Patents by Inventor Tobias Fey

Tobias Fey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMPLANT
    Publication number: 20200246148
    Abstract: The invention relates to an implant for replacing bone or cartilage material, which is constituted by a plurality of elements (B, B1, B2, B3, B4) produced from a non-metallic, linearly elastic material, an element (B, B1, B2, B3, B4) being connected to adjacent elements (B, B1, B2, B3, B4) by a viscoelastic polymer material such that gaps (L) remain between the adjacent elements (B, B1, B2, B3, B4) and that the adjacent elements (B, B1, B2, B3, B4) can move relative to one another.
    Type: Application
    Filed: October 18, 2018
    Publication date: August 6, 2020
    Inventors: Kolja GELSE, Tobias FEY, Gerhard KRÖNKE, Arnd KLEYER, Axel HUEBER, Nina RENNER, Milena PACHOWSKY, Jonas BIGGEMANN, Carina SCHOLTYSEK, Peter GREIL, Georg SCHETT, Marc PEZOLDT, Martin STUMPF
  • Ceramic bone substitute material and method for the production thereof
    Patent number: 10328181
    Abstract: A method for producing a ceramic osseoconductive bone substitute material, the bone substitute material, intervertebral disk implants containing the substitute bone material, and to methods of using the bone substitute material.
    Type: Grant
    Filed: April 28, 2014
    Date of Patent: June 25, 2019
    Assignees: CERAMTEC GMBH, FRIDRICH-ALEXANDER-UNIVERSITÄT ERLANGEN-NÜRNBERG
    Inventors: Heinrich Wecker, Alfons Kelnberger, Peter Greil, Tobias Fey, Johanna Schmidt, Bodo Zierath
  • BONE REPLACEMENT MATERIAL AND METHOD FOR PRODUCING BONE REPLACEMENT MATERIAL
    Publication number: 20160151161
    Abstract: A ceramic bone replacement material and to a generative method for producing said bone replacement material, in particular ceramic bone replacement materials used in implants and preferably in spinal column implants. Generative manufacturing methods make it possible to shape the structures of the bone replacement.
    Type: Application
    Filed: June 25, 2014
    Publication date: June 2, 2016
    Inventors: Kathrin Lorenz, Tobias Fey, Peter Greil, Heinrich Wecker, Alfons Kelnberger
  • CERAMIC BONE SUBSTITUTE MATERIAL AND METHOD FOR THE PRODUCTION THEREOF
    Publication number: 20160067381
    Abstract: A method for producing a ceramic osseoconductive bone substitute material, the bone substitute material, intervertebral disk implants containing the substitute bone material, and to methods of using the bone substitute material.
    Type: Application
    Filed: April 28, 2014
    Publication date: March 10, 2016
    Inventors: Heinrich Wecker, Alfons Kelnberger, Peter Greil, Tobias Fey, Johanna Schmidt, Bodo Zierath
  • Semiconductor arrangement
    Patent number: 8564126
    Abstract: A semiconductor arrangement, in particular a power semiconductor arrangement, in which a semiconductor having a top side provided with contacts is connected to an electrical connection device formed from a film assembly wherein an underfill is provided between the connection device and the top side of the semiconductor. The underfill has a matrix formed from a preceramic polymer.
    Type: Grant
    Filed: February 11, 2010
    Date of Patent: October 22, 2013
    Assignee: Semikron Elektronik GmbH & Co. KG
    Inventors: Christian Goebl, Heiko Braml, Ulrich Herrmann, Tobias Fey
  • Semiconductor Arrangement
    Publication number: 20100264537
    Abstract: A semiconductor arrangement, in particular a power semiconductor arrangement, in which a semiconductor having a top side provided with contacts is connected to an electrical connection device formed from a film assembly wherein an underfill is provided between the connection device and the top side of the semiconductor. The underfill has a matrix formed from a preceramic polymer.
    Type: Application
    Filed: February 11, 2010
    Publication date: October 21, 2010
    Applicant: SEMIKRON Elektronik GmbH & Co. KG
    Inventors: Christian GOEBL, Heiko Braml, Ulrich Herrmann, Tobias Fey