area. The invention also discloses a collimator including the polymer miniature lens.
    Type: Application
    Filed: April 21, 2010
    Publication date: August 11, 2011
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung Mak, Tinhoi Siu
  • Publication number: 20100200147
    Abstract: The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. The invention also provides a plate installing device with a light concentrator, which can be installed by the adhesive bonding method above mentioned.
    Type: Application
    Filed: July 23, 2009
    Publication date: August 12, 2010
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung Mak, Tinhoi Siu, Xiaoxi Liu, Gamboa Guillen, Dianjun Gong, Wei Si