Abstract: A semiconductor power module includes one or more semiconductors placed on a substrate. At least one contact pin extends basically perpendicular to the substrate and is electrically connected to the substrate or the semiconductor via a pin foot. A terminal end of the contact pin protrudes outside an encapsulation compound encapsulating at least partially the substrate, the one or more semiconductors, and the contact pin. At least one sealing ring and at least one washer are received by a pin shaft of the contact pin such that they rest on the pin foot. The washer is fixed by the encapsulation compound, and the sealing ring is held in longitudinal direction of the pin shaft in an elastically deformed state by the washer.

Abstract: A mold tool 1 is described for molding a semiconductor power module having an electrical contact pin 2 which includes an electrical contact portion 3 for contacting a substrate 4 with another electrical component. The pin 2 comprises a protruding portion 5 being a top-sided pin connector. The mold tool 1 includes a first 6 and a second mold die which, when brought together for molding, form a cavity to be filled with a mold compound for encapsulating electrical components of the semiconductor power module, and a recess 7 in the first die 6 which communicates with the cavity within the second die. The recess 7 is filled with a cushion-like soft material 8 into which the top-sided pin connector is pushed thereinto and completely surrounded by the soft material so that a sealing means is formed that prevents any contamination of the electrical contact portion 3 of the pin 2 by the molding compound introduced into the cavity. Furthermore, a method of manufacturing such a semiconductor power module is described.