Abstract: The invention generally relates to multi-chip jet impingement cooling for heat dissipation and methods of use thereof. In certain aspects, the invention provides a high performance computing (HPC) system comprising: a logic chip; a plurality of high bandwidth memory (HBM) chips; and a jet impingement cooling arrangement; wherein the HPC is arranged such that incoming fluid from the jet impingement cooling arrangement first impinges over the HBMs and is then redirected towards the logic chip to impinge again, thus cooling the HBMs and logic chip in series.

Abstract: A multi-jet liquid impingement cooler for on-chip cooling is disclosed, providing an ultra-thin, compact solution for high-power electronic devices. The cooler comprises a manifold having an integrated serpentine wall structure, and laterally alternating feeding and draining nozzles. The integrated serpentine wall structure separates cool and heated coolant flow channels. The feeding nozzles direct, in jets, a cool coolant, which is delivered to the manifold, toward the electronic device for impingement cooling, and the draining nozzles remove the heated coolant from the manifold.

Abstract: A method of fabricating a multilayered metallic microstructure includes stacking a plurality of porous membranes having various pore sizes and/or orientations, and joining the stacked plurality of porous membranes. The method further includes manufacturing the multilayered metallic microstructure as an integral microstructure formed by a plurality of nanowires defined in pores of the plurality of porous membranes.

Abstract: A method of bonding two substrates together includes applying a plurality of templating spheres to a first metal layer on a first substrate of the two substrates, applying a metal on the plurality of templating spheres to form a porous metal layer, and bonding a solder layer arranged on a second substrate of the two substrates to the porous metal layer with heat and pressure such that pores of the porous metal layer are filled with solder material and intermetallic compounds, forming a metal inverse opals layer bonding the first and second substrates together.

Abstract: An integrated circuit includes a transistor layer, a backside power delivery network having a buried power rail and a plurality of backside metal layers, a power source electrically connected to the buried power rail by electrical connections in the plurality of backside metal layers, and a cooling arrangement defined at least partially in the plurality of backside metal layers. The cooling arrangement is formed of a plurality of inlet channels, a plurality of outlet channels, and a plurality of cooling channels, wherein each of the plurality of inlet channels is fluidly connected to a plurality of cooling channels, and each of the plurality of cooling channels is fluidly connected to the plurality of outlet channels.

Abstract: A liquid jet impingement cooler includes a wick structure formed of a porous material and a manifold. The manifold includes a plurality of inlet nozzles fluidly connecting a liquid inlet to the wick structure, a plurality of outlet nozzles fluidly connecting the wick structure to a liquid outlet, and a vapor outlet fluidly connected to the porous material of the wick structure.

Abstract: Disclosed is an adapter panel and a method of manufacturing the same comprising a panel body having a first surface and an opposing second surface, wherein a through-hole in a frustrum shape is formed through the panel body and filled by a conical electrical conductor between the first and second surface. The conical electrical conductor has a plane end flush with the first surface and a tip end protruding from the second surface. The panel body further comprises a wiring structure on the first surface electrically connected to the plane end of the conical electrical conductor. Bonding to a dielectric plate can be achieved by directly inserting the tip end of the conical electrical conductor into a solder ball.