Patents by Inventor TO CHAN

TO CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230194338
    Abstract: A device and a method for detecting a light irradiating angle are disclosed. The device, used to detect the incident direction of a light ray, includes a solar sensor and a processor. The sensing unit of the solar sensor has sensing areas. The sensing areas correspondingly generate sensing signals based on the intensity of the light ray. A mask covers the sensing unit and has an X-shaped light transmitting portion. The light ray transmits the X-shaped light transmitting portion to form an X-axis light ray and a Y-axis light ray. The X-axis light ray intersects the Y-axis light ray. The X-axis light ray and the Y-axis light ray fall on the sensing area. The processor, coupled to the sensing unit, receives the sensing signals and determines information of the incident direction according to the sensing signals.
    Type: Application
    Filed: March 21, 2022
    Publication date: June 22, 2023
    Inventors: MANG OU-YANG, YUNG-JHE YAN, GUAN-YU HUANG, TSE YU CHENG, CHANG-HSUN LIU, YU-SIOU LIU, YING-WEN JAN, CHEN-YU CHAN, TUNG-YUN HSIEH
  • Publication number: 20230197528
    Abstract: A method for forming an integrated circuit. The method includes providing a semiconductor structure comprising: (i) two transistors, (ii) a gate on the channel of the transistor, (iii) contacts coupled to each transistor, (iv) a dielectric layer over the two transistors, the gate, and the contacts, (v) a first conductive line arranged within a first metallization level and extending along a first direction, (vi) a first conductive via connecting the first conductive line with a first contact of a transistor, and (vii) a second conductive via connecting the first conductive line with a second contact of a transistor. The method also includes recessing the first dielectric layer, providing spacers along the first conductive line, depositing a second dielectric layer on the first dielectric layer, forming an opening in the second dielectric layer and first dielectric layer, and providing a conductive material in the opening, thereby forming a third conductive via.
    Type: Application
    Filed: November 10, 2022
    Publication date: June 22, 2023
    Inventors: Boon Teik Chan, Dunja Radisic, Bilal Chehab
  • Publication number: 20230197522
    Abstract: The disclosure relates to a method for forming a semiconductor device. The method includes forming a device layer stack on a substrate, the device layer stack having a first sub-stack comprising a first sacrificial layer and on the first sacrificial layer a channel layer defining a topmost layer of the first sub-stack, and a second sub-stack on the first sub-stack and including a first sacrificial layer defining a bottom layer of the second sub-stack, and a second sacrificial layer on the first sacrificial layer, wherein said first sacrificial layers are formed of a first sacrificial semiconductor material, the second sacrificial layer is formed of a second sacrificial semiconductor material, and the channel layer is formed of a semiconductor channel material, and wherein a thickness of the second sub-stack exceeds a thickness of the first sacrificial layer of the first sub-stack.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 22, 2023
    Inventors: Boon Teik Chan, Anne Vandooren, Julien Ryckaert, Naoto Horiguchi
  • Publication number: 20230198073
    Abstract: A battery pack and a device including the same are provided. The battery pack includes a battery module and a battery pack frame on which the battery module is mounted, the battery module comprising a battery cell stack in which a plurality of battery cells are stacked, a module frame accommodating the battery cell stack, and end plates covering front and rear sides of the battery cell stack, and a fastening member coupling the module frame to the battery pack frame.
    Type: Application
    Filed: October 8, 2021
    Publication date: June 22, 2023
    Inventor: Chan Kyu Lee
  • Publication number: 20230192878
    Abstract: The present disclosure describes single agent and combination therapies and uses for the treatment of cancer and/or cancer-associated diseases. The single agent and combinations therapies include a BCMA antibody.
    Type: Application
    Filed: May 13, 2021
    Publication date: June 22, 2023
    Applicant: PFIZER INC.
    Inventors: Nathalie Annie BARDY BOUXIN, Eloisa Virginia BARRY, John Andrew BLAKE-HASKINS, Geoffrey Wing-Lynn CHAN, Jeffrey CHOU, Mohamed A ELMELIEGY, Heike Iris KRUPKA, Kai Hsin LIAO, Erik Rene VANDENDRIES, Andrea VIQUEIRA, Paul Stephen WISSEL, Anne YVER
  • Publication number: 20230196879
    Abstract: An electronic gaming machine includes a processor configured to control display of a plurality of columns of symbol positions, where each column of symbol positions includes a plurality of symbols. The processor is also configured to select the symbols for each column and simulate display of the first reel strip stopping prior to simulating display of the second reel strip stopping, whereby a sub-category of prize associated with a prize sub-category symbol is indicated to a player of the electronic gaming machine prior to indicating a category of prize associated with a prize category symbol. The processor is also configured to determine whether a first column includes the prize sub-category symbol as well as whether a second column includes the prize category symbol. If the prize sub-category and prize category symbols are included, the processor is also configured to provide an award.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 22, 2023
    Inventors: Billy Tam, Lipi Gupta, Matthew Chan, Hiram Yu
  • Publication number: 20230194398
    Abstract: The present disclosure relates to a blood staining patch, a method and device for a blood test using the same, and more particularly, to a patch configured to contain a staining reagent for staining blood and a method and device for economically testing blood using the same. A blood testing method according to an aspect of the present disclosure, which is a blood testing method in which a patch, which includes a mesh structure forming micro-cavities and is configured to contain a staining reagent for staining staining targets present in blood in the micro-cavities, is used to perform a blood test through staining of the staining target, includes placing blood in a reaction region, and providing the staining reagent to the reaction region using the patch configured to contain the staining reagent.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 22, 2023
    Inventors: Dong Young Lee, Chan Yang Lim, Kyung Hwan Kim, Young Min Shin, Hyun Jeong YANG
  • Publication number: 20230197723
    Abstract: An integrated circuit includes a first diffusion area for a first type transistor. The first type transistor includes a first drain region and a first source region. A second diffusion area for a second type transistor is separated from the first diffusion area. The second type transistor includes a second drain region and a second source region. A gate electrode continuously extends across the first diffusion area and the second diffusion area in a routing direction. A first metallic structure is electrically coupled with the first source region. A second metallic structure is electrically coupled with the second drain region. A third metallic structure is disposed over and electrically coupled with the first and second metallic structures. A width of the first metallic structure is substantially equal to or larger than a width of the third metallic structure.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 22, 2023
    Inventors: Ali KESHAVARZI, Ta-Pen GUO, Shu-Hui SUNG, Hsiang-Jen TSENG, Shyue-Shyh LIN, Lee-Chung LU, Chung-Cheng WU, Li-Chun TIEN, Jung-Chan YANG, Ting Yu CHEN, Min CAO, Yung-Chin HOU
  • Publication number: 20230194161
    Abstract: Implementations described and claimed herein provide systems and methods for processing liquefied natural gas (LNG). In one implementation, a dry feed gas is received. The dry feed gas is chilled with clean vapor from a heavies removal column to form a chilled feed gas. The chilled feed gas is partially condensed into a vapor phase and a liquid phase. The liquid phase retains freezing components. The freezing components are extracted using a reflux stream in the heavies removal column. The freezing components are removed as a condensate. The vapor phase is compressed into a clean feed gas. The clean feed gas is free of the freezing components for downstream liquefaction.
    Type: Application
    Filed: February 15, 2023
    Publication date: June 22, 2023
    Inventors: Jinghua Chan, Qi Ma, Dale L. Embry, Attilio J. Praderio
  • Publication number: 20230198466
    Abstract: An oscillation circuit including an amplifier, a feedback resistor and a first switch circuit is provided. The amplifier inverts and amplifies an oscillation signal received from an input terminal thereof to provide an output oscillation signal at an output terminal thereof. The feedback resistor is coupled between the input terminal and the output terminal, and coupled with the first switch circuit in parallel. The first switch circuit conducts the input terminal to the output terminal in one of the following situations: (1) an input voltage of the oscillation signal is higher than an output voltage of the output oscillation signal by at least a first threshold value; and (2) the output voltage is higher than the input voltage by at least a second threshold value. The first switch circuit has a first on-state resistance smaller than a resistance of the feedback resistor.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 22, 2023
    Inventors: Ping-Yuan DENG, Chia-Liang LIN, Ka-Un CHAN
  • Publication number: 20230190798
    Abstract: Provided in some aspects are compositions of cells for treating subjects with disease and conditions such as non-Hodgkin's lymphoma (NHL), and related methods, compositions, uses and articles of manufacture. In some embodiments, the disease or condition is a B-cell non-Hodgkin lymphoma (B-cell NHL). The cells generally express recombinant receptors such as chimeric antigen receptors (CARs) for targeting an antigen, such as CD 19, on cells of the lymphoma.
    Type: Application
    Filed: February 11, 2021
    Publication date: June 22, 2023
    Applicant: Juno Therapeutics, Inc.
    Inventors: Matthew WESTOBY, Adrian Wrangham BRIGGS, David G. KUGLER, Robert Guy CASPARY, Calvin CHAN, Divya VARUN, Lothar GERMEROTH, Christian STEMBERGER, Mateusz Pawel POLTORAK, Keenan BASHOUR, Oleksandr BATUREVYCH, Nurgul KILAVUZ, Kristen HEGE, Michael BURGESS, Kaida WU, Ruth Amanda SALMON
  • Publication number: 20230191589
    Abstract: Disclosed is a payload transportation device for transporting a payload, which has a low height and in which driving wheels are configured to come into constant contact with a ground surface even when the ground surface is uneven.
    Type: Application
    Filed: July 22, 2020
    Publication date: June 22, 2023
    Inventor: Jong Chan LEE
  • Publication number: 20230197586
    Abstract: A chip package includes a chip with at least one contact pad, a contact structure formed from at least one continuous longitudinally extended electrically conductive element by attaching the conductive element to the contact pad in at least three contact positions, wherein the conductive element bends away from the contact pad between pairs of consecutive contact positions, and an encapsulation partially encapsulating the contact structure, wherein the encapsulation includes an outer surface facing away from the chip, and wherein the contact structure is partially exposed at the outer surface.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 22, 2023
    Inventors: Chan Lam Cha, Wern Ken Daryl Wee, Hoe Jian Chong, Chin Kee Leow
  • Publication number: 20230200088
    Abstract: A semiconductor device includes a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, a first ultra low-k (ULK) dielectric layer on the first MTJ and the second MTJ, a passivation layer on the first ULK dielectric layer, and a second ULK dielectric layer on the passivation layer.
    Type: Application
    Filed: February 23, 2023
    Publication date: June 22, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kun-Ju Li, Tai-Cheng Hou, Hsin-Jung Liu, Fu-Yu Tsai, Bin-Siang Tsai, Chau-Chung Hou, Yu-Lung Shih, Ang Chan, Chih-Yueh Li, Chun-Tsen Lu
  • Publication number: 20230191065
    Abstract: A patient interface for treating sleep disorder breathing includes a textile tube that also provides support for the seal forming structure. The textile tube includes an inner and outer layer that are joined along seams to form an air chamber or passageway. The textile tube can be pre-shaped so that the textile tube resiliently returns to a pre-determined shape prior to the introduction of pressurized air.
    Type: Application
    Filed: February 22, 2023
    Publication date: June 22, 2023
    Inventors: Adam Francis BARLOW, David James BRAUND, Andrew CHAN, Justin John FORMICA, Gerard Michael RUMMERY, Matthew Robin WELLS, Paul Derrick WATSON
  • Patent number: 11680752
    Abstract: A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: June 20, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Wei-Lung Chan, Wen-Ti Cheng
  • Patent number: 11683169
    Abstract: Systems and methods for managing keys in a computer memory are described. In some embodiments, location addresses are determined for two key elements. A periodic time interval that is based on a time duration for performing a transaction involving a distance between the key elements is determined. One key element may be stored at a location address and then relocated to another location address after the periodic time interval has passed. In some embodiments, areas the computer memory may remain static during relocation of the key element.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: June 20, 2023
    Assignee: EBAY INC.
    Inventors: Michael J. T. Chan, Derek Chamorro, Venkata Siva Vijayendra Bhamidipati, Glenn G. Lebumfacil, Ralph Scott Forsythe
  • Patent number: 11678811
    Abstract: A method and system for contextual heart rate monitoring are disclosed. In a first aspect, the method comprises calculating a heart rate using a detected ECG signal and detecting an activity level. In a second aspect, the system comprises a wireless sensor device coupled to a user via at least one electrode, wherein the wireless sensor device includes a processor and a memory device coupled to the processor, wherein the memory device stores an application which, when executed by the processor, causes the processor to calculate a heart rate using a detected ECG signal and to detect an activity level.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: June 20, 2023
    Assignee: Vital Connect, Inc.
    Inventors: Nima Ferdosi, Ravi Narasimhan, Alexander Chan
  • Patent number: 11680321
    Abstract: A method for fabricating a semiconductor device, including the steps of: providing a substrate having an etch stop layer formed thereon; forming a preliminary stacked structure on the etch stop layer, the preliminary stacked structure including a lower sacrifice layer contacting the etch stop layer, a support layer, and an upper sacrifice layer; forming a hole penetrating the preliminary stacked structure and the etch stop layer; forming a conductive pattern in the hole; removing the upper sacrifice layer and a portion of the support layer; removing the lower sacrifice layer; forming a first conductive layer covering the conductive pattern; and forming a dielectric layer covering the first conductive layer, a remaining portion of the support layer, and the etch stop layer.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: June 20, 2023
    Assignee: XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
    Inventors: Chan-Sul Joo, Jee-Hoon Kim
  • Patent number: 11679129
    Abstract: The present disclosure is broadly concerned with the field of cancer immunotherapy. For example, the present invention generally relates to an immune cell comprising a genetically engineered antigen receptor that specifically binds to a target antigen and a genetic disruption agent that reduces or is capable of reducing the expression in the immune cell of a gene that weakens the function of the immune cell.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: June 20, 2023
    Assignees: CUROCELL, INC., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chan Hyuk Kim, Young-Ho Lee, Yujean Lee, HyeongJi Lee, Sang Hoon Lee