Abstract: The invention relates to a process for forming a conductive track or coating on a substrate, comprising: applying a conductive paste to the substrate, the conductive paste comprising a solids portion dispersed in an organic medium, the solids portion comprising particles of electrically conductive material and an inorganic particle mixture comprising substantially crystalline particles of two or more different metal compounds, wherein the inorganic particle mixture includes substantially crystalline particles of a tellurium compound and is substantially lead free; and firing the applied conductive paste on the surface of the substrate with a firing profile in which the temperature of the surface of the applied conductive paste exceeds 500° C. for a period of two minutes or less. The invention further relates to a substrate having a conductive track or coating formed thereon.

Abstract: The present invention relates to a conductive paste for forming a conductive track or coating on a substrate, particularly suitable for use in solar cells. The paste comprises a solids portion dispersed in an organic medium, the solids portion comprising electrically conductive material and an inorganic particle mixture wherein the inorganic particle mixture comprises substantially crystalline particles. The present invention also relates to a method of preparing a conductive paste, a method for the manufacture of a surface electrode of a solar cell, an electrode for a solar cell and a solar cell.

Abstract: The present invention relates to a conductive paste for forming a conductive track or coating on a substrate, particularly suitable for use in solar cells. The paste comprises a solids portion dispersed in an organic medium, the solids portion comprising electrically conductive material and an inorganic particle mixture wherein the inorganic particle mixture comprises substantially crystalline particles. The present invention also relates to a method of preparing a conductive paste, a method for the manufacture of a surface electrode of a solar cell, an electrode for a solar cell and a solar cell.

Abstract: The present invention relates to a conductive paste for forming a conductive track on a substrate, the paste comprising a solids portion dispersed in an organic medium, the solids portion comprising an electrically conductive material, particles of a glass fit and particles of a tellurium compound. The invention further relates to methods for preparing such a paste, to a method of manufacturing an electrode on a surface of a solar cell, and to a solar cell having an electrode formed thereon.

Abstract: The present invention relates to a conductive paste for forming a conductive track on a substrate, the paste comprising a solids portion dispersed in an organic medium, the solids portion comprising an electrically conductive material, particles of a glass fit and particles of a tellurium compound. The invention further relates to methods for preparing such a paste, to a method of manufacturing an electrode on a surface of a solar cell, and to a solar cell having an electrode formed thereon.

Abstract: The invention relates to a process for forming a conductive track or coating on a substrate, comprising: applying a conductive paste to the substrate, the conductive paste comprising a solids portion dispersed in an organic medium, the solids portion comprising particles of electrically conductive material and an inorganic particle mixture comprising substantially crystalline particles of two or more different metal compounds, wherein the inorganic particle mixture includes substantially crystalline particles of a tellurium compound and is substantially lead free; and firing the applied conductive paste on the surface of the substrate with a firing profile in which the temperature of the surface of the applied conductive paste exceeds 500° C. for a period of two minutes or less. The invention further relates to a substrate having a conductive track or coating formed thereon.

Abstract: The present invention relates to a conductive paste for forming a conductive track or coating on a substrate, particularly suitable for use in solar cells. The paste comprises a solids portion dispersed in an organic medium, the solids portion comprising electrically conductive material and an inorganic particle mixture wherein the inorganic particle mixture comprises substantially crystalline particles. The present invention also relates to a method of preparing a conductive paste, a method for the manufacture of a surface electrode of a solar cell, an electrode for a solar cell and a solar cell.

Abstract: The present invention relates to conductive pastes, suitable for use in solar cells, a method for the manufacture of a light receiving surface electrode of a solar cell, a light receiving electrode for a solar cell and a solar cell. The paste comprises a solids portion dispersed in an organic medium, the solids portion comprising electrically conductive metal, and mixed oxide, wherein the mixed oxide is a tellurium-bismuth-cerium mixed oxide and is substantially lead-free and substantially silicon-free.

Abstract: The present invention relates to conductive pastes suitable for use in solar cells, to a method of manufacturing a light receiving surface electrode of a solar cell, and to a light receiving surface of a solar cell. The paste includes a mixed oxide (e.g. a glass frit) which includes lead, tellurium, bismuth and at least 0.5 wt % in total of WO3, MoO3, CeO2 and BaO.

Abstract: A method for producing an MWT-PERC solar cell is provided, in which openings in the substrate of the solar cell have contact passages and emitter regions that are present on the back side of the solar cell are completely removed outside the contact passages and a dielectric layer is applied on the back side, whereby a paste, which does not act in an electrically contacting manner opposite the substrate, is used for the contact passages.

Abstract: A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.

Abstract: A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.

Abstract: A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.

Abstract: A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.