Abstract: The invention relates to a machining module for a device for producing a molded metal body (1) by means of an additively generative manufacturing process. A sheet, wire, or pulverulent metal-containing starting material (2) is melted and applied in layers, thereby forming the molded body (1). According to the invention, in addition to a material supply device (9), the machining module comprises a protective gas supply device (11), which has an outlet opening arranged annularly about the material supply device (9), and a fluid supply device (3) for supplying coolant (4), having one or more nozzles (10) which are arranged spatially adjacent to the material supply device (9) such that the surface of the molded body (1) can be supplied with the coolant (4) in points or in a partial manner directly adjacent to the melt bath at one position or along a curve, each of which can be specified in a variable manner.

Abstract: The invention relates to a machining module for a device for producing a molded metal body (1) by means of an additive generative manufacturing process. A sheet, wire, or pulverulent metal-containing starting material (2) is melted and applied in layers, thereby forming the molded body (1). According to the invention, in addition to a material supply device (9), the machining module comprises a protective gas supply device (11), which has an outlet opening arranged annularly about the material supply device (9), and a fluid supply device (3) for supplying coolant (4), having one or more nozzles (10) which are arranged spatially adjacent to the material supply device (9) such that the surface of the molded body (1) can be supplied with the coolant (4) in points or in a partial manner directly adjacent to the melt bath at one position or along a curve, each of which can be specified in a variable manner.

Abstract: The invention relates to a silver solder paste and to a silver solder paste containing copper, which can be used to join metal or metalized substrates, in particular copper substrates, without pressure at low temperatures. The silver solder according to the invention contains a metal-organic silver complex as a precursor, which forms silver nanoparticles only upon being heated and which forms a silver-metal molten phase over a temperature range of 20 to 40 units upon being heated further, which silver-metal molten phase can be used as a process window for joining already starting at 150° C., preferably starting at approximately 200° C.