Abstract: The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.

Abstract: The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.

Abstract: A mold for casting a micro-scale structure includes an upper surface including a first cavity having a first depth. A negative pattern for an array of micro-scale structures is defined in a surface of the first cavity. The mold includes at least one second cavity having a second depth defined in the cavity outside of the negative pattern for the array of micro-scale structures. The at least one second cavity defines a negative pattern for a standoff of the micro-scale structure. A fabric retaining frame is disposed in the first cavity.

Abstract: A method of forming a metal mold for casting a micro-scale dry adhesive structure includes securing a master patch of material including a micro-scale dry adhesive structure on a plating fixture, electroforming the metal mold on the patch of material, and removing the metal mold from the plating fixture and patch of material.

Abstract: A mold for casting a micro-scale structure includes an upper surface including a first cavity having a first depth. A negative pattern for an array of micro-scale structures is defined in a surface of the first cavity. The mold includes at least one second cavity having a second depth defined in the cavity outside of the negative pattern for the array of micro-scale structures. The at least one second cavity defines a negative pattern for a standoff of the micro-scale structure. A fabric retaining frame is disposed in the first cavity.

Abstract: A mold for casting a micro-scale dry adhesive structure includes an upper surface including a first cavity having a first depth, a negative pattern for an array of micro-scale structures defined in a surface of the first cavity, and at least one second cavity having a second depth defined in the cavity outside of the negative pattern for the array of micro-scale structures, the at least one second cavity defining a negative pattern for a standoff of the micro-scale dry adhesive structure.

Abstract: The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.

Abstract: Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Abstract: An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.

Abstract: An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.

Abstract: Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Abstract: An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.

Abstract: Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Abstract: Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Abstract: Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Abstract: Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Abstract: An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.

Abstract: A probe of a Raman spectroscopy system has a wavelength and/or amplitude referencing system for determining a wavelength of the excitation signal. Preferably, this referencing system is near an output aperture, through which the excitation signal is transmitted to the sample. In this way, any birefringence or polarization dependent loss (PDL) that may be introduced by optical elements in the system can be compensated for since the wavelength reference system will detect the effect or impact of these elements.

Abstract: A method is described for forming an electromigration-resistant (ER) intermetallic region beneath and adjacent a conductive plug in a via. Preferably the ER region is formed of a sintered intermetallic compound of Al and Ti, and the conductive plug is formed of W.