Patents by Inventor Tobias Remsch

Tobias Remsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reformer of layered structure
    Publication number: 20010024629
    Abstract: A reforming reactor has a layered structure with an alternating sequence of reforming layers filled with a reforming catalyst material for an endothermic reforming reaction, and heating layers which adjoin the reforming layers via thermally conductive partition and contain a heating-space catalyst material for an exothermic reaction. The volume of the respective reforming layers is greater than that of the respective heating-space layers; and the heating-space catalyst material is introduced into the corresponding heating layer as a wall coating.
    Type: Application
    Filed: January 16, 2001
    Publication date: September 27, 2001
    Inventors: Stefan Brauchle, Tobias Remsch, Dietmar Heil, Wolfgang Schmid