Abstract: An amusement ride includes at least one vehicle which is guided along a track, at least one passenger receptacle for accommodating a passenger being situated on the vehicle. A movement, position, and/or orientation of the passenger receptacle relative to the vehicle is changeable by means of at least one adjusting unit in at least one degree of freedom. A controller controls the adjusting unit. The controller is in signal communication with a memory in which movements to be performed, positions to be assumed, and/or orientations to be assumed during the ride of each passenger receptacle are stored directly or indirectly as memory content. The controller is designed to allow the positions, orientations, and/or movements to be assumed in sequence at a given point on the track during the ride. The amusement ride has means by which the passenger determines the memory content for the relevant passenger receptacle.

Abstract: A composition includes at least one type of conductive or semiconductive nanostructures, wherein at least one conductive ligand is arranged on the surface of the nanostructures, and at least one solvent, wherein the ligand has at least one group by which functionalization is possible. This makes it possible in simple fashion to obtain functionalizable conductive structures, in particular by inkjet processes.

Abstract: Conductive or semiconductive nanoparticles are modified with conductive ligands so as to be able to obtain conductive or semiconductive layers without requiring a thermal treatment for forming the structures upon application of the layers. A composition can include a matrix polymer for producing conductive composites.

Abstract: A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.

Abstract: A method of producing a fastening arrangement for the position-correct fastening of a component to a structural part of a motor vehicle comprises the steps: providing of the structural part; providing of a first tolerance compensation element and a second tolerance compensation element; positioning of the first tolerance compensation element, while holding the structural part firmly, relative to the structural part in a nominal position for the later position-correct fastening of the component to be fastened, and holding of the first tolerance compensation element in the nominal position, the first tolerance compensation element being positioned with a gap relative to the structural part; inserting of the second tolerance compensation element between the first tolerance compensation element and the structural part, so that the gap between the first tolerance compensation element and the structural part is bridged over; joining of the second tolerance compensation element to the first tolerance compensation el

Abstract: A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.

Abstract: Conductive or semiconductive nanoparticles are modified with conductive ligands so as to be able to obtain conductive or semiconductive layers without requiring a thermal treatment for forming the structures upon application of the layers. A composition can include a matrix polymer for producing conductive composites.

Abstract: A method of producing a fastening arrangement for the position-correct fastening of a component to a structural part of a motor vehicle comprises the steps: providing of the structural part; providing of a first tolerance compensation element and a second tolerance compensation element; positioning of the first tolerance compensation element, while holding the structural part firmly, relative to the structural part in a nominal position for the later position-correct fastening of the component to be fastened, and holding of the first tolerance compensation element in the nominal position, the first tolerance compensation element being positioned with a gap relative to the structural part; inserting of the second tolerance compensation element between the first tolerance compensation element and the structural part, so that the gap between the first tolerance compensation element and the structural part is bridged over; joining of the second tolerance compensation element to the first tolerance compensation el

Abstract: In metal-nanoparticle arrays and methods of producing metal-nanoparticle arrays, the metal-nanoparticle size and the interparticle distance between the metal nanoparticles can be adjusted. In the method of producing metal-nanoparticle arrays, a colloidal dispersion of microspheres is deposited on a substrate as a densely packed monolayer via convective assembly, after which the deposited monolayer is coated with at least one thinly deposited metal-nanoparticle layer by a physical deposition process, and after which the microspheres deposited on the substrate as a monolayer and coated with at least one metal-nanoparticle layer are removed by thermal decomposition.

Abstract: This invention relates to the use of optically anisotropic particles in order to non-destructively test or determine physical system parameters and/or the microscopic structure of systems. The mobility of the optically anisotropic particles is used to examine physical system parameters and/or the microscopic structure of systems. To this end, particle mobility is measured via an optical system.

Abstract: Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.

Abstract: Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.

Abstract: In a fastening arrangement for the positionally correct fastening of a device to a structural part of a motor vehicle, the at least one screw means is arranged on a tolerance-compensating part, wherein the tolerance-compensating part is fixed to the structural part by means of a joining material which is selected from an adhesive or a plastic liquefied by ultrasonic welding, and wherein the tolerance-compensating part is adjusted in position relative to the structural part. A method for the positionally correct fastening of a device to the structural part of a motor vehicle makes use of a tolerance-compensating part which is joined to the structural part by making use of a joining process in which a joining material is used, the joining process being selected from the group consisting of: adhesive bonding with an adhesive as the joining material, ultrasonic welding with a plastic as the joining material.

Abstract: Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.

Abstract: Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.

Abstract: A method of nanoparticle printing including: contacting a printing plate with a target substrate, while the printing plate is contacting the target substrate, illuminating nanoparticies on the printing plate with intense flashes of LASER light, or subjecting the nanoparticles to microwave radiation, such that energy is selectively transferred into the particles, increasing a local temperature of the particles which causes an increased interaction of the particles with the target substrate and produces a strong junction and removes the particles from the printing plate; and peeling off the printing plate from the target substrate.

Abstract: A method of protecting a polymeric layer from contamination by a photoresist layer. The method includes: (a) forming a polymeric layer over a substrate; (b) forming a non-photoactive protection layer over the polymeric layer; (c) forming a photoresist layer over the protection layer; (d) exposing the photoresist layer to actinic radiation and developing the photoresist layer to form a patterned photoresist layer, thereby exposing regions of the protection layer; (e) etching through the protection layer and the polymeric layer where the protection layer is not protected by the patterned photoresist layer; (f) removing the patterned photoresist layer in a first removal process; and (g) removing the protection layer in a second removal process different from the first removal process.

Abstract: Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.

Abstract: Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.

Abstract: A method of transferring nanoparticles to a surface is provided. The method includes rotating a perimeter surface through a colloidal solution such that nanoparticles are captured by binding sites, removing liquid from the captured nanoparticles and rotating a take-up roll such that the captured nanoparticles contact a carrier surface. Moreover, the method includes removing the captured nanoparticles from the perimeter surface and transferring the nanoparticles to the carrier surface with a carrier adhesive material, rotating the carrier surface such that the transferred nanoparticles contact a target substrate, and removing the transferred nanoparticles from the carrier surface and transferring the transferred nanoparticles to the target substrate with a target substrate material.