Abstract: The embodiments of the present disclosure provide an array substrate and a method for manufacturing the same, and a display device. The array substrate includes a substrate, wherein the substrate has a display region and a peripheral region surrounding the display region, the display region has a plurality of pixels arranged in an array, and each of the plurality of pixels includes a light transmission region and a light shielding region, and a light shielding block covering at least a part of the light transmission region of at least one pixel close to the peripheral region of the plurality of pixels.

Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.

Abstract: A mixer with a filtering function and a method for linearization of the mixer are provided. The mixer includes at least one amplifier, a transconductance device and a feedback network. The at least one amplifier is configured to output a filtered voltage signal according to an input voltage signal. The transconductance device is coupled to the at least one amplifier, and is configured to generate a filtered current signal according to the filtered voltage signal. The feedback network is coupled between any output terminal among at least one output terminal of the transconductance device and an input terminal of the at least one amplifier. More particularly, the mixer is configured to output a modulated signal according to the filtered current signal.

Abstract: This disclosure provides modified T cells possessing both cell killing function and antigen presenting cell function and method of culturing the same. By administration of the modified T cell, cancer cells in a subject may be effectively inhibited via cell-mediated immunity.

Abstract: A drive assembly with reduced size and reduced noise includes a bottom box, an elastic member, a movable plate, a PCB board, and a plurality of shape memory alloy wires. The bottom box comprises a bottom plate and a plurality of side plates. The plurality of side plates is arranged on a side of the bottom plate to form a receiving groove, the plurality of side plates defines a position groove connects to the receiving groove. The elastic member, the movable plate, the plurality of shape memory alloy wires, and a partial of the rigid printed circuit board are located within the receiving groove, another partial of the rigid printed circuit board is disposed with the position groove. The elastic member connects between the bottom plate and the movable plate, the plurality of shape memory alloy wires connects between the movable plate and the rigid printed circuit board.

Abstract: A dustproof member includes a base plate, a dustproof plate, and a connecting portion. A first through hole is defined by an inner surface of the base plate. A second through hole is defined by an inner surface of the dustproof plate. The connecting portion has a shape of a hollow barrel and defines a hollow cavity. Two opposite ends of the connecting portion are respectively connected to an end of the inner surface of the base plate and an end of the inner surface of the dustproof plate, thereby forming a dust collecting groove between the base plate and the dustproof plate. A camera module having the dustproof member and an electronic device having the camera module are also provided.

Abstract: This application discloses a knowledge graph-based case retrieval method, device and equipment, and a storage medium. The method includes: constructing a legal case knowledge graph based on text information; performing random-walk sampling on node set data constructed based on the legal case knowledge graph, so as to obtain a plurality of pieces of sequence data; training a model by using a word2vec algorithm based on the plurality of pieces of sequence data, so as to obtain an updated target model; obtaining target text information, and analyzing the target text information by using the target model, so as to construct a to-be-retrieved knowledge graph; retrieving the legal case knowledge graph based on the to-be-retrieved knowledge graph, so as to obtain case information associated with the to-be-retrieved knowledge graph; and obtaining outputted case information based on a first similarity and a second similarity of the case information.

Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.

Abstract: A method includes forming a first metallic feature, forming a dielectric layer over the first metallic feature, etching the dielectric layer to form an opening, with a top surface of the first metallic feature being exposed through the opening, and performing a first treatment on the top surface of the first metallic feature. The first treatment is performed through the opening, and the first treatment is performed using a first process gas. After the first treatment, a second treatment is performed through the opening, and the second treatment is performed using a second process gas different from the first process gas. A second metallic feature is deposited in the opening.

Abstract: A semiconductor device includes a bottom electrode; a magnetic tunneling junction (MTJ) element over the bottom electrode; a top electrode over the MTJ element; and a sidewall spacer abutting the MTJ element, wherein at least one of the bottom electrode, the top electrode, and the sidewall spacer includes a magnetic material.

Abstract: Methods, systems, and devices for wireless communications are described. A transmitter may transmit a payload in transmission to the base station in a wireless communications system. The transmitter may identify a payload to include in the transmission to the base station. The transmitter may determine to transmit the transmission using an orthogonal sequence codebook or a non-orthogonal sequence codebook, based on a size of the payload, a control message from the base station to the transmitter, or a combination of these. The transmitter may then transmit the transmission to the base station based on whether the transmission is to use the orthogonal sequence codebook or the non-orthogonal sequence codebook. The transmission may be a noncoherent transmission. The transmission may be an uplink control information transmission, an uplink data transmission, a downlink control information transmission, or a downlink data transmission.

Abstract: A hinge structure applied to an electronic device having a first component and a second component is provided. The hinge structure includes a torque hinge and a one-way pivoting mechanism. The torque hinge includes a first base and a first rotation element. The first base connects to the first component. The first rotation element rotatably connects to the first base. The second component pivotally connects to the first rotation element through the one-way pivoting mechanism.

Abstract: A semiconductor device having an improved source/drain region profile and a method for forming the same are disclosed. In an embodiment, a method includes etching one or more semiconductor fins to form one or more recesses; and forming a source/drain region in the one ore more recesses, the forming the source/drain region including epitaxially growing a first semiconductor material in the one or more recesses at a temperature of 600° C. to 800° C., the first semiconductor material including doped silicon germanium; and conformally depositing a second semiconductor material over the first semiconductor material at a temperature of 300° C. to 600° C., the second semiconductor material including doped silicon germanium and having a different composition than the first semiconductor material.

Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die and a plurality of bumps. The first semiconductor die has a front side and a backside opposite to each other. The second semiconductor die is disposed at the backside of the first semiconductor die and electrically connected to first semiconductor die. The plurality of bumps is disposed at the front side of the first semiconductor die and physically connects first die pads of the first semiconductor die. A total width of the first semiconductor die may be less than a total width of the second semiconductor die.

Abstract: Light from a light source that has interacted with a sample of downhole fluid provided in a downhole optical tool is sequentially passed through a plurality of groups of light filters, each of the groups of light filters including of one or more light filters, to generate a data set for each of the groups of light filters, also referred to as a simultaneous channel group. The data generated for each of the simultaneous channel groups is then analyzed to determine if the data from that simultaneous channel groups is effective in providing information useful for the analysis of the sample of downhole fluid.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: The invention belongs to the technical field of aerospace product machinery manufacturing. Disclosed are on-machine three-dimensional profiling machining device for complex-configured composite material pipelines and an application method thereof. The on-machine three-dimensional profiling of the complex-configured composite material pipelines is In the shape machining device, a precision lifting rod is installed on the linear motion module, and a depth vision system is installed on the precision lifting rod; a precision linear motion table and a radial motion module are installed at the left end of the on-machine measurement hollow machining structure, laser displacement sensor probe, and the eddy current sensor probe is installed on the left end of the hollow machining structure for on-machine measurement through mounting bolts. The invention has the advantages of high integration, simple operation, convenience and practicality.

Abstract: An air pollution forecast management system including an air quality management device and an Internet of Things (IOT) cloud platform is disclosed. The air quality management device includes a dust particle sensing module being configured to sense gas exhausted from a smoke exhaust flue. The IoT cloud platform is configured to compute, at a second time after a first time, an exhaust gas set of the gas drifting from the first time to the second time by using current-observed meteorological data at the second time, receive a plurality of air-pollution sets at a plurality of geographic locations at the second time, compute a plurality of influencing results of the plurality of air-pollution sets respectively associated with the exhaust gas set, and generate a feedback instruction according to at least one of the plurality of influencing results to control gas emission of the smoke exhaust flue.