Patents by Inventor Tobias Kraus

Tobias Kraus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230057908
    Abstract: A composition includes at least one type of conductive or semiconductive nanostructures, wherein at least one conductive ligand is arranged on the surface of the nanostructures, and at least one solvent, wherein the ligand has at least one group by which functionalization is possible. This makes it possible in simple fashion to obtain functionalizable conductive structures, in particular by inkjet processes.
    Type: Application
    Filed: December 4, 2020
    Publication date: February 23, 2023
    Inventors: Indra Backes, Andreas Hegetschweiler, Lola González-García, Tobias Kraus, Aránzazu del Campo, Aleeza Farrukh, Thibaut Thai
  • Patent number: 11286394
    Abstract: Conductive or semiconductive nanoparticles are modified with conductive ligands so as to be able to obtain conductive or semiconductive layers without requiring a thermal treatment for forming the structures upon application of the layers. A composition can include a matrix polymer for producing conductive composites.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: March 29, 2022
    Assignee: Leibniz-Institut für Neue Materialien gemeinnützige GmbH
    Inventors: Beate Reiser, Tobias Kraus, Lola González-García, Johannes H. M. Maurer, Ioannis Kanelidis
  • Patent number: 10941035
    Abstract: A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: March 9, 2021
    Assignee: Leibniz-Institut für Neue Materialien gemeinnützige GmbH
    Inventors: Johannes H. M. Maurer, Tobias Kraus, Lola González-García, Beate Reiser, Ioannis Kanelidis, Peter William de Oliveira, Jenny Kampka, Karsten Moh
  • Patent number: 10228006
    Abstract: A method of producing a fastening arrangement for the position-correct fastening of a component to a structural part of a motor vehicle comprises the steps: providing of the structural part; providing of a first tolerance compensation element and a second tolerance compensation element; positioning of the first tolerance compensation element, while holding the structural part firmly, relative to the structural part in a nominal position for the later position-correct fastening of the component to be fastened, and holding of the first tolerance compensation element in the nominal position, the first tolerance compensation element being positioned with a gap relative to the structural part; inserting of the second tolerance compensation element between the first tolerance compensation element and the structural part, so that the gap between the first tolerance compensation element and the structural part is bridged over; joining of the second tolerance compensation element to the first tolerance compensation el
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: March 12, 2019
    Assignee: PROGRESS-WERK OBERKIRCH AG
    Inventors: Michael Pfaff, Frank Domnik, Tobias Kraus, Franz Mayer, Romain Roucco, Stephan Kasper
  • Publication number: 20180251370
    Abstract: A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.
    Type: Application
    Filed: September 2, 2016
    Publication date: September 6, 2018
    Applicant: Leibniz-Institut für Neue Materialien gemeinnützige GmbH
    Inventors: Johannes H.M. MAURER, Tobias KRAUS, Lola GONZÁLEZ-GARCÍA, Beate REISER, Ioannis KANELIDIS, Peter William DE OLIVEIRA, Jenny KAMPKA, Karsten MOH
  • Publication number: 20180251640
    Abstract: Conductive or semiconductive nanoparticles are modified with conductive ligands so as to be able to obtain conductive or semiconductive layers without requiring a thermal treatment for forming the structures upon application of the layers. A composition can include a matrix polymer for producing conductive composites.
    Type: Application
    Filed: September 8, 2016
    Publication date: September 6, 2018
    Applicant: Leibniz-Institut für Neue Materialien gemeinnützige GmbH
    Inventors: Beate Reiser, Tobias Kraus, Lola González-García, Johannes H.M. Maurer, Ioannis Kanelidis
  • Publication number: 20160023690
    Abstract: A method of producing a fastening arrangement for the position-correct fastening of a component to a structural part of a motor vehicle comprises the steps: providing of the structural part; providing of a first tolerance compensation element and a second tolerance compensation element; positioning of the first tolerance compensation element, while holding the structural part firmly, relative to the structural part in a nominal position for the later position-correct fastening of the component to be fastened, and holding of the first tolerance compensation element in the nominal position, the first tolerance compensation element being positioned with a gap relative to the structural part; inserting of the second tolerance compensation element between the first tolerance compensation element and the structural part, so that the gap between the first tolerance compensation element and the structural part is bridged over; joining of the second tolerance compensation element to the first tolerance compensation el
    Type: Application
    Filed: July 23, 2015
    Publication date: January 28, 2016
    Inventors: Michael Pfaff, Frank Domnik, Tobias Kraus, Franz Mayer, Romain Roucco, Stephan Kasper
  • Publication number: 20150321162
    Abstract: In metal-nanoparticle arrays and methods of producing metal-nanoparticle arrays, the metal-nanoparticle size and the interparticle distance between the metal nanoparticles can be adjusted. In the method of producing metal-nanoparticle arrays, a colloidal dispersion of microspheres is deposited on a substrate as a densely packed monolayer via convective assembly, after which the deposited monolayer is coated with at least one thinly deposited metal-nanoparticle layer by a physical deposition process, and after which the microspheres deposited on the substrate as a monolayer and coated with at least one metal-nanoparticle layer are removed by thermal decomposition.
    Type: Application
    Filed: December 12, 2013
    Publication date: November 12, 2015
    Applicants: BESCHRAENKTER HAFTUNG
    Inventors: Daniel BRODOCEANU, Tobias KRAUS, Cheng FANG, Nicolas Hans VOELCKER
  • Publication number: 20140370615
    Abstract: This invention relates to the use of optically anisotropic particles in order to non-destructively test or determine physical system parameters and/or the microscopic structure of systems. The mobility of the optically anisotropic particles is used to examine physical system parameters and/or the microscopic structure of systems. To this end, particle mobility is measured via an optical system.
    Type: Application
    Filed: December 7, 2012
    Publication date: December 18, 2014
    Applicants: beschraenkter Haftung
    Inventors: Tobias Kraus, Si Chen
  • Patent number: 8546257
    Abstract: Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: October 1, 2013
    Assignee: International Business Machines Corporation
    Inventors: Tobias Kraus, Laurent Malaquin, Heiko Wolf
  • Publication number: 20120282771
    Abstract: Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.
    Type: Application
    Filed: July 17, 2012
    Publication date: November 8, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tobias Kraus, Laurent Malaquin, Heiko Wolf
  • Publication number: 20120213574
    Abstract: In a fastening arrangement for the positionally correct fastening of a device to a structural part of a motor vehicle, the at least one screw means is arranged on a tolerance-compensating part, wherein the tolerance-compensating part is fixed to the structural part by means of a joining material which is selected from an adhesive or a plastic liquefied by ultrasonic welding, and wherein the tolerance-compensating part is adjusted in position relative to the structural part. A method for the positionally correct fastening of a device to the structural part of a motor vehicle makes use of a tolerance-compensating part which is joined to the structural part by making use of a joining process in which a joining material is used, the joining process being selected from the group consisting of: adhesive bonding with an adhesive as the joining material, ultrasonic welding with a plastic as the joining material.
    Type: Application
    Filed: August 19, 2011
    Publication date: August 23, 2012
    Applicant: PROGRESS-WERK OBERKIRCH AG
    Inventors: Hubert Graf, Tobias Kraus, Frank Griebenow, Michael Mueller, Hansjoerg Schmeider, Thorsten Seiler, Hans-Peter Thumbach, Jakob Willmann
  • Publication number: 20110244192
    Abstract: Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.
    Type: Application
    Filed: June 14, 2011
    Publication date: October 6, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tobias Kraus, Heiko Wolf
  • Patent number: 8028621
    Abstract: Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: October 4, 2011
    Assignee: International Business Machines Corporation
    Inventors: Tobias Kraus, Heiko Wolf
  • Publication number: 20110027499
    Abstract: A method of nanoparticle printing including: contacting a printing plate with a target substrate, while the printing plate is contacting the target substrate, illuminating nanoparticies on the printing plate with intense flashes of LASER light, or subjecting the nanoparticles to microwave radiation, such that energy is selectively transferred into the particles, increasing a local temperature of the particles which causes an increased interaction of the particles with the target substrate and produces a strong junction and removes the particles from the printing plate; and peeling off the printing plate from the target substrate.
    Type: Application
    Filed: July 30, 2009
    Publication date: February 3, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Heiko Wolf, Tobias Kraus, Andrea Decker
  • Patent number: 7749915
    Abstract: A method of protecting a polymeric layer from contamination by a photoresist layer. The method includes: (a) forming a polymeric layer over a substrate; (b) forming a non-photoactive protection layer over the polymeric layer; (c) forming a photoresist layer over the protection layer; (d) exposing the photoresist layer to actinic radiation and developing the photoresist layer to form a patterned photoresist layer, thereby exposing regions of the protection layer; (e) etching through the protection layer and the polymeric layer where the protection layer is not protected by the patterned photoresist layer; (f) removing the patterned photoresist layer in a first removal process; and (g) removing the protection layer in a second removal process different from the first removal process.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: July 6, 2010
    Assignee: International Business Machines Corporation
    Inventors: Ute Drechsler, Urs T. Duerig, Jane Elizabeth Frommer, Bernd W. Gotsmann, James Lupton Hedrick, Armin W. Knoll, Tobias Kraus, Robert Dennis Miller
  • Publication number: 20090278213
    Abstract: Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes.
    Type: Application
    Filed: May 8, 2008
    Publication date: November 12, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tobias Kraus, Laurent Malaquin, Heiko Wolf
  • Publication number: 20090272285
    Abstract: Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.
    Type: Application
    Filed: May 2, 2008
    Publication date: November 5, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tobias Kraus, Heiko Wolf
  • Patent number: 7520951
    Abstract: A method of transferring nanoparticles to a surface is provided. The method includes rotating a perimeter surface through a colloidal solution such that nanoparticles are captured by binding sites, removing liquid from the captured nanoparticles and rotating a take-up roll such that the captured nanoparticles contact a carrier surface. Moreover, the method includes removing the captured nanoparticles from the perimeter surface and transferring the nanoparticles to the carrier surface with a carrier adhesive material, rotating the carrier surface such that the transferred nanoparticles contact a target substrate, and removing the transferred nanoparticles from the carrier surface and transferring the transferred nanoparticles to the target substrate with a target substrate material.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: April 21, 2009
    Assignee: International Business Machines (IBM) Corporation
    Inventors: Heiko Wolf, Tobias Kraus
  • Publication number: 20080220613
    Abstract: A method of protecting a polymeric layer from contamination by a photoresist layer. The method includes: (a) forming a polymeric layer over a substrate; (b) forming a non-photoactive protection layer over the polymeric layer; (c) forming a photoresist layer over the protection layer; (d) exposing the photoresist layer to actinic radiation and developing the photoresist layer to form a patterned photoresist layer, thereby exposing regions of the protection layer; (e) etching through the protection layer and the polymeric layer where the protection layer is not protected by the patterned photoresist layer; (f) removing the patterned photoresist layer in a first removal process; and (g) removing the protection layer in a second removal process different from the first removal process.
    Type: Application
    Filed: March 31, 2008
    Publication date: September 11, 2008
    Inventors: Ute Drechsler, Urs T. Duerig, Jane Elizabeth Frommer, Bernd W. Gotsmann, James Lupton Hedrick, Armin W. Knoll, Tobias Kraus, Robert Dennis Miller