Abstract: A behavior understanding system and a behavior understanding method are provided. The behavior understanding system includes a sensor and a processor. The sensor senses a motion of a human body portion for a time period. A sequence of motion sensing data of the sensor is obtained. At least two comparing results respectively corresponding to at least two timepoints within the time period are generated according to the motion sensing data. The comparing result are generated through comparing the motion sensing data with base motion data. The base motion data is related to multiple base motions. A behavior information of the human body portion is determined according to the comparing results. The behavior information is related to a behavior formed by at least one of the base motions. Accordingly, the accuracy of behavior understanding can be improved, and the embodiments may predict the behavior quickly.

Abstract: A method of manufacturing a device includes exposing at least one of a source/drain contact plug or a gate contact plug to a metal ion source solution during a manufacturing process, wherein a constituent metal of a metal ion in the metal ion source solution and the at least one source/drain contact plug or gate contact plug is the same. If the source/drain contact plug or the gate contact plug is formed of cobalt, the metal ion source solution includes a cobalt ion source solution. If the source/drain contact plug or the gate contact plug is formed of tungsten, the metal ion source solution includes a tungsten ion source solution.

Abstract: The invention relates to a new lactic acid bacteria (LAB), Lactobacillus fermentum PS150, and a bioactive protein produced by the LAB has advantageous effect in improving mood disorder, enhancing cognitive functions in brain and treating or preventing a neurodegenerative disease.

Abstract: The present disclosure provides systems and methods that leverage machine learning to perform user input motion prediction. In particular, the systems and methods of the present disclosure can include and use a machine-learned motion prediction model that is trained to receive motion data indicative of motion of a user input object and, in response to receipt of the motion data, output predicted future locations of the user input object. The user input object can be a finger of a user or a stylus operated by the user. The motion prediction model can include a deep recurrent neural network.

Abstract: Various embodiments relate to data packet compensation in multi-device media systems. A primary headphone device may include one or more communication interfaces configured to communicate with an audio source and a secondary headphone device. The primary headphone device may further include communication logic configured to transmit information to the secondary headphone device identifying one or more data packets received by the primary headphone device. The communication logic may also be configured to receive reporting information identifying one or more data packets missed by the secondary headphone device. Also, the communication logic may be configured to transmit compensation information for the one or more data packets missed by the secondary headphone device.

Abstract: The present disclosure relates to apparatus and methods for locking and/or unlocking a vehicle based on a location of a mobile device associated with the vehicle. In one embodiment a processor in a vehicle analyzes a position of a mobile device relative to the vehicle and allows the vehicle to be unlocked when the mobile device is determined to be approaching the vehicle.

Abstract: Aluminum-containing layers and systems and methods for forming the same are provided. In an embodiment, a method includes depositing an aluminum-containing layer on a substrate in a chamber by atomic layer deposition. The depositing further includes contacting the substrate with an aluminum-containing precursor in a first pulse having a first peak pulse flow rate and a first pulse width; contacting the substrate with a nitrogen-containing precursor; contacting the substrate with the aluminum-containing precursor in a second pulse having a second peak pulse flow rate and a second pulse width; and contacting the substrate with the nitrogen-containing precursor. The first peak pulse flow rate is greater than the second peak pulse flow rate. The first pulse width is smaller than the second pulse width.

Abstract: Melt stable polyaryletherketoneketone are prepared by from a reactive, lower molecular weight polyaryletherketoneketone having an ultraviolet absorbance at 455 nm of at least 0.185 when measured in 0.1% solution in dichloroaeetic acid.

Abstract: A forging device for molten metal includes first and second die bodies that are linked by first and second power arms to move back and forth in a cavity of a die base so as to open and close a workpiece shaping space defined between first and second die faces of the first and second die bodies. When the workpiece shaping space is opened, a molten metal is poured, and then the workpiece shaping space is closed to cast a semi-finished workpiece. After that, the first and second power arms axially press and forge the semi-finished workpiece in the workpiece shaping space into a high-strength workpiece. The high-strength workpiece is shaped by casting and forging in the same process.

Abstract: A package structure and method for forming the same are provided. The package structure includes a semiconductor die formed over a first side of an interconnect structure, and the semiconductor die has a first height. The package structure also includes a first stacked die package structure formed over the first side of the interconnect structure, and the first stacked die package structure has a second height. The second height is greater than the first height. The package structure includes a lid structure formed over the semiconductor die and the first stacked die package structure. The lid includes a main portion and a protruding portion extending from the main portion, and the protruding portion is directly over the semiconductor die.

Abstract: An embodiment device package includes a first die, a second die, and a molding compound extending along sidewalls of the first die and the second die. The package further includes redistribution layers (RDLs) extending laterally past edges of the first die and the second die. The RDLs include an input/output (I/O) contact electrically connected to the first die and the second die, and the I/O contact is exposed at a sidewall of the device package substantially perpendicular to a surface of the molding compound opposite the RDLs.

Abstract: Methods and systems for status determination are disclosed. Operational status of a node can be considered based on operational rates of a plurality of nodes in a system. An example method can comprise determining a first operational rate of a first node and determining a second operational rate of a second node. A difference between the first operational rate and the second operational rate can be analyzed. For example, the difference can be compared to a threshold to determine an operational status of the first node. If the difference is above the threshold, the operational status can be given a first value, but if the difference is below the threshold, the operational status can be given a second value. The operational status can be sent to a load balancer.

Abstract: A battery pack includes a case and a plurality of batteries, wherein the case includes a first body, a second body, and a connecting frame. The first body has a first opening. The second body has a second opening which could match with the first opening. A chamber is formed between the first body and the second body. The connecting frame is connected to the second body, and has a first connecting shaft and a second connecting shaft. The first connecting shaft is adapted to be connected to the first body, and the second connecting shaft is adapted to be connected to a mounting position. The batteries are disposed side by side in the chamber.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: Methods, systems, and apparatus for improving exchange systems. In one aspect, a method includes receiving data representing an exchange problem; determining, from the received data, an integer programming formulation of the exchange problem; mapping the integer programming formulation of the exchange problem to a quadratic unconstrained binary optimization (QUBO) formulation of the exchange problem; obtaining data representing a solution to the exchange problem from a quantum computing resource; and initiating an action based on the obtained data representing a solution to the exchange problem.

Abstract: Apparatus and methods are provided for efficient bandwidth adaptation for wideband carrier. In one novel aspect, the UE starts a BWP timer upon detecting one or more BWP timer starting triggering events, resets the BWP timer upon detecting BWP resetting triggering events, and switches to the default BWP upon expiration of the BWP timer. The BWP timer starting triggering events comprises decoding a command to switch away from the default BWP, the detection of end of DL data transmission in DRX mode. In another novel aspect, the UE only decodes the DCI indication for active BWP switching in the first three OFDM symbols of a subframe or a slot. In yet another novel aspect, when the SPS is configured for the serving cell for a UE with multiple BWPs, the SPS is configured for all the BWPs accordingly.

Abstract: A connector module adapted for a set-top box including a shielding case, a first connector disposed outside of the shielding case, an annular capacitor disposed between the first connector and the shielding case, and at least one ferrite core disposed in the shielding case and generating mutual inductance by coupling the shielding case is provided. The first connector being connected to a peripheral cable has a transmission cable penetrating into the shielding case. The annular capacitor is electrically connected between a grounding layer of the transmission cable and a grounding of a first circuit board of the set-top box. The transmission cable is connected to a second connector of the first circuit board after entering the shielding case and penetrating the ferrite core. A high frequency signal from the peripheral cable is transmitted to the first circuit board via the first connector, the transmission cable, and the second connector.

Abstract: A package structure including first and second packages is provided. The first package includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, and a plurality of conductive wire segments. The semiconductor die has an active surface and a back surface. The insulating encapsulant encapsulates the semiconductor die. The first redistribution layer is disposed on the back surface of the semiconductor die and a bottom surface of the insulating encapsulant. The first redistribution layer has a first surface and a second surface opposite to the first surface. The second redistribution layer is disposed on the active surface of the semiconductor die. The plurality of conductive wire segments electrically connects the semiconductor die to the second redistribution layer and the first redistribution layer to the second redistribution layer. The second package is stacked on the second surface of the first redistribution layer over the first package.

Abstract: A communications device includes a system ground plane, a signal source, a device frame, a magnetic conductive material and an antenna. The signal source is electrically coupled to the system ground plane. The device frame is perpendicular to the system ground plane. The antenna is electrically coupled to the signal source and is disposed on the device frame. The magnetic conductive material is disposed adjacent to the antenna but spaced apart by a first predetermined distance from the antenna. The magnetic line of force induced by the antenna is directed in a predetermined direction by the magnetic conductive material.

Abstract: A supporting device includes a dual-shaft hinge module and two buffering modules respectively arranged at two opposite sides of the dual-shaft hinge module. Each dual-shaft hinge module includes two shafts, a linking member clamped between the two shafts, and two side wing members respectively and slidably installed on the two shafts. The two buffering modules are respectively installed on the two shafts and are respectively cooperated with the two side wing members. Each buffering module includes an internal connecting member fixed on and synchronously rotatable with the corresponding shaft and an external connecting member slidably disposed on the internal connecting member and provided to be fixed on a carrying plate. Each side wing member has a limiting portion passing through the corresponding internal connecting member and the corresponding external connecting member.