Abstract: A defect inspection method, an inspection system, and a non-transitory computer-readable storage medium are provided. The defect inspection method includes providing a processed image and a reference image of a wafer, both the processed image and the reference image comprising a pattern of interest; determining the processed image as a qualified image in response to a matching ratio that reflects a percentage of correctly aligned features of the pattern of interest between the processed image and the reference image is above a first predetermined threshold; selecting a first feature of the qualified image; selecting a second feature of the reference image corresponding to the first feature of the processed image; comparing the qualified image with the reference image to determine a variation of the first feature with respect to the second feature; and detecting a defect of the wafer based on a comparison of the first and second features.

Abstract: A defect inspection method is disclosed. The method includes acquiring a plurality of first images of a first specimen in a first resolution. The method includes acquiring a plurality of second images of the first specimen in a second resolution, the second resolution being different from the first resolution. The method includes training a machine learning model with a training set, wherein the training set comprises at least the plurality of first images of the first specimen and the plurality of second images of the first specimen. The method includes acquiring a third image of a second specimen in the first resolution. The method includes inputting the third image into the trained machine learning model. The method includes generating, based on the trained machine learning model, a fourth image of the second specimen in the second resolution.

Abstract: An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface.

Abstract: A method includes inspecting a wafer to find a first potential defect having a first wafer coordinate, and capturing a patch image of the first potential defect from the wafer. The patch image is compared with patterns of a wafer representation to find a first layout coordinate of a location in the wafer representation, wherein the location in the wafer representation corresponds to a location of the first potential defect in the wafer. A reference feature in the wafer representation is selected, wherein the reference feature in the wafer representation has a second layout coordinate. A coordinate difference between the first layout coordinate and the second layout coordinate is calculated. The coordinate difference is subtracted from the first wafer coordinate to calculate a second wafer coordinate of a reference feature in the wafer, wherein the reference feature in the wafer representation corresponds to the reference feature in the wafer.

Abstract: An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface.

Abstract: A method for detecting photoresist residue during semiconductor device manufacture includes developing photoresist on a surface of a semiconductor device to expose portions of the surface A plurality of etch paths are then partially etched into the surface and inspected to determine their depths.

Abstract: A method for detecting photoresist residue during semiconductor device manufacture includes developing photoresist on a surface of a semiconductor device to expose portions of the surface A plurality of etch paths are then partially etched into the surface and inspected to determine their depths.