Abstract: In an embodiment a method for producing a component having a carrier and at least one component part electrically conductively connected to the carrier and mechanically fixed to the carrier by an electrically insulating bonding layer includes providing the carrier having a connection layer, wherein the bonding layer is disposed on the carrier and has at least one opening, wherein a connection surface of the connection layer is exposed, and wherein the bonding layer projects vertically beyond the exposed connection surface or vice versa, applying the component part having a contact layer on the carrier in such that, in top view of the carrier, an exposed contact surface of the contact layer covers the opening and the connection surface located therein, wherein the exposed contact surface is spaced apart from the exposed connection surface by a vertical distance and reducing the vertical distance by changing a volume of the bonding layer such that the exposed contact surface and the exposed connection surface a

Abstract: In an embodiment a device for transferring at least one semiconductor component from a carrier substrate to a target substrate includes at least one lighting device configured to emit a first light pulse onto the semiconductor component to release it from the carrier substrate and to move it towards the target substrate, the semiconductor component comprising at least one contact surface, which corresponds to at least one contact surface on the target substrate and at least one of the contact surfaces comprising a solder material and to emit a second light pulse after the first light pulse, the second light pulse configured to melt the solder material on the at least one of the contact surfaces before the semiconductor component reaches the target substrate.

Abstract: In an embodiment a target carrier for transferring semiconductor components includes a target substrate with at least two contact areas and a shrinkable collecting layer arranged around each of the at least two contact areas and projecting beyond the at least two contact areas, wherein a lateral distance between two opposite edges of the shrinkable collecting layer around each of the at least two contact areas is smaller than a lateral dimension of the at least one contact pad of the semiconductor components, wherein the shrinkable collecting layer around the at least two contact areas is designed such that its structuring is configured to penetrate into the shrinkable collecting layer with a substantially central alignment of the at least one contact pad relative to one of the at least two contact areas.

Abstract: The disclosure relates to a method for designing a stator segment for a stator of an m-phase synchronous reluctance machine with concentrated windings, the stator being divided into a stator segment or a plurality of stator segments and comprising a ferromagnetic base body with peripherally distributed tooth structures and a winding system mounted in the base body, which comprises, per stator segment, z tooth structures and a number of winding phases (U, V, W) corresponding to the number of phases m, each of said winding phases comprising a series connection and/or a parallel connection of a plurality of the concentrated windings, a rotor of the synchronous reluctance machine comprising a pole number p in a peripheral section corresponding to the stator segment.

Abstract: In an embodiment a method for producing a component having a carrier and at least one component part electrically conductively connected to the carrier and mechanically fixed to the carrier by an electrically insulating bonding layer includes providing the carrier having a connection layer, wherein the bonding layer is disposed on the carrier and has at least one opening, wherein a connection surface of the connection layer is exposed, and wherein the bonding layer projects vertically beyond the exposed connection surface or vice versa, applying the component part having a contact layer on the carrier in such that, in top view of the carrier, an exposed contact surface of the contact layer covers the opening and the connection surface located therein, wherein the exposed contact surface is spaced apart from the exposed connection surface by a vertical distance and reducing the vertical distance by changing a volume of the bonding layer such that the exposed contact surface and the exposed connection surface a

Abstract: The invention relates to an arrangement in the form of an electric ring machine in the implementation of a reluctance machine which is operated as a synchronous reluctance machine, in which recesses are formed at the outer side of the rotor sheets in the radial extension opposite to the inner barriers. These result in webs which hold and enclose the barriers and can thus be manufactured in a defined manner at both sides, even if the finished assembled rotor design is later finally mechanically reworked at the outer side. In addition to the rotor, the invention also relates to a corresponding electric ring machine and a method for producing such a rotor.

Abstract: The disclosure relates to a method for designing a stator segment for a stator of an m-phase synchronous reluctance machine with concentrated windings, the stator being divided into a stator segment or a plurality of stator segments and comprising a ferromagnetic base body with peripherally distributed tooth structures and a winding system mounted in the base body, which comprises, per stator segment, z tooth structures and a number of winding phases (U, V, W) corresponding to the number of phases m, each of said winding phases comprising a series connection and/or a parallel connection of a plurality of the concentrated windings, a rotor of the synchronous reluctance machine comprising a pole number p in a peripheral section corresponding to the stator segment.