Patents by Inventor Tobias Hehn

Tobias Hehn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240161946
    Abstract: The invention relates to a 3D inkjet printing process for producing a component with a conductor body and an insulating body. The invention further relates to a component produced using the method. For reasons of simplicity, the application refers to the conductor body and the insulating body in the singular, which includes the plural.
    Type: Application
    Filed: November 10, 2023
    Publication date: May 16, 2024
    Inventors: Tobias Hehn, Felix Zimmer, Jens Holtmannspötter, Andreas Salomon, Rolf Baltes
  • Publication number: 20220314536
    Abstract: A structure comprises: a plurality of substructures and a vernier-based position marker. The plurality of substructures include a first substructure, a second substructure, and at least one electronic component. The second substructure is at least partially additively manufactured on the first substructure. The vernier-based position marker is configured to indicate a relative offset between the first substructure and the second substructure.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 6, 2022
    Inventors: Jörg Sander, Rolf Baltes, Andreas Salomon, Felix Zimmer, Tobias Hehn