Abstract: A system for automatically adjusting the print head gap of an impact printer, particularly for paper stocks of differing thicknesses and multi-layer forms, provides for measurement of an absolute distance between an undeflected platen position and a home position of the print head. Paper stock thickness is measured by measuring the distance to the home position from a position of the print head when a predetermined force is exerted by the print head against the platen. Since a similar measurement is made when paper stock is not present in the printer and using the same force against the platen, platen flexure is removed as a source of error and a standardized force is available for compression of the paper stock during measurement. Improved accuracy is achieved at high speed while avoiding the use of position encoder/decoder arrangements. A wider range of manufacturing variations in printer geometry and rigidity can be accommodated with uniformly improved print quality.

Abstract: A test apparatus for testing a know-good die integrated circuit is disclosed. The test apparatus uses conductive straps extending across trenches. The straps align with bond pads on the integrated circuit. When the bond pads are brought into contact with the straps, the straps exert a counterforce in the opposite direction to ensure a good electrical contact while testing the integrated circuit.

Abstract: A method and system for performing reflectance measurements of a sample using radiation having UV frequency components (preferably in a broad UV band) and visible frequency components (preferably in a broad band). Preferably, two detectors simultaneously receive a sample beam reflected from the sample surface. One detector generates a signal indicative of the sample beam components in the UV band and the other detector generates a signal indicative of the sample beam components in the visible band. By processing these two signals, the invention enables accurate measurement of the thickness of a very thin film on the sample. Preferably, the system determines a single effective wavelength for the UV radiation incident on the first detector and a single effective wavelength for the visible radiation incident on the second detector. Embodiments of the system can also measure reflectance spectra and refractive indices, and can determine lithographic exposure times.

Abstract: A catheter suitable for the delivery of laser energy to an obstruction in a body lumen is provided, which has an expandable, elastic distal end portion containing optical fibers whose exposed distal end faces are arranged in two or more substantially concentric arrays that merge into a narrower band array of a larger diameter upon radial expansion of the elastic distal end portion. The distal end portion of the catheter is more elastomeric than the catheter body.

Abstract: A process for bonding a flip chip (20) to a substrate (22) comprising positioning the flip chip (20) above the substrate (22). The flip chip (20) has an active face provided with conductive bumps so that its active face is oriented toward the substrate (22). The flip chip (20) is placed on the substrate (22) so that the bumps align with a bonding pattern on the substrate (22). An ultrasonic horn (30) is lowered having a flat surface onto a back side of the flip chip (20). Force is applied through the ultrasonic horn (30) to the back side of the flip chip (20), which is normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the force is applied so that the ultrasonic energy is isothermally transferred across the flip chip (20) to the substrate (22) and a diffusion bond is created therebetween.

Abstract: Provided is a method and apparatus for electrically detecting the location of bond failure and wire breakage occurring during tensile strength testing of a wire sample having first and second bond foots affixed to respective first and second support pads. The method and apparatus monitors the voltage levels of first and second electrically conductive probes. The first probe has a primary lead in electrical contact with the first support pad and a secondary lead in electrical contact with the first bond foot. Similarly, the second electrically conductive probe has a primary lead in electrical contact with the second support pad and a secondary lead in electrical contact with the second bond foot. Voltage detection circuitry is provided in electrical contact with the first and second probes for detecting the voltage level at each of the respective primary and secondary leads to generate the respective corresponding output signals.

Abstract: Thermal recording material containing a suitable substrate coated with an image forming layer. The image forming layer contains a thermally reducible source of silver, a 3-indazolinone or urea compound; a polymeric binder; and optionally, an auxiliary reducing agent and toner. Preferably, an anti-stick layer is coated on top of the imaging layer.The 3-indazolinone and urea compounds have been found to enhance the thermal image forming capability of thermal recording material.

Abstract: Photothermographic articles containing interfacial barriers comprising a layer of a polymeric organic acid containing carboxyl and/or sulfo groups in direct contact with an adjacent layer comprising a basic polymer capable of forming hydrogen bonds with the polymeric organic acid are disclosed. A crosslinked barrier is formed at the interface between the layers which has substantial impermeability to chemical diffusion.

Abstract: A printed circuit (pc) board (105) having at least two layers, wherein proper assembly and alignment of the at least two layers may be visually verified, comprises a first layer (410) having a first printed circuit pattern (305) formed thereon, the first printed circuit pattern (305) including a first identifier (115) formed along at least one edge (405) of the first layer (410). The pc board (105) further comprises a second layer (420) having a second printed circuit pattern (305) formed thereon, the second printed circuit pattern (305) including a second identifier (120) formed along at least one edge (405) of the second layer (420), the second identifier (120) being visibly aligned with the first identifier (115) in a predetermined alignment to indicate that the first layer (410) and the second layer (420) are correctly laminated.

Abstract: Spread spectrum receiver includes a delay locked loop (DLL) circuit for holding the synchronization of a despread signal with a received spread spectrum signal. The DLL circuit comprises a subtracter for generating a signal representative of a subtraction between first and second correlation signals, a positive feedback amplifier for amplifying the subtraction representative signal and a window comparator for producing a lock signal when the subtraction representative signal is positioned within a window width.

Abstract: Radiation sensitive thermally developable imaging elements comprise:(a) photosensitive silver halide,(b) light insensitive silver salt oxidizing agent,(c) reducing agent for silver ions, and(d) an antifoggant or speed enhancing compound comprising iodophthalazinone compounds. The antifoggants are effective in reducing spurious background image densities.

Abstract: A system interconnects electronic modules with one another, to a power supply and to signal lines through a printed circuit board. The modules are electrically connected to traces on the printed circuit board using blind mateable connectors. EMI shielding plates are mounted to the circuit board at the I/O connectors for the external cables. Guide elements, such as pin and socket guides and printed circuit board edge guides, are mounted to the circuit board to guide the blind mateable connectors. The syustem eliminates the numerous cables which would otherwise be required. The printed circuit board is mounted within the system housing and acts as an air duct barrier to aid proper air circulation. The circuit board also acts as a structured element helping to stabilize the housing and various module supports and serves as a mounting structure for various elements, such as cooling fans.

Abstract: An autofocusing system for a microscope is disclosed. An autofocus target is placed between a colliminating lens and a relay lens of the microscope. The autofocus target contains a pattern of dark areas which are projected onto a specimen and reflected into a CCD camera array. The focus of the microscope is adjusted such that the variation in intensity of light through the pattern is maximized.

Abstract: A system interconnects electronic modules with one another, to a power supply and to signal lines through a printed circuit board. The modules are electrically connected to traces on the printed circuit board using blind mateable connectors. EMI shielding plates are mounted to the circuit board at the I/O connectors for the external cables. Guide elements, such as pin and socket guides and printed circuit board edge guides, are mounted to the circuit board to guide the blind mateable connectors. The system eleminates the numerous cables which would otherwise be required. The printed circuit board is mounted within the system housing and acts as an air duct barrier to aid proper air circulation. The circuit board also acts as a structured element helping to stabilize the housing and various module supports and serves as a mounting structure for various elements, such as cooling fans.

Abstract: An automatic system for performing sheet resistivity testing on surface layers of semiconductor wafers, including a wafer handling stage having a platform for carrying a semiconductor wafer, and an arrangement for mounting the platform for rotation about a central axis and for translation of the platform orthogonal to a major surface thereof. A platform drive translates the platform between a wafer test position and a wafer load position, and a stage drive rotates the platform to accurately located angular test positions. A probe handling arrangement includes a carriage for carrying a test probe parallel to the major surface of a wafer on the platform and a carriage drive translates the carriage between a parked position in which a test prove thereon is positioned adjacent and clear of the platform and accurately located test positions along a radius of the platform. The carriage carries a resistivity test probe which includes test probe element for contacting the surface of a semiconductor wafer.

Abstract: Method for preparing photosensitive silver halide crystals. A binder resin, a source of halide ions, and a source of silver ions are dissolved in an organic solvent, e.g., ethanol. Silver halide nuclei will then form. Additional source of halide ions and additional source of silver ions can be added to the solution in incremental additions, so that the initially-formed silver halide nuclei will grow. Upon removal of the solvent, the silver halide crystals will exist in a dry state, entrapped in the binder resin. Silver halide crystals formed and grown in this manner can be used to prepare photothermographic imaging compositions, which compositions will exhibit higher speed than photothermographic imaging compositions containing silver halide crystals grown according to conventional methods.

Abstract: Method for preparing photosensitive silver halide crystals. A binder resin, a source of halide ions, and a source of silver ions are dissolved in an organic solvent, e.g., ethanol. Silver halide nuclei will then form. Additional source of halide ions and additional source of silver ions can be added to the solution in incremental additions, so that the initially-formed silver halide nuclei will grow. Upon removal of the solvent, the silver halide crystals will exist in a dry state, entrapped in the binder resin. Silver halide crystals formed and grown in this manner can be used to prepare photothermographic imaging compositions, which compositions will exhibit higher speed than photothermographic imaging compositions containing silver halide crystals grown according to conventional methods.

Abstract: An insulated electrical member adapted for high voltage use is made by (1) covering a conducting member having a porous layer disposed thereon with a non-linear stress grading composition comprising cycloaliphatic epoxy resin, non-linear silicon carbide and an effective amount of curing agent, (2) curing the non-linear stress grading composition at up to about 130.degree. C., (3) impregnating the porous layer with a reactive insulating resin composition containing polar components, such that the resin composition contacts the non-linear stress grading composition, and (4) heating the covered, impregnated electrical member to cure the insulating resin composition, where the non-linear stress grading composition after insulating resin cure is characterized as remaining adherent to the member.