Abstract: A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a first heatsink thermally conductively coupled to the first vapor chamber; and a second thermal management device, that includes a second vapor chamber; and a second heatsink thermally conductively coupled to the second vapor chamber, where the second thermal management device is thermally conductively coupled to the first thermal management device; where the PCB is interposed between the first thermal management device and the second thermal management device.

Abstract: Embodiments described herein relate to a system for positioning indicator lights of a network device. The system may include a circuit board, which may include a circuit board edge positioned behind a front panel of the network device, two surfaces; and a side of the circuit board edge positioned between the two surfaces. The system may also include a hole through the circuit board near the circuit board edge, a cutout extending from a portion of the hole to the side of the circuit board edge, a LED coupled to the surface of the circuit board and adapted to emit light into the hole, and a lightpipe disposed in the hole to receive light emitted from the LED into a first end of the lightpipe. The lightpipe may direct the light from a second end of the lightpipe toward an opening in the front panel of the network device.

Abstract: Embodiments described herein relate to a system for positioning indicator lights of a network device. The system may include a circuit board, which may include a circuit board edge positioned behind a front panel of the network device, two surfaces; and a side of the circuit board edge positioned between the two surfaces. The system may also include a hole through the circuit board near the circuit board edge, a cutout extending from a portion of the hole to the side of the circuit board edge, a LED coupled to the surface of the circuit board and adapted to emit light into the hole, and a lightpipe disposed in the hole to receive light emitted from the LED into a first end of the lightpipe. The lightpipe may direct the light from a second end of the lightpipe toward an opening in the front panel of the network device.

Abstract: A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a first heatsink thermally conductively coupled to the first vapor chamber; and a second thermal management device, that includes a second vapor chamber; and a second heatsink thermally conductively coupled to the second vapor chamber, where the second thermal management device is thermally conductively coupled to the first thermal management device; where the PCB is interposed between the first thermal management device and the second thermal management device.

Abstract: A system includes an electronic connector configured to be coupled to a connector module and an electromagnetic interference (EMI) absorber proximate to and at least partially surrounding the electronic connector. The EMI absorber may be positioned as close as possible to the electronic connector and may be attached to the electronic connector. This positioning of the EMI absorber at least partially absorbs EMI present at the electronic connector and thereby reduces the noise on electronic signals being communicated on conductors of the electronic connector as well as reducing overall radiated emissions from an electronic system including the electronic connector.

Abstract: A processing chamber component and method for fabricating the same are provided. The processing chamber component is fabricated in the manner described herein and includes the creation of at least a macro texture on a surface of the chamber component. The macro texture is defined by a plurality of engineered features arranged in a predefined orientation on the surface of the chamber component. In some embodiments, the engineered features prevent formation of a line of sight surface defined between the features to enhance retention of films deposited on the chamber component.