Patents by Inventor Tobias Gamon

Tobias Gamon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and Device for Producing an Edge Structure of a Semiconductor Component
    Publication number: 20220416019
    Abstract: A method for producing an edge structure of a semiconductor component includes: providing a semiconductor body having at least two mutually spaced-apart main faces respectively having an edge, between which edges an edge face extends; and etching a predetermined edge contour by purposely applying a chemical etchant onto the edge face by an etchant jet with simultaneous rotation of the semiconductor body about a rotation axis. The etchant jet is guided with a predetermined jet cross section, while being directed tangentially with respect to the edge face, such that the etchant jet impinges on the edge face only with a part of the jet cross section. A corresponding device for producing an edge structure of a semiconductor component is also described.
    Type: Application
    Filed: June 16, 2022
    Publication date: December 29, 2022
    Inventors: Tobias Gamon, Reiner Barthelmess, Uwe Kellner-Werdehausen, Sebastian Sommer
  • System and method for producing devices including a semiconductor part and a non-semiconductor part
    Patent number: 9659798
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: May 23, 2017
    Assignee: Infineon Technologies AG
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner
  • System and Method for Producing Devices Including a Semiconductor Part and a Non-Semiconductor Part
    Publication number: 20120284977
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Application
    Filed: July 25, 2012
    Publication date: November 15, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner
  • System and method for producing devices including a semiconductor part and a non-semiconductor part
    Patent number: 8309465
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: November 13, 2012
    Assignee: Infineon Technologies AG
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner
  • System and Method for Producing Devices Including a Semiconductor Part and a Non-Semiconductor Part
    Publication number: 20120186052
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Application
    Filed: January 21, 2011
    Publication date: July 26, 2012
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner