Abstract: An optical communication unit for sending and receiving optical communication signals is described. The optical communication unit includes an optical unit, an elevation drive and an azimuth drive. The optical unit emits and/or receives optical communication signals. The elevation drive is coupled with the optical unit by way of an elevation bearing and swivels the optical unit about an elevation axis. The azimuth drive is coupled with the optical unit and the elevation drive and turns the optical unit together with the elevation drive about an azimuth axis. The elevation axis is arranged eccentrically with respect to the azimuth axis, so that the elevation axis is offset with respect to the azimuth axis by a lateral offset. This allows the optical unit to be swiveled to alongside the azimuth drive, so that a swiveling range of the optical unit is increased.

Abstract: A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.

Abstract: An optical communication unit for sending and receiving optical communication signals is described. The optical communication unit includes an optical unit, an elevation drive and an azimuth drive. The optical unit emits and/or receives optical communication signals. The elevation drive is coupled with the optical unit by way of an elevation bearing and swivels the optical unit about an elevation axis. The azimuth drive is coupled with the optical unit and the elevation drive and turns the optical unit together with the elevation drive about an azimuth axis. The elevation axis is arranged eccentrically with respect to the azimuth axis, so that the elevation axis is offset with respect to the azimuth axis by a lateral offset. This allows the optical unit to be swiveled to alongside the azimuth drive, so that a swiveling range of the optical unit is increased.

Abstract: A high-frequency module can be used in communication satellites. The high-frequency module contains an electronic unit and a housing. The housing at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing. An internal connector is arranged on the housing, which is coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector. The internal connector is constructed integrally with at least a part of the housing. This allows a thermo-mechanical stress on the electronic unit to be reduced.

Abstract: A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.

Abstract: A high-frequency module can be used in communication satellites. The high-frequency module contains an electronic unit and a housing. The housing at least partially encloses the electronic unit, and the electronic unit is arranged at least partially in an interior space of the housing. An internal connector is arranged on the housing, which is coupled to the electronic unit such that electrical signals can be transmitted between the electronic unit and the internal connector. The internal connector is constructed integrally with at least a part of the housing. This allows a thermo-mechanical stress on the electronic unit to be reduced.