Abstract: Microelectromechanical device with a carrier substrate having a substrate surface (100a), and plural MEMS modules (120. Each module includes an ASIC layer (140) having a front side (140a) and a rear side (140b). A baseplate (160) has a front side (160a) and a rear side (160b), a plurality of microelectromechanical components (130) have rear sides (130b). The baseplate rear side is cohesively connected to the ASIC layer front side with electrical contacts (144). The components are arranged on the baseplate front side with their component rear sides. The contacts are partly encompassed by a frame (195) arranged between baseplate and ASIC layer. The ASIC layer has an ASIC controlling the components. The ASIC is electrically connected to the components using a portion of the contacts. The modules are arranged on the substrate surface and the ASIC layer rear sides of the modules are connected to the substrate surface.

Abstract: A method for producing a plurality of sensor devices. The method includes: furnishing a substrate having contact points in a plurality of predetermined regions for sensor chips; disposing the sensor chips in the predetermined regions on the substrate, and electrically contacting the sensor chips to the contact points; attaching a frame structure with an adhesive material on the substrate and between the sensor chips, the frame structure proceeding laterally around the sensor chips, the frame structure extending, after attachment, vertically beyond the sensor chips and forming a respective cavity for at least one of the sensor chips, and a membrane spanning at least one of the cavities for the sensor chips so as to cover it; and singulating the substrate, or the frame structure and the substrate, around the respective cavities into several sensor devices.

Abstract: A micromechanical component having a printed circuit board with a main extension plane, having an ASIC chip and a MEMS chip, which are arranged parallel to the main extension plane, wherein the ASIC chip is arranged above the printed circuit board, and the MEMS chip is arranged above the ASIC chip, wherein the ASIC chip is electrically contacted to the printed circuit board in a bonding region by bonding wires. An adapter chip is arranged between the ASIC chip and the MEMS chip, which adapter chip at least partially covers the bonding region in a z-direction perpendicular to the main extension plane. A method for producing a micromechanical component is also described.

Abstract: A method for manufacturing a MEMS sensor. The method includes: providing a substrate, applying a support layer onto a back side of the substrate, forming at least one cavity in the substrate in such a way that an access to the back side from the front side is formed, introducing a MEMS structure into the at least one cavity, and fixing the MEMS structure on the support layer.

Abstract: A method for producing a plurality of sensor devices. The method includes: furnishing a substrate having contact points in a plurality of predetermined regions for sensor chips; disposing the sensor chips in the predetermined regions on the substrate, and electrically contacting the sensor chips to the contact points; attaching a frame structure with an adhesive material on the substrate and between the sensor chips, the frame structure proceeding laterally around the sensor chips, the frame structure extending, after attachment, vertically beyond the sensor chips and forming a respective cavity for at least one of the sensor chips, and a membrane spanning at least one of the cavities for the sensor chips so as to cover it; and singulating the substrate, or the frame structure and the substrate, around the respective cavities into several sensor devices.

Abstract: A method for manufacturing a MEMS sensor. The method includes: providing a substrate, applying a support layer onto a back side of the substrate, forming at least one cavity in the substrate in such a way that an access to the back side from the front side is formed, introducing a MEMS structure into the at least one cavity, and fixing the MEMS structure on the support layer.

Abstract: A micromechanical pressure sensor, having a sensor core formed in a silicon substrate in a pressure-sensitive region, having a sensor membrane, a first cavity being formed in the silicon substrate on the sensor membrane; a second cavity formed between a rear-side surface of the silicon substrate and the sensor core, access holes that go out from the rear-side surface of the silicon substrate being connected to the second cavity; and at least one anchoring recess going out from the rear-side surface being formed in an anchoring region of the silicon substrate surrounding the pressure-sensitive region, the anchoring recess being formed such that a molding compound can flow into the anchoring recess.

Abstract: A micromechanical pressure sensor, having a sensor core formed in a silicon substrate in a pressure-sensitive region, having a sensor membrane, a first cavity being formed in the silicon substrate on the sensor membrane; a second cavity formed between a rear-side surface of the silicon substrate and the sensor core, access holes that go out from the rear-side surface of the silicon substrate being connected to the second cavity; and at least one anchoring recess going out from the rear-side surface being formed in an anchoring region of the silicon substrate surrounding the pressure-sensitive region, the anchoring recess being formed such that a molding compound can flow into the anchoring recess.